公开(公告)号：US11984335B2

公开(公告)日：2024-05-14

申请号：US17564511

申请日：2021-12-29

Applicant: Applied Materials, Inc.

Inventor： Coby Scott Grove ,  Ruiping Wang ,  Avinash Shantaram ,  Jitendra Ratilal Bhimjiyani

IPC: H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67303 ,  H01L21/67778

Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

公开(公告)号：US11566322B2

公开(公告)日：2023-01-31

申请号：US16096665

申请日：2016-05-24

Applicant: Applied Materials, Inc.

Inventor： Xi Huang ,  Fei Peng ,  Kiran Krishnapur ,  Ruiping Wang ,  Jrjyan Jerry Chen ,  Steven Verhaverbeke ,  Robert Jan Visser

IPC: C23C16/04 ,  C23C16/44 ,  H01L51/52 ,  H01L51/56

Abstract: A mask assembly (100) includes a mask frame (102) and a mask screen (104), both of the mask frame (102) and the mask screen (104) made of a metallic material, and a metal coating (125) disposed on exposed surfaces of one or both of the mask frame (102) and the mask screen (104).

公开(公告)号：US12237186B2

公开(公告)日：2025-02-25

申请号：US17945910

申请日：2022-09-15

Applicant: Applied Materials, Inc.

Inventor： Ruiping Wang ,  Ying Wang ,  Guan Huei See ,  Ananthkrishna Jupudi ,  Praveen Kumar Choragudi

IPC: H01L21/67 ,  B08B1/10 ,  B08B3/04 ,  B08B7/00 ,  B08B13/00 ,  F26B25/14 ,  G06T1/00 ,  H01L21/683

Abstract: Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

公开(公告)号：US12001193B2

公开(公告)日：2024-06-04

申请号：US17692671

申请日：2022-03-11

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Xundong Dai ,  Guan Huei See ,  Ruiping Wang ,  Michael R. Rice ,  Hari Kishen Ponnekanti ,  Nirmalya Maity

IPC: G05B19/41 ,  G05B19/418 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC classification number: G05B19/418 ,  H01L21/67121 ,  H01L21/68771 ,  H01L21/68778 ,  G05B2219/45031

Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

公开(公告)号：US11756925B2

公开(公告)日：2023-09-12

申请号：US17508489

申请日：2021-10-22

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Ruiping Wang

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/67 ,  C23C16/513 ,  H01L21/683 ,  H01L21/66

CPC classification number: H01L24/95 ,  C23C16/513 ,  H01L21/67132 ,  H01L21/67253 ,  H01L21/6836 ,  H01L22/10 ,  H01L24/94

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for hybrid bonding a wafer comprises performing a first vacuum processing procedure on the wafer disposed within a first processing chamber, obtaining at least one of moisture measurements or organic species measurements within the first processing chamber, comparing the obtained at least one of moisture measurements or organic species measurements with a predetermined threshold, and one of when a comparison of the obtained at least one of moisture measurements or organic species measurements is equal to or less than the predetermined threshold automatically performing a second vacuum processing procedure in a second processing chamber different from the first processing chamber on the wafer, or when the comparison of the obtained at least one of moisture measurements or organic species measurements is greater than the predetermined threshold automatically continuing performing the first vacuum processing procedure on the wafer.