Scalable Interrupts
    1.
    发明公开
    Scalable Interrupts 审中-公开

    公开(公告)号:US20240311319A1

    公开(公告)日:2024-09-19

    申请号:US18674203

    申请日:2024-05-24

    申请人: Apple Inc.

    IPC分类号: G06F13/24 G06F1/26

    CPC分类号: G06F13/24 G06F1/26

    摘要: An interrupt delivery mechanism for a system includes and interrupt controller and a plurality of cluster interrupt controllers coupled to respective pluralities of processors in an embodiment. The interrupt controller may serially transmit an interrupt request to respective cluster interrupt controllers, which may acknowledge (Ack) or non-acknowledge (Nack) the interrupt based on attempting to deliver the interrupt to processors to which the cluster interrupt controller is coupled. In a soft iteration, the cluster interrupt controller may attempt to deliver the interrupt to processors that are powered on, without attempting to power on processors that are powered off. If the soft iteration does not result in an Ack response from one of the plurality of cluster interrupt controllers, a hard iteration may be performed in which the powered-off processors may be powered on.

    Latency Events in Multi-Die Architecture
    2.
    发明公开

    公开(公告)号:US20240184355A1

    公开(公告)日:2024-06-06

    申请号:US18438665

    申请日:2024-02-12

    申请人: Apple Inc.

    IPC分类号: G06F1/3296 G06F1/3206

    CPC分类号: G06F1/3296 G06F1/3206

    摘要: Techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. A system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. A particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. The primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. A given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state. Techniques are further disclosed relating to managing latency tolerance events within a multi-die integrated circuit.

    Power consumption control based on random bus inversion

    公开(公告)号:US11836107B2

    公开(公告)日:2023-12-05

    申请号:US17683396

    申请日:2022-03-01

    申请人: Apple Inc.

    IPC分类号: G06F15/78 G06F13/40

    CPC分类号: G06F15/7807 G06F13/4013

    摘要: An electronic device includes circuitry and a plurality of ports. The plurality of ports includes an input port and an output port, configured to communicate data units with one or more other devices across a fabric of a System on a Chip (SoC), the data units include N data bits, N being an integer larger than 1. The circuitry is configured to receive an input data unit via the input port, to make a random decision of whether to invert the N data bits in the input data unit, to produce an output data unit by retaining or inverting the N data bits of the input data unit based on the random decision, and to send the output data unit via the output port.

    Multi-Die Power Synchronization
    4.
    发明申请

    公开(公告)号:US20230059725A1

    公开(公告)日:2023-02-23

    申请号:US17933168

    申请日:2022-09-19

    申请人: Apple Inc.

    IPC分类号: G06F1/3296 G06F1/3206

    摘要: Techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. A system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. A particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. The primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. A given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state. Techniques are further disclosed relating to managing latency tolerance events within a multi-die integrated circuit.

    ELECTRONIC DISPLAY POWER MANAGEMENT SYSTEMS AND METHODS

    公开(公告)号:US20220413589A1

    公开(公告)日:2022-12-29

    申请号:US17899607

    申请日:2022-08-30

    申请人: Apple Inc.

    摘要: An electronic device may include a display panel to display images based on corresponding image data and an image source to pre-render a flip-book including a first image frame for display at a first target presentation time and a second image frame for display at a second target presentation time. The electronic device may also include a display pipeline coupled between the display panel and the image source having image data processing circuitry to process image data for display. The electronic device may also include a controller to instruct the display pipeline to process image data, to determine a power-on time based on a target presentation time, and to instruct the display pipeline to power-gate the image data processing circuitry upon completion of the processing of image data and until the power-on time is reached.

    Multi-die power synchronization
    6.
    发明授权

    公开(公告)号:US11467655B1

    公开(公告)日:2022-10-11

    申请号:US17340940

    申请日:2021-06-07

    申请人: Apple Inc.

    摘要: Techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. A system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. A particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. The primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. A given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state. Techniques are further disclosed relating to managing latency tolerance events within a multi-die integrated circuit.

    System-on-Chip with DVFM Protection Circuit
    9.
    发明公开

    公开(公告)号:US20230259189A1

    公开(公告)日:2023-08-17

    申请号:US17673870

    申请日:2022-02-17

    申请人: Apple Inc.

    IPC分类号: G06F1/28

    CPC分类号: G06F1/28

    摘要: A system includes multiple hardware circuits and protection circuitry. The multiple hardware circuits are coupled to respective power domains having respective sets of domain-specific power settings. The protection circuitry is configured to monitor requests in which one or more of the hardware circuits request transitions between the domain-specific power settings, to determine, from among multiple system-level combinations of the domain-specific power settings, a subset of system-level combinations that could potentially be traversed in performing the requested transitions, and to initiate a responsive action upon detecting that any of the system-level combinations in the subset is specified as invalid.

    Power Delivery Reduction Scheme for SoC

    公开(公告)号:US20230069344A1

    公开(公告)日:2023-03-02

    申请号:US17676665

    申请日:2022-02-21

    申请人: Apple Inc.

    IPC分类号: G06F1/3296 G06F1/3206

    摘要: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Different sets of power delivery trigger circuits may be coupled to the integrated circuit by wiring or serial communication interfaces. Power reduction responses may be implemented at faster rates utilizing the wired power delivery trigger circuits while slower power reduction response can be implemented utilizing serially connected power delivery trigger circuits. The threshold for power reduction response by wired power delivery trigger circuits may also be closer to a functional failure point of the integrated circuit in order to provide fast response to avoid failure of the integrated circuit.