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公开(公告)号:US20230009692A1
公开(公告)日:2023-01-12
申请号:US17368997
申请日:2021-07-07
Applicant: Applied Materials, Inc
Inventor: Songjae LEE , Hao WANG , David JORGENSEN , Yi-Chiau HUANG
IPC: C23C18/32 , C30B23/02 , C23C18/16 , C23C16/32 , C23C16/455 , C30B29/06 , C23C18/18 , C23C16/458
Abstract: Embodiments of the present disclosure generally relate to a substrate support having a two-part surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an upper surface and a two-part coating disposed over the upper surface of the body. The two-part coating includes a first coating layer extending a first radial distance from a center of the body. The first coating layer includes at least one of a metal-containing material or alloy. The two-part coating includes a second coating layer disposed over the first coating layer. The second coating layer extends a second radial distance from the center of the body. The first radial distance is greater than the second radial distance. The second coating layer is non-metal.
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公开(公告)号:US20230154766A1
公开(公告)日:2023-05-18
申请号:US17529684
申请日:2021-11-18
Applicant: Applied Materials, Inc.
Inventor: Songjae LEE , Avinash SHERVEGAR , Srinivasa RANGAPPA , Sundarapandiyan SHANMUGAM , Ernesto J. ULLOA , Vinodh RAMACHANDRAN , Abraham PALATY , Jaidev RAJARAM
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67017 , H01L21/68707
Abstract: Apparatus for processing a substrate are described herein. More specifically, embodiments described herein relate to separate pre-clean process modules and pre-clean control modules coupled to a cluster tool assembly. Each pre-clean process module and each pre-clean control module are connected by a cable conduit which is configured to have power and control cables passing therethrough between the pre-clean process module and the ore-clean control module. A maintenance passage is formed through the cluster tool assembly. Each of a purge gas source, a process gas source, a manometer, an isolation port, and a throttle valve are all accessible from one side of the pre-clean process module.
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公开(公告)号:US20240297066A1
公开(公告)日:2024-09-05
申请号:US18116244
申请日:2023-03-01
Applicant: Applied Materials, Inc.
Inventor: Liurui LI , Songjae LEE
IPC: H01L21/687 , B65G47/90
CPC classification number: H01L21/6875 , B65G47/90 , H01L21/68707
Abstract: A method for securing a support ball in a substrate support, a tool for forming a capture lip in a substrate support, and a substrate support having a substrate support ball captured in an opening of the substrate support are provided. In one example, a method for securing a support ball in a substrate support includes pressing a support ball into an opening formed in a first surface of the substrate support which is configured to support a substrate in a vacuum processing chamber, forming a capture lip in the opening which protrudes into the opening a distance sufficient to retain the support ball in the opening support ball, and setting an exposure height that the support ball projects above the first surface the substrate support.
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公开(公告)号:US20240141488A1
公开(公告)日:2024-05-02
申请号:US18050375
申请日:2022-10-27
Applicant: Applied Materials, Inc.
Inventor: David JORGENSEN , Songjae LEE , Hao WANG , Yi-Chiau HUANG , Christopher BEAUDRY
IPC: C23C16/455 , C23C16/08 , C23C18/16 , C23C18/32 , C23C28/00 , H01L21/687
CPC classification number: C23C16/45527 , C23C16/08 , C23C18/165 , C23C18/32 , C23C28/3455 , H01L21/68757
Abstract: Embodiments of the present disclosure generally relate to a substrate support having a surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an outer surface and a surface coating formed from a non-metal or a reduced-metal material disposed over at least a top surface of the outer surface of the body. In an embodiment, the surface coating includes a two-part coating having an optional first coating layer formed over an entire outer surface of the support body.
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公开(公告)号:US20230402268A1
公开(公告)日:2023-12-14
申请号:US17836657
申请日:2022-06-09
Applicant: Applied Materials, Inc.
Inventor: Songjae LEE , Masato ISHII , Martin TRUEMPER , Richard O. COLLINS , Martin Jeffrey SALINAS , Yong ZHENG , Anita ZHAO , Adele MARIADASS , Christophe MARCADAL , Henry BARANDICA , Ernesto J. ULLOA
CPC classification number: H01J37/32834 , H01J37/32449 , H01J37/32357 , H01J37/32899 , C23C14/022 , B08B7/0035 , B08B13/00 , H01J37/32825 , H01J2237/335 , H01J2237/186 , H01J2237/182
Abstract: A plasma processing system for cleaning a substrate is provided. The plasma processing system includes a process chamber that includes: a chamber body enclosing an interior volume; and a substrate support disposed in the interior volume. The plasma processing system includes a vacuum pump; a first exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump; and a second exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump. The first exhaust line and the second exhaust line are arranged to provide alternative paths for the exhaust between the interior volume and the vacuum pump, and the first exhaust line has an internal diameter that is at least 50% smaller than the internal diameter of the second exhaust line.
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