公开(公告)号：US20190080951A1

公开(公告)日：2019-03-14

申请号：US15703961

申请日：2017-09-13

申请人： APPLIED MATERIALS, INC.

发明人： Joel M. HUSTON ,  Cheng-Hsiung TSAI ,  Gwo-Chuan TZU

IPC分类号： H01L21/683 ,  H01L21/78 ,  H01L21/67 ,  H01L21/677

摘要： Embodiments of substrate supports and process chambers equipped with the same are provided. In some embodiments, a substrate support includes: a support body having a first surface; one or more receptacles extending through the first surface and into the support body; and one or more protrusions respectively disposed within corresponding ones of the one or more receptacles and projecting from the first surface, wherein the one or more protrusions at least partially define a substantially planar support surface above the first surface. Methods of eliminating backside wafer damage are also disclosed.

公开(公告)号：US20180155838A1

公开(公告)日：2018-06-07

申请号：US15421964

申请日：2017-02-01

申请人： APPLIED MATERIALS, INC.

发明人： Muhammad M. RASHEED ,  Muhannad MUSTAFA ,  Hamid TAVASSOLI ,  Steven V. SANSONI ,  Cheng-Hsiung TSAI ,  Vikash Banthia

IPC分类号： C23C16/46 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

CPC分类号： C23C16/46 ,  C23C16/4584 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785

摘要： Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.

公开(公告)号：US20240242947A1

公开(公告)日：2024-07-18

申请号：US18620405

申请日：2024-03-28

申请人： Applied Materials, Inc.

发明人： David GUNTHER ,  Cheng-Hsiung TSAI ,  Kirankumar Neelasandra SAVANDAIAH

IPC分类号： H01J37/34 ,  C23C14/50 ,  C23C14/56 ,  C23C16/458 ,  H01J37/32

CPC分类号： H01J37/3441 ,  C23C14/50 ,  C23C14/564 ,  C23C16/4585 ,  H01J37/32477 ,  H01J37/32651 ,  H01J37/32724 ,  H01J37/3411

摘要： Embodiments of a process kit are provided herein. In some embodiments, a deposition ring includes: an annular band having an upper surface and a lower surface, wherein the annular band includes a radially inner portion and a radially outer portion, wherein the lower surface includes a step that extends downward from the radially inner portion to the radially outer portion, wherein the step is disposed closer to a radially outermost surface of the annular band than a radially innermost surface of the annular band; an inner lip extending upwards from the upper surface of the annular band, and wherein the upper surface of the inner lip is an uppermost surface of the deposition ring; a channel disposed radially outward of and beneath a lowermost surface of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.

公开(公告)号：US20230265561A1

公开(公告)日：2023-08-24

申请号：US17751273

申请日：2022-05-23

申请人： Applied Materials, Inc.

发明人： Zubin HUANG ,  Tomoharu MATSUSHITA ,  Cheng-Hsiung TSAI

IPC分类号： C23C16/458 ,  H01L21/687 ,  C23C16/46

CPC分类号： C23C16/4585 ,  H01L21/68721 ,  C23C16/46

摘要： A substrate support includes a monolithic body. The monolithic body includes a central portion and a peripheral portion. The central portion includes a top surface recessed with respect to the peripheral portion. A shadow ring is configured to sit directly upon an upper surface of the peripheral portion, and overlaps a portion of a substrate positioned upon the central portion. A heating element embedded within the central portion heats the central portion, the peripheral portion, and the shadow ring.

公开(公告)号：US20220099426A1

公开(公告)日：2022-03-31

申请号：US17530538

申请日：2021-11-19

申请人： Applied Materials, Inc.

发明人： Tomoharu MATSUSHITA ,  Aravind KAMATH ,  Jallepally RAVI ,  Cheng-Hsiung TSAI ,  Hiroyuki TAKAHAMA

IPC分类号： G01B5/004 ,  H01L21/683 ,  H01L21/68

摘要： Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.

公开(公告)号：US20200230782A1

公开(公告)日：2020-07-23

申请号：US16838848

申请日：2020-04-02

申请人： APPLIED MATERIALS, INC.

发明人： Pulkit AGARWAL ,  Bonnie T. CHIA ,  Song-Moon SUH ,  Cheng-Hsiung TSAI ,  Dhritiman Subha KASHYAP ,  Xiaoxiong YUAN ,  Eric RIESKE

IPC分类号： B24C1/00 ,  B24C3/32 ,  H01L21/67

摘要： Embodiments of methods and apparatus for cleaning contaminants from a substrate are disclosed herein. In some embodiments, a substrate cleaning apparatus includes: a substrate support to support a substrate along an edge of the substrate, wherein the substrate further includes a first side and an opposing second side having contaminants disposed on the second side; a showerhead disposed a first distance of about 1.5 mm to about 4.4 mm opposite the substrate support and facing the first side of the substrate; and one or more nozzles disposed a second distance of about 1 inch to about 2 inches beneath the substrate support to discharge a mixture of solid and gaseous carbon dioxide toward the contaminants on the second side of the substrate, and wherein the one or more nozzles have an angle of about 20 to about 40 degrees.

公开(公告)号：US20160192444A1

公开(公告)日：2016-06-30

申请号：US14634711

申请日：2015-02-27

申请人： APPLIED MATERIALS, INC.

发明人： TOMOHARU MATSUSHITA ,  Jallepally RAVI ,  Cheng-Hsiung TSAI ,  Aravind KAMATH ,  Xiaoxiong YUAN ,  Manjunatha KOPPA

IPC分类号： H05B3/26 ,  H05B3/12

CPC分类号： H05B3/26 ,  H01L21/67103 ,  H05B2203/037

摘要： Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a body having a support surface; and a first heater disposed within the body and having a first heating coil and multiple heating zones, wherein a pitch of windings of the first heating coil vary among each of the multiple heating zones to define a predetermined heating ratio between the multiple heating zones.

摘要翻译： 本文提供了基板支撑件的实施例。 在一些实施例中，衬底支撑件可以包括具有支撑表面的主体; 以及第一加热器，其设置在所述主体内并且具有第一加热线圈和多个加热区域，其中所述第一加热线圈的绕组间距在每个所述多个加热区域中变化以限定所述多个加热区域之间的预定加热比。

公开(公告)号：US20240266200A1

公开(公告)日：2024-08-08

申请号：US18107157

申请日：2023-02-08

申请人： Applied Materials, Inc.

发明人： Sarath BABU ,  Mukund SUNDARARAJAN ,  Cheng-Hsiung TSAI ,  Ananthkrishna JUPUDI ,  Ross MARSHALL

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01L21/67103

摘要： An electrostatic chuck assembly including a body including a body recess and a heat transfer plate disposed in the body recess, wherein the heat transfer plate includes an upper surface, a lower surface, a first opening, and a second opening. The electrostatic chuck assembly further includes an RF transmission tube configured to transfer RF power to the lower surface of the heat transfer plate. The electrostatic chuck assembly further includes a puck bonded to the upper surface of the heat transfer plate. The electrostatic chuck assembly further includes a first chucking electrode disposed in the first opening and a second chucking electrode is disposed in the second opening, wherein the first and second chucking electrodes are configured to transfer a chucking voltage to the puck.

公开(公告)号：US20160322239A1

公开(公告)日：2016-11-03

申请号：US14749209

申请日：2015-06-24

申请人： APPLIED MATERIALS, INC.

发明人： Pulkit AGARWAL ,  Bonnie T. CHIA ,  Song-Moon SUH ,  Cheng-Hsiung TSAI ,  Dhritiman Subha KASHYAP ,  Xiaoxiong YUAN ,  Eric RIESKE

IPC分类号： H01L21/67 ,  B24C1/00

CPC分类号： B24C1/003 ,  B24C3/322 ,  H01L21/67028

摘要： Embodiments of methods and apparatus for cleaning contaminants from a substrate are disclosed herein. In some embodiments, a substrate cleaning apparatus includes: a substrate support to support a substrate along an edge of the substrate, wherein the substrate further includes a first side and an opposing second side having contaminants disposed on the second side; a showerhead disposed a first distance of about 1.5 mm to about 4.4 mm opposite the substrate support and facing the first side of the substrate; and one or more nozzles disposed a second distance of about 1 inch to about 2 inches beneath the substrate support to discharge a mixture of solid and gaseous carbon dioxide toward the contaminants on the second side of the substrate, and wherein the one or more nozzles have an angle of about 20 to about 40 degrees.

摘要翻译： 本文公开了用于从衬底清洁污染物的方法和设备的实施例。 在一些实施例中，基板清洁装置包括：基板支撑件，用于沿着基板的边缘支撑基板，其中所述基板还包括第一侧和相对的第二侧，其具有设置在所述第二侧上的污染物; 喷头，其布置在与基板支撑件相对的大约1.5mm至大约4.4mm的第一距离处，并面向基板的第一侧; 以及一个或多个喷嘴，其在基板支撑件下方设置约1英寸至约2英寸的第二距离，以将固体和气态二氧化碳的混合物朝向基板的第二侧上的污染物排出，并且其中所述一个或多个喷嘴具有 约20至约40度的角度。

公开(公告)号：US20150146339A1

公开(公告)日：2015-05-28

申请号：US14550106

申请日：2014-11-21

申请人： Applied Materials, Inc.

发明人： Govinda RAJ ,  Cheng-Hsiung TSAI ,  Robert T. HIRAHARA ,  Kadthala R. NARENDRNATH ,  Manjunatha KOPPA ,  Ross MARSHALL

IPC分类号： H01L21/683

CPC分类号： H01L21/6875 ,  H01L21/6831 ,  Y10T428/24298 ,  Y10T428/24314

摘要： Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

摘要翻译： 实施例涉及具有最小接触面积特征的静电卡盘表面。 更具体地，本发明的实施例提供一种具有凸起的细长表面特征图案的静电卡盘组件，用于提供减少的颗粒产生和减少基板和夹紧装置的磨损。