公开(公告)号：US20160271750A1

公开(公告)日：2016-09-22

申请号：US15074089

申请日：2016-03-18

Applicant: Applied Materials, Inc.

Inventor： Yongqi HU ,  Simon YAVELBERG ,  Gangadhar SHEELAVANT ,  Kadthala R. NARENDRNATH

IPC: B24B37/32

CPC classification number: B24B37/32

Abstract: A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (Ra) of less than about 30 microinches (μin).

Abstract translation: 公开了一种保持环和化学机械平面化系统（CMP）。 在一个实施例中，用于抛光系统的保持环包括具有抛光内径的环形主体。 主体具有形成在其中的槽的底面，外径壁和内径壁，其中内径壁被抛光至小于约30微英寸（μin）的粗糙度平均（Ra）。

公开(公告)号：US20160181142A1

公开(公告)日：2016-06-23

申请号：US14975119

申请日：2015-12-18

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Kadthala R. NARENDRNATH ,  Bopanna Ichettira VASANTHA ,  Simon YAVELBERG

IPC: H01L21/687

Abstract: An edge ring and process for fabricating an edge ring are disclosed herein. In one embodiment, an edge ring includes an annular body and a plurality of thermal breaks disposed within the annular body. The thermal breaks are disposed perpendicular to a center line of the annular body of the edge ring.

Abstract translation: 本文公开了一种边缘环和用于制造边缘环的工艺。 在一个实施例中，边缘环包括环形体和设置在环形体内的多个热断裂。 热断裂垂直于边缘环的环形体的中心线设置。

公开(公告)号：US20160233060A1

公开(公告)日：2016-08-11

申请号：US15015849

申请日：2016-02-04

Applicant: Applied Materials, Inc.

Inventor： Kadthala R. NARENDRNATH ,  Govinda RAJ ,  Goichi YOSHIDOME ,  Bopanna Ichettira VASANTHA ,  Umesh M. KELKAR

IPC: H01J37/32

Abstract: A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has a textured surface. The textured surface includes a plurality of independent engineered macro features integrally formed with the component part body. The engineered macro features include a macro feature body extending from the textured surface.

Abstract translation: 本文公开了一种用于处理室的腔室部件。 在一个实施例中，用于处理室的腔室部件包括具有单一整体结构的部件主体。 组件部件主体具有纹理表面。 纹理表面包括与组件部件主体整体形成的多个独立的工程宏观特征。 设计的宏观特征包括从纹理表面延伸的宏观特征体。

公开(公告)号：US20150146339A1

公开(公告)日：2015-05-28

申请号：US14550106

申请日：2014-11-21

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Cheng-Hsiung TSAI ,  Robert T. HIRAHARA ,  Kadthala R. NARENDRNATH ,  Manjunatha KOPPA ,  Ross MARSHALL

IPC: H01L21/683

CPC classification number: H01L21/6875 ,  H01L21/6831 ,  Y10T428/24298 ,  Y10T428/24314

Abstract: Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

Abstract translation: 实施例涉及具有最小接触面积特征的静电卡盘表面。 更具体地，本发明的实施例提供一种具有凸起的细长表面特征图案的静电卡盘组件，用于提供减少的颗粒产生和减少基板和夹紧装置的磨损。

公开(公告)号：US20140165915A1

公开(公告)日：2014-06-19

申请号：US14050196

申请日：2013-10-09

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Daniel MARTIN ,  Robert T. HIRAHARA ,  Ashish BHATNAGAR ,  Bopanna VASANTH ,  Prashanth RAO ,  Kadthala R. NARENDRNATH

IPC: H01L21/67 ,  H05B3/10

CPC classification number: H01L21/67103 ,  H01L21/68792

Abstract: An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.

Abstract translation: 提供了一种用于基板支撑加热器和相关联的室部件的装置，其具有减少的能量损失。 在一个实施例中，提供了基板支撑加热器。 衬底支撑加热器包括加热器本体，其具有用于接收衬底的第一表面和与第一表面相对的第二表面，设置在第一表面和第二表面之间的加热器本体中的加热元件，以及设置在第二表面上的热障壁 所述加热器主体的表面，其中所述热障包括设置在所述第一层上的第一层和第二层。

公开(公告)号：US20160107117A1

公开(公告)日：2016-04-21

申请号：US14877753

申请日：2015-10-07

Applicant: APPLIED MATERIALS, INC.

Inventor： Govinda RAJ ,  Monika AGARWAL ,  Hamid MOHIUDDIN ,  Kadthala R. NARENDRNATH

IPC: B01D53/32 ,  B01D53/68 ,  H01J37/32

CPC classification number: B01D53/32 ,  B01D53/68 ,  B01D2257/2025 ,  B01D2257/2027 ,  B01D2257/2045 ,  B01D2257/2047 ,  B01D2258/0216 ,  B01D2259/818 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32844 ,  Y02C20/30

Abstract: Embodiments disclosed herein include a plasma source, and an abatement system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source is disclosed. The plasma source includes a body having an inlet and an outlet, and the inlet and the outlet are fluidly coupled within the body. The body further includes inside surfaces, and the inside surfaces are coated with yttrium oxide or diamond-like carbon. The plasma source further includes a flow splitter disposed in the body in a position that formed two flow paths between the inlet and the outlet, and a plasma generator disposed in a position operable to form a plasma within the body between the flow splitter and inside surfaces of the body.

Abstract translation: 本文公开的实施方案包括等离子体源和用于减轻在半导体工艺中产生的化合物的减排系统。 在一个实施例中，公开了一种等离子体源。 等离子体源包括具有入口和出口的本体，并且入口和出口在体内流体耦合。 身体还包括内表面，并且内表面涂覆有氧化钇或类金刚石碳。 等离子体源还包括设置在主体中的分流器，其形成在入口和出口之间的两个流动路径的位置，以及等离子体发生器，其布置在可操作的位置中，以在主体内在分流器和内表面之间形成等离子体 的身体。