公开(公告)号：US20230377855A1

公开(公告)日：2023-11-23

申请号：US17664324

申请日：2022-05-20

Applicant: Applied Materials, Inc.

Inventor： Mukesh Shivakumaraiah CHITRADURGA ,  Luke BONECUTTER ,  Sathya Swaroop GANTA ,  Canfeng LAI ,  Jay D. PINSON ,  Kaushik Comandoor ALAYAVALLI ,  Kallol BERA

IPC: H01J37/32 ,  C23C16/44 ,  B08B7/00

CPC classification number: H01J37/32862 ,  H01J37/32715 ,  H01J37/32091 ,  C23C16/4405 ,  B08B7/0035

Abstract: Embodiments of the present disclosure generally relate to a substrate processing chamber, and methods for cleaning the substrate processing chamber are provided herein. An electrode cleaning ring is disposed in a lower portion of a process volume (e.g., disposed below a substrate support in the process volume). The electrode cleaning ring is a capacitively coupled plasma source. The electrode cleaning ring propagates plasma into the lower portion of the process volume. RF power is provided to the electrode cleaning ring via an RF power feed-through. The RF plasma propagated by the electrode cleaning ring removes deposition residue in the lower portion of the process volume.