RETAINING RING FOR LOWER WAFER DEFECTS
    2.
    发明申请
    RETAINING RING FOR LOWER WAFER DEFECTS 审中-公开
    用于较低波形缺陷的保持环

    公开(公告)号:US20160271750A1

    公开(公告)日:2016-09-22

    申请号:US15074089

    申请日:2016-03-18

    CPC classification number: B24B37/32

    Abstract: A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (Ra) of less than about 30 microinches (μin).

    Abstract translation: 公开了一种保持环和化学机械平面化系统(CMP)。 在一个实施例中,用于抛光系统的保持环包括具有抛光内径的环形主体。 主体具有形成在其中的槽的底面,外径壁和内径壁,其中内径壁被抛光至小于约30微英寸(μin)的粗糙度平均(Ra)。

    CORROSION RESISTANT RETAINING RINGS

    公开(公告)号:US20170106495A1

    公开(公告)日:2017-04-20

    申请号:US14885944

    申请日:2015-10-16

    CPC classification number: B24B37/32

    Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.

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