公开(公告)号：US20240032183A1

公开(公告)日：2024-01-25

申请号：US18373128

申请日：2023-09-26

Applicant: Applied Materials, Inc.

Inventor： Costel BILOIU ,  David T. BLAHNIK ,  Wai-Ming TAM ,  Charles T. CARLSON ,  Frank SINCLAIR

IPC: H05H7/02 ,  H05H7/12 ,  H05H9/00

CPC classification number: H05H7/02 ,  H05H7/12 ,  H05H9/00 ,  H05H2007/025

Abstract: An exciter for a high frequency resonator. The exciter may include an exciter coil inner portion, extending along an exciter axis, an exciter coil loop, disposed at a distal end of the exciter coil inner portion. The exciter may also include a drive mechanism, including at least a rotation component to rotate the exciter coil loop around the exciter axis.

公开(公告)号：US20240179828A1

公开(公告)日：2024-05-30

申请号：US18431579

申请日：2024-02-02

Applicant: Applied Materials, Inc.

Inventor： David T. BLAHNIK ,  Charles T. CARLSON ,  Robert B. VOPAT ,  Frank SINCLAIR ,  Paul J. MURPHY ,  Krag R. SENIOR

IPC: H05H7/22

CPC classification number: H05H7/22 ,  H05H2007/222

Abstract: Embodiments herein are directed to a linear accelerator assembly for an ion implanter. In some embodiments, a LINAC may include a coil resonator and a plurality of drift tubes coupled to the coil resonator by a set of flexible leads.

公开(公告)号：US20240420919A1

公开(公告)日：2024-12-19

申请号：US18210524

申请日：2023-06-15

Applicant: Applied Materials, Inc.

Inventor： Aaron P. WEBB ,  Krag R. SENIOR ,  Chris CZAJKA ,  Charles T. CARLSON ,  Jason M. SCHALLER

IPC: H01J37/30 ,  H01J37/317 ,  H05H9/04

Abstract: An ion implantation system including an ion source for generating an ion beam, an end station for holding a substrate to be implanted by the ion beam, and a linear accelerator disposed between the ion source and the end station and adapted to accelerate the ion beam, the linear accelerator comprising at least one acceleration stage including a resonator coil coupled to a drift tube assembly, the drift tube assembly including a first drift tube coupled to a first end of a first insulting rod via interference fit, a second drift tube coupled to a first end of a second insulting rod via interference fit, and a mounting bracket coupled to a second end of the first insulting rod and to a second end of the second insulting rod via interference fit.

公开(公告)号：US20200217423A1

公开(公告)日：2020-07-09

申请号：US16642827

申请日：2018-09-28

Applicant: Applied Materials, Inc.

Inventor： Benjamin B. RIORDON ,  Charles T. CARLSON ,  Aaron WEBB ,  Gary WYKA

IPC: F16K1/20 ,  F16K49/00 ,  F16K51/02 ,  H01J37/32

Abstract: The present disclosure generally relates to an isolation device for use in processing systems. The isolation device has a body with an inlet opening disposed at a first end coupled to a processing system component such as a remote plasma source and outlet openings, for example two, disposed at a second end which are coupled to a processing system component such as a process chamber. Flaps disposed within the body are actuatable to an open position from a closed position or to a closed position from an open position, to selectively allow or prevent passage of a fluid from the processing system component coupled to the isolation device to the other processing system component coupled thereto.

公开(公告)号：US20190293199A1

公开(公告)日：2019-09-26

申请号：US16341703

申请日：2017-12-01

Applicant: Applied Materials, Inc.

Inventor： Charles T. CARLSON ,  Tammy Jo PRIDE ,  Benjamin B. RIORDON ,  Aaron WEBB

IPC: F16K27/02 ,  F16K1/20 ,  F16K11/10

Abstract: Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.

公开(公告)号：US20190148186A1

公开(公告)日：2019-05-16

申请号：US16157808

申请日：2018-10-11

Applicant: Applied Materials, Inc.

Inventor： Jason M. SCHALLER ,  Robert Brent VOPAT ,  Charles T. CARLSON ,  Jeffrey Charles BLAHNIK ,  Timothy J. FRANKLIN ,  David BLAHNIK ,  Aaron WEBB

IPC: H01L21/67 ,  H01L21/673

Abstract: Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290° C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.

公开(公告)号：US20190139793A1

公开(公告)日：2019-05-09

申请号：US16170683

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Jean DELMAS ,  Charles T. CARLSON ,  Robert Brent VOPAT

IPC: H01L21/67 ,  H01L21/324 ,  F22G7/00

Abstract: A system for annealing substrates is provided. The system includes a first boiler having an input coupled to a water source; a second boiler having an input connected to an output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch processing chamber is configured to anneal a plurality of substrates using steam from the second boiler.