公开(公告)号：US20240141488A1

公开(公告)日：2024-05-02

申请号：US18050375

申请日：2022-10-27

Applicant: Applied Materials, Inc.

Inventor： David JORGENSEN ,  Songjae LEE ,  Hao WANG ,  Yi-Chiau HUANG ,  Christopher BEAUDRY

IPC: C23C16/455 ,  C23C16/08 ,  C23C18/16 ,  C23C18/32 ,  C23C28/00 ,  H01L21/687

CPC classification number: C23C16/45527 ,  C23C16/08 ,  C23C18/165 ,  C23C18/32 ,  C23C28/3455 ,  H01L21/68757

Abstract: Embodiments of the present disclosure generally relate to a substrate support having a surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an outer surface and a surface coating formed from a non-metal or a reduced-metal material disposed over at least a top surface of the outer surface of the body. In an embodiment, the surface coating includes a two-part coating having an optional first coating layer formed over an entire outer surface of the support body.

公开(公告)号：US20230312422A1

公开(公告)日：2023-10-05

申请号：US18112988

申请日：2023-02-22

Applicant: Applied Materials, Inc.

Inventor： Arvinder Chadha ,  Christopher BEAUDRY

IPC: C04B35/581 ,  H02N13/00 ,  C04B35/10

CPC classification number: C04B35/581 ,  H02N13/00 ,  C04B35/10 ,  C04B2235/3865 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/75

Abstract: Embodiments disclosed herein include a puck for an electrostatic chuck. In an embodiment, the puck comprises a substrate with a top surface and a bottom surface. In an embodiment, a first material composition is at the top surface of the substrate, and a second material composition is at the bottom surface of the substrate. In an embodiment, a composition gradient is provided through the substrate between the top surface and the bottom surface.

公开(公告)号：US20240249965A1

公开(公告)日：2024-07-25

申请号：US18099210

申请日：2023-01-19

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh CHADHA ,  Jonathan SIMMONS ,  Stephen Donald PROUTY ,  Christopher BEAUDRY ,  Glen T. MORI ,  Anand DURAIRAJAN

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/68735 ,  H01L21/68757

Abstract: A substrate support carrier includes an electrostatic chuck (ESC) assembly includes a top ceramic disc having a recess formed from a lower surface of the top ceramic disc, a bottom ceramic disc having a hole through the bottom ceramic disc, an upper bonding layer interposed between the lower surface of the top ceramic disc and an upper surface of the bottom ceramic disc, and a porous plug within at least one of the recess of the top ceramic disc and the hole of the bottom ceramic disc, a temperature control base, and a lower bonding layer interposed between a lower surface of the bottom ceramic disc and an upper surface of the temperature control base.

公开(公告)号：US20240203705A1

公开(公告)日：2024-06-20

申请号：US18081388

申请日：2022-12-14

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh CHADHA ,  Christopher BEAUDRY

IPC: H01J37/32 ,  G03F7/20

CPC classification number: H01J37/32715 ,  G03F7/202 ,  H01J2237/2007 ,  H01J2237/332

Abstract: A substrate support for use in a processing chamber to hold a substrate thereon includes a substrate support body, and a plurality of mesas on recessed surfaces of the substrate support body, wherein heights of the plurality of mesas from the recessed surfaces vary over the substrate support body between at least two different heights.

公开(公告)号：US20240158308A1

公开(公告)日：2024-05-16

申请号：US17985393

申请日：2022-11-11

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh CHADHA ,  Christopher BEAUDRY

IPC: C04B37/00 ,  C04B38/00 ,  C04B41/00 ,  C04B41/53 ,  C04B41/91

CPC classification number: C04B37/001 ,  C04B37/005 ,  C04B38/0054 ,  C04B38/007 ,  C04B41/0045 ,  C04B41/5353 ,  C04B41/91 ,  C04B2237/10 ,  C04B2237/32 ,  C04B2237/58 ,  C04B2237/62

Abstract: A method of forming a substrate support for use in a processing chamber includes forming a porous region in each of a plurality of ceramic green sheets, stacking the plurality of ceramic green sheets, each having the porous region formed therein, to form a ceramic laminate, and sintering the ceramic laminate to form a monolithic ceramic body having a porous plug formed therein. The porous plug includes the porous regions in the plurality of ceramic green sheets that are sintered.