公开(公告)号：US20220102141A1

公开(公告)日：2022-03-31

申请号：US17035107

申请日：2020-09-28

Applicant: Applied Materials, Inc.

Inventor： Anup Kumar SINGH ,  Rick KUSTRA ,  Vinayak Vishwanath HASSAN ,  Bhaskar KUMAR ,  Krishna NITTALA ,  Pramit MANNA ,  Kaushik Comandoor ALAYAVALLI ,  Ganesh BALASUBRAMANIAN

IPC: H01L21/02 ,  H01J37/32 ,  H01L21/033 ,  C23C16/505 ,  C23C16/26 ,  C23C16/44 ,  B08B7/00

Abstract: Embodiments of the present disclosure generally relate to methods of depositing carbon film layers greater than 3,000 Å in thickness over a substrate and surface of a lid of a chamber using dual frequency, top, sidewall and bottom sources. The method includes introducing a gas to a processing volume of a chamber. A first radiofrequency (RF) power is provided having a first frequency of about 40 MHz or greater to a lid of the chamber. A second RF power is provided having a second frequency to a bias electrode disposed in a substrate support within the processing volume. The second frequency is about 10 MHz to about 40 MHz. An additional third RF power is provided having lower frequency of about 400 kHz to about 2 MHz to the bias electrode.

公开(公告)号：US20230377855A1

公开(公告)日：2023-11-23

申请号：US17664324

申请日：2022-05-20

Applicant: Applied Materials, Inc.

Inventor： Mukesh Shivakumaraiah CHITRADURGA ,  Luke BONECUTTER ,  Sathya Swaroop GANTA ,  Canfeng LAI ,  Jay D. PINSON ,  Kaushik Comandoor ALAYAVALLI ,  Kallol BERA

IPC: H01J37/32 ,  C23C16/44 ,  B08B7/00

CPC classification number: H01J37/32862 ,  H01J37/32715 ,  H01J37/32091 ,  C23C16/4405 ,  B08B7/0035

Abstract: Embodiments of the present disclosure generally relate to a substrate processing chamber, and methods for cleaning the substrate processing chamber are provided herein. An electrode cleaning ring is disposed in a lower portion of a process volume (e.g., disposed below a substrate support in the process volume). The electrode cleaning ring is a capacitively coupled plasma source. The electrode cleaning ring propagates plasma into the lower portion of the process volume. RF power is provided to the electrode cleaning ring via an RF power feed-through. The RF plasma propagated by the electrode cleaning ring removes deposition residue in the lower portion of the process volume.

公开(公告)号：US20220349050A1

公开(公告)日：2022-11-03

申请号：US17660442

申请日：2022-04-25

Applicant: Applied Materials, Inc.

Inventor： Rick KUSTRA ,  Kaushik Comandoor ALAYAVALLI ,  Jay D. PINSON, II ,  Sathya Swaroop GANTA ,  Anup Kumar SINGH

IPC: C23C16/44

Abstract: Embodiments of the present disclosure generally relate a process chamber including a lid and a chamber body coupled to the lid. The chamber body and lid define a process volume and a coupling ring is disposed within the chamber body and below the lid. The coupling ring is coupled to ground or is coupled to a coupling RF power source. A substrate support is disposed and movable within the process volume.

公开(公告)号：US20220139679A1

公开(公告)日：2022-05-05

申请号：US17088407

申请日：2020-11-03

Applicant: Applied Materials, Inc.

Inventor： Job George KONNOTH JOSEPH ,  Sathya Swaroop GANTA ,  Kallol BERA ,  Andrew NGUYEN ,  Jay D. PINSON, II ,  Akshay DHANAKSHIRUR ,  Kaushik Comandoor ALAYAVALLI ,  Canfeng LAI ,  Ren-Guan DUAN ,  Jennifer Y. SUN ,  Anil Kumar KALAL ,  Abhishek PANDEY

IPC: H01J37/32 ,  H01J37/20

Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.

公开(公告)号：US20220064797A1

公开(公告)日：2022-03-03

申请号：US17403056

申请日：2021-08-16

Applicant: Applied Materials, Inc.

Inventor： Akshay DHANAKSHIRUR ,  Juan Carlos ROCHA-ALVAREZ ,  Kaushik Comandoor ALAYAVALLI ,  Jay D. PINSON, II ,  Rick KUSTRA ,  Badri N. RAMAMURTHI ,  Anup Kumar SINGH ,  Ganesh BALASUBRAMANIAN ,  Bhaskar KUMAR ,  Vinayak Vishwanath HASSAN ,  Canfeng LAI ,  Kallol BERA ,  Sathya Swaroop GANTA

IPC: C23C16/455 ,  H01J37/32

Abstract: A lid for a process chamber includes a plate having a first surface and a second surface opposite the first surface. The first surface has a recess and a seal groove formed in the first surface and surrounding the recess. The lid further includes an array of holes extending from the recess to the second surface.