公开(公告)号：US20180096834A1

公开(公告)日：2018-04-05

申请号：US15833728

申请日：2017-12-06

申请人： APPLIED MATERIALS, INC.

发明人： David KNAPP ,  Simon HUANG ,  Jeffrey W. ANTHIS ,  Philip Alan KRAUS ,  David THOMPSON

IPC分类号： H01L21/02 ,  H01L21/033 ,  H01J37/32

CPC分类号： H01L21/0332 ,  B82Y30/00 ,  C08K3/04 ,  H01J37/32009 ,  H01J37/3244 ,  H01J2237/334 ,  H01L21/0206 ,  H01L21/0335 ,  H01L21/0337

摘要： Embodiments include a method of processing a hardmask that includes forming an alloyed carbon hardmask over an underlying layer. In an embodiment, the alloyed carbon hardmask is alloyed with metallic-carbon fillers. The embodiment further includes patterning the alloyed carbon hardmask and transferring the pattern of the alloyed carbon hardmask into the underlying layer. According to an embodiment, the method may further include removing the metallic component of the metallic-carbon fillers from the alloyed carbon hardmask to form a porous carbon hardmask. Thereafter, the porous hardmask may be removed. In an embodiment, the metallic component of the metallic-carbon fillers may include flowing a processing gas into a chamber that volatizes the metallic component of the metallic-carbon fillers.

公开(公告)号：US20240186181A1

公开(公告)日：2024-06-06

申请号：US18074335

申请日：2022-12-02

申请人： Applied Materials, Inc.

发明人： Ge QU ,  Qihao ZHU ,  Zheng JU ,  Yang ZHOU ,  Jiajie CEN ,  Feng Q. LIU ,  Zhiyuan WU ,  Feng CHEN ,  Kevin KASHEFI ,  Xianmin TANG ,  Jeffrey W. ANTHIS ,  Mark Joseph SALY

IPC分类号： H01L21/768 ,  H01L21/3205

CPC分类号： H01L21/76849 ,  H01L21/32051 ,  H01L21/76877

摘要： Methods to deposit a metal cap for an interconnect are disclosed. In embodiments, a method comprises contacting the substrate with an alkyl halide and a ruthenium metal precursor to form a metal cap for an interconnect.