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公开(公告)号：US20240297059A1
公开(公告)日：2024-09-05
申请号：US18663897
申请日：2024-05-14
Applicant: Applied Materials, Inc.
Inventor： Andrew NGUYEN , Sathya Swaroop GANTA , Kallol BERA , Canfeng LAI
IPC: H01L21/677 , C23C16/513 , H01J37/32 , H01L21/02
CPC classification number: H01L21/67709 , C23C16/513 , H01J37/3266 , H01L21/02274
Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.
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公开(公告)号：US20230377855A1
公开(公告)日：2023-11-23
申请号：US17664324
申请日：2022-05-20
Applicant: Applied Materials, Inc.
Inventor： Mukesh Shivakumaraiah CHITRADURGA , Luke BONECUTTER , Sathya Swaroop GANTA , Canfeng LAI , Jay D. PINSON , Kaushik Comandoor ALAYAVALLI , Kallol BERA
CPC classification number: H01J37/32862 , H01J37/32715 , H01J37/32091 , C23C16/4405 , B08B7/0035
Abstract: Embodiments of the present disclosure generally relate to a substrate processing chamber, and methods for cleaning the substrate processing chamber are provided herein. An electrode cleaning ring is disposed in a lower portion of a process volume (e.g., disposed below a substrate support in the process volume). The electrode cleaning ring is a capacitively coupled plasma source. The electrode cleaning ring propagates plasma into the lower portion of the process volume. RF power is provided to the electrode cleaning ring via an RF power feed-through. The RF plasma propagated by the electrode cleaning ring removes deposition residue in the lower portion of the process volume.
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公开(公告)号：US20220349050A1
公开(公告)日：2022-11-03
申请号：US17660442
申请日：2022-04-25
Applicant: Applied Materials, Inc.
Inventor： Rick KUSTRA , Kaushik Comandoor ALAYAVALLI , Jay D. PINSON, II , Sathya Swaroop GANTA , Anup Kumar SINGH
IPC: C23C16/44
Abstract: Embodiments of the present disclosure generally relate a process chamber including a lid and a chamber body coupled to the lid. The chamber body and lid define a process volume and a coupling ring is disposed within the chamber body and below the lid. The coupling ring is coupled to ground or is coupled to a coupling RF power source. A substrate support is disposed and movable within the process volume.
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Patent Agency Ranking
公开(公告)号：US20220139679A1
公开(公告)日：2022-05-05
申请号：US17088407
申请日：2020-11-03
Applicant: Applied Materials, Inc.
Inventor： Job George KONNOTH JOSEPH , Sathya Swaroop GANTA , Kallol BERA , Andrew NGUYEN , Jay D. PINSON, II , Akshay DHANAKSHIRUR , Kaushik Comandoor ALAYAVALLI , Canfeng LAI , Ren-Guan DUAN , Jennifer Y. SUN , Anil Kumar KALAL , Abhishek PANDEY
Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.
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公开(公告)号：US20220064797A1
公开(公告)日：2022-03-03
申请号：US17403056
申请日：2021-08-16
Applicant: Applied Materials, Inc.
Inventor： Akshay DHANAKSHIRUR , Juan Carlos ROCHA-ALVAREZ , Kaushik Comandoor ALAYAVALLI , Jay D. PINSON, II , Rick KUSTRA , Badri N. RAMAMURTHI , Anup Kumar SINGH , Ganesh BALASUBRAMANIAN , Bhaskar KUMAR , Vinayak Vishwanath HASSAN , Canfeng LAI , Kallol BERA , Sathya Swaroop GANTA
IPC: C23C16/455 , H01J37/32
Abstract: A lid for a process chamber includes a plate having a first surface and a second surface opposite the first surface. The first surface has a recess and a seal groove formed in the first surface and surrounding the recess. The lid further includes an array of holes extending from the recess to the second surface.
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公开(公告)号：US20240271284A1
公开(公告)日：2024-08-15
申请号：US18634376
申请日：2024-04-12
Applicant: Applied Materials, Inc.
Inventor： Kallol BERA , Sathya Swaroop GANTA , Timothy Joseph FRANKLIN , Kaushik ALAYAVALLI , Akshay DHANAKSHIRUR , Stephen C. GARNER , Bhaskar KUMAR
IPC: C23C16/52 , C23C16/505 , C23C16/54 , H01J37/32
CPC classification number: C23C16/52 , C23C16/505 , C23C16/54 , H01J37/32082 , H01J37/32174 , H01J37/3266 , H01J37/32669
Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.
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公开(公告)号：US20220122866A1
公开(公告)日：2022-04-21
申请号：US17076024
申请日：2020-10-21
Applicant: Applied Materials, Inc.
Inventor： Andrew NGUYEN , Sathya Swaroop GANTA , Kallol BERA , Canfeng LAI
IPC: H01L21/677 , C23C16/513 , H01L21/02
Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.
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公开(公告)号：US20210269919A1
公开(公告)日：2021-09-02
申请号：US17131315
申请日：2020-12-22
Applicant: Applied Materials, Inc.
Inventor： Kallol BERA , Sathya Swaroop GANTA , Timothy Joseph FRANKLIN , Kaushik ALAYAVALLI , Akshay DHANAKSHIRUR , Stephen C. GARNER , Bhaskar KUMAR
Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.
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