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公开(公告)号：US20050128540A1
公开(公告)日：2005-06-16
申请号：US11034050
申请日：2005-01-13
申请人： Alan Kathman , Michael Feldman
发明人： Alan Kathman , Michael Feldman
IPC分类号： B23K26/06 , G02B5/02 , G02B5/18 , G02B5/32 , G02B27/09 , G02F1/01 , G03F7/20 , G03H1/08 , H01L21/027 , H04B10/04
CPC分类号： G02B5/0252 , B23K26/06 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/066 , B23K26/0665 , G02B5/0278 , G02B5/1819 , G02B5/1857 , G02B5/32 , G02B19/0014 , G02B19/0057 , G02B19/0095 , G02B27/09 , G02B27/0927 , G02B27/0944 , G03F7/70058 , G03H1/0236 , G03H2001/085 , G03H2001/303 , H04B10/50 , Y10S359/90
摘要： A beam homogenizer that minimizes undesired intensity variations at the output plane caused by sharp breaks between facets in previous embodiments. The homogenizer includes a hologram made up of irregularly patterned diffractive fringes. An input beam illuminates at least part of the hologram. The hologram transmits a portion of the input beam onto an output plane. In doing so, the energy of the input beam is spatially redistributed at the output plane into a homogenized output beam having a preselected spatial energy distribution at the output plane. Thus, the illuminated portion of the output plane has a shape predetermined by the designer of the homogenizer.
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公开(公告)号：US06406583B1
公开(公告)日：2002-06-18
申请号：US09514252
申请日：2000-02-28
申请人： Brian Harden , Alan Kathman , Michael Feldman
发明人： Brian Harden , Alan Kathman , Michael Feldman
IPC分类号： B32B3118
CPC分类号： G02B5/1819 , G02B3/0006 , G02B6/4206 , G02B6/4214 , G02B6/4224 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B13/0085 , G02B2006/12102 , G02B2006/12107 , G03F9/7042 , G11B7/123 , G11B7/1353 , G11B7/1362 , G11B7/1372 , G11B7/22 , G11B2007/13727 , H01L25/167 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H01S5/0201 , H01S5/02248 , Y10T156/1052 , Y10T156/1089 , Y10T156/1092 , H01L2924/00
摘要： Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
摘要翻译： 集成的多个光学元件可以通过将包含这种光学元件的基板结合在一起或通过在晶片基板的任一侧上设置光学元件来形成。 随后切割晶片以获得单独的单元本身。 光学元件可以光刻地，直接地或使用光刻产生的主体来压印元件。 对准特征有助于这种集成的多个光学元件的有效生产，以及在晶片级上的后创建处理。
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公开(公告)号：US20070110361A1
公开(公告)日：2007-05-17
申请号：US11647397
申请日：2006-12-29
申请人： Brian Harden , Alan Kathman , Michael Feldman
发明人： Brian Harden , Alan Kathman , Michael Feldman
CPC分类号： B29D11/00278 , G02B6/4214 , Y10T156/1052
摘要： Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
摘要翻译： 集成的多个光学元件可以通过将包含这种光学元件的基板结合在一起或通过在晶片基板的任一侧上设置光学元件来形成。 随后切割晶片以获得单独的单元本身。 光学元件可以光刻地，直接地或使用光刻产生的主体来压印元件。 对准特征有助于这种集成的多个光学元件的有效生产，以及在晶片级上的后创建处理。
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公开(公告)号：US06844978B2
公开(公告)日：2005-01-18
申请号：US10170726
申请日：2002-06-14
申请人： Brian Harden , Alan Kathman , Michael Feldman
发明人： Brian Harden , Alan Kathman , Michael Feldman
IPC分类号： G02B6/12 , G02B6/42 , G03F9/00 , G11B7/12 , G11B7/135 , G11B7/22 , H01L25/16 , H01L27/00 , H01L27/146 , H01L31/12 , H01S3/00 , H01S5/00 , H01S5/022 , G02B27/10
CPC分类号： G02B5/1819 , G02B3/0006 , G02B6/4206 , G02B6/4214 , G02B6/4224 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B13/0085 , G02B2006/12102 , G02B2006/12107 , G03F9/7042 , G11B7/123 , G11B7/1353 , G11B7/1362 , G11B7/1372 , G11B7/22 , G11B2007/13727 , H01L25/167 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H01S5/0201 , H01S5/02248 , Y10T156/1052 , Y10T156/1089 , Y10T156/1092 , H01L2924/00
摘要： Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
摘要翻译： 集成的多个光学元件可以通过将包含这种光学元件的基板结合在一起或通过在晶片基板的任一侧上设置光学元件来形成。 随后切割晶片以获得单独的单元本身。 光学元件可以光刻地，直接地或使用光刻产生的主体来压印元件。 对准特征有助于这种集成的多个光学元件的有效生产，以及在晶片级上的后创建处理。
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公开(公告)号：US08611026B2
公开(公告)日：2013-12-17
申请号：US12382944
申请日：2009-03-26
申请人： Hongtao Han , Alan Kathman , Rong Huang , Michael Feldman , Robert D. TeKolste , Jeremy Huddleston , James Carriere , Michael Magoon , Jack Schmidt
发明人： Hongtao Han , Alan Kathman , Rong Huang , Michael Feldman , Robert D. TeKolste , Jeremy Huddleston , James Carriere , Michael Magoon , Jack Schmidt
CPC分类号： G02B3/0031 , B29D11/0073
摘要： An optical device includes a substrate. a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.
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6.发明授权Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby 有权用于复制光学元件，特别是在晶片级上的方法，以及由此形成的复制品公开(公告)号：US08318057B2
公开(公告)日：2012-11-27
申请号：US10647262
申请日：2003-08-26
申请人： Brian Harden , Alan Kathman , Michael Feldman
发明人： Brian Harden , Alan Kathman , Michael Feldman
IPC分类号： B29D11/00
CPC分类号： G02B5/1819 , G02B3/0006 , G02B6/4206 , G02B6/4214 , G02B6/4224 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B13/0085 , G02B2006/12102 , G02B2006/12107 , G03F9/7042 , G11B7/123 , G11B7/1353 , G11B7/1362 , G11B7/1372 , G11B7/22 , G11B2007/13727 , H01L25/167 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H01S5/0201 , H01S5/02248 , Y10T156/1052 , Y10T156/1089 , Y10T156/1092 , H01L2924/00
摘要： Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
摘要翻译： 集成的多个光学元件可以通过将包含这种光学元件的基板结合在一起或通过在晶片基板的任一侧上设置光学元件来形成。 随后切割晶片以获得单独的单元。 光学元件可以光刻地，直接地或使用光刻产生的主体来压印元件。 对准特征有助于这种集成的多个光学元件的有效生产，以及在晶片级上的后创建处理。
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公开(公告)号：US20070187789A1
公开(公告)日：2007-08-16
申请号：US11783530
申请日：2007-04-10
申请人： Alan Kathman , James Morris , John Hammond , Michael Feldman
发明人： Alan Kathman , James Morris , John Hammond , Michael Feldman
IPC分类号： H01L31/0232 , H01L29/24 , H01L29/22 , H01L29/227 , G02B6/36
CPC分类号： H01L31/0203 , G02B6/4201 , G02B6/4204 , G02B6/4251 , G02B6/4259 , G02B6/4269 , G02B6/4274 , G02B6/4286 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01S5/0201 , H01L2924/00014 , H01L2924/00
摘要： An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.
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公开(公告)号：US6096155A
公开(公告)日：2000-08-01
申请号：US943274
申请日：1997-10-03
申请人： Brian Harden , Alan Kathman , Michael Feldman
发明人： Brian Harden , Alan Kathman , Michael Feldman
IPC分类号： G02B6/12 , G02B6/42 , G03F9/00 , G11B7/12 , G11B7/135 , G11B7/22 , H01L25/16 , H01L27/00 , H01L27/146 , H01L31/12 , H01S3/00 , H01S5/00 , H01S5/022 , H01L21/78
CPC分类号： G02B5/1819 , G02B13/0085 , G02B3/0006 , G02B6/4206 , G02B6/4231 , G02B6/4232 , G03F9/7042 , G11B7/123 , G11B7/1353 , G11B7/1362 , G11B7/1372 , G11B7/22 , H01L25/167 , H01L27/14625 , H01L27/14632 , H01L27/14687 , G02B2006/12102 , G02B2006/12107 , G02B6/4214 , G02B6/4224 , G02B6/4238 , G02B6/4239 , G11B2007/13727 , H01L2924/0002 , H01S5/0201 , H01S5/02248 , Y10T156/1052 , Y10T156/1089 , Y10T156/1092
摘要： Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
摘要翻译： 集成的多个光学元件可以通过将包含这种光学元件的基板结合在一起或通过在晶片基板的任一侧上设置光学元件来形成。 随后切割晶片以获得单独的单元本身。 光学元件可以光刻地，直接地或使用光刻产生的主体来压印元件。 对准特征有助于这种集成的多个光学元件的有效生产，以及在晶片级上的后创建处理。
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9.发明申请Optical device including at least one replicated surface and associated methods 失效光学装置包括至少一个复制表面和相关方法公开(公告)号：US20090290833A1
公开(公告)日：2009-11-26
申请号：US12382944
申请日：2009-03-26
申请人： Hongtao Han , Alan Kathman , Rong Huang , Michael Feldman , Robert D. TeKOLSTE , Jeremy Huddleston , James Carriere , Michael Magoon , Jack Schmidt
发明人： Hongtao Han , Alan Kathman , Rong Huang , Michael Feldman , Robert D. TeKOLSTE , Jeremy Huddleston , James Carriere , Michael Magoon , Jack Schmidt
CPC分类号： G02B3/0031 , B29D11/0073
摘要： An optical device includes a substrate. a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.
摘要翻译： 光学装置包括基板。 在基板的第一表面上的非平面透明结构，所述非平面透明结构由第一材料制成，并且在所述基板的与所述非平面透明结构相邻的所述第一表面上的模制折射表面，所述模制折射 表面由与第一材料不同的第二材料制成。
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10.发明授权Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby 有权用于复制光学元件，特别是在晶片级上的方法，以及由此形成的复制品公开(公告)号：US06610166B1
公开(公告)日：2003-08-26
申请号：US09503249
申请日：2000-02-14
申请人： Brian Harden , Alan Kathman , Michael Feldman
发明人： Brian Harden , Alan Kathman , Michael Feldman
IPC分类号： B29D1100
CPC分类号： G02B5/1819 , G02B3/0006 , G02B6/4206 , G02B6/4214 , G02B6/4224 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B13/0085 , G02B2006/12102 , G02B2006/12107 , G03F9/7042 , G11B7/123 , G11B7/1353 , G11B7/1362 , G11B7/1372 , G11B7/22 , G11B2007/13727 , H01L25/167 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H01S5/0201 , H01S5/02248 , Y10T156/1052 , Y10T156/1089 , Y10T156/1092 , H01L2924/00
摘要： Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
摘要翻译： 集成的多个光学元件可以通过将包含这种光学元件的基板结合在一起或通过在晶片基板的任一侧上设置光学元件来形成。 随后切割晶片以获得单独的单元本身。 光学元件可以光刻地，直接地或使用光刻产生的主体来压印元件。 对准特征有助于这种集成的多个光学元件的有效生产，以及在晶片级上的后创建处理。
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