System and method for clipping integers
    1.
    发明授权
    System and method for clipping integers 失效
    用于剪切整数的系统和方法

    公开(公告)号:US5801977A

    公开(公告)日:1998-09-01

    申请号:US826817

    申请日:1997-04-07

    摘要: A circuit and method for clipping input integers to a specified range comprising the steps of providing a mask wherein a bit is set for each out-of-range bit and not set for in-range bits and applying the mask to input integers so that any integers outside of the range is clipped to the quantity in the range closest to the integer, thereby producing output integers within a range specified by the mask. Other systems and methods are disclosed.

    摘要翻译: 一种用于将输入整数剪切到指定范围的电路和方法,包括以下步骤:提供掩模,其中为每个超范围位设置位,并且不为范围内位设置位,并将掩码应用于输入整数,使得任何 超出范围的整数被剪裁到最接近整数的范围内的数量,从而在掩码指定的范围内产生输出整数。 公开了其它系统和方法。

    Vector memory operations
    2.
    发明授权
    Vector memory operations 失效
    矢量内存操作

    公开(公告)号:US5689653A

    公开(公告)日:1997-11-18

    申请号:US384308

    申请日:1995-02-06

    摘要: The op-code bandwidth limitation of computer systems is alleviated by providing one or more vector buffers. Data is transferred between memory and processor registers in a two part process using the vector buffers. In a first part, a vector request instruction initiates buffering of data by storing data in control registers identifying a set of data elements (a vector) in the memory. When the identifying information is loaded in the control registers, a vector prefetch controller transfers elements of the vector between the memory and a vector buffer. In a second part, vector element operation instructions transfer a next element of the vector between the vector buffer and a specified processor register for use in arithmetic or logic operations.

    摘要翻译: 通过提供一个或多个向量缓冲器来减轻计算机系统的操作码带宽限制。 数据在存储器和处理器寄存器之间使用向量缓冲区在两部分进程中传输。 在第一部分中,向量请求指令通过将数据存储在识别存储器中的一组数据元素(矢量)的控制寄存器中来发起数据的缓冲。 当识别信息被加载到控制寄存器中时,向量预取控制器在存储器和向量缓冲器之间传送向量的元素。 在第二部分中,向量元素操作指令将矢量的下一个元素传送到矢量缓冲器和指定的处理器寄存器之间,用于算术或逻辑运算。

    Poison bit error checking code scheme
    5.
    发明授权
    Poison bit error checking code scheme 有权
    毒码错误检查码方案

    公开(公告)号:US08438452B2

    公开(公告)日:2013-05-07

    申请号:US12317849

    申请日:2008-12-29

    IPC分类号: G06F11/00

    CPC分类号: G06F11/1012 G06F11/1064

    摘要: In one embodiment, a method provides determining one of an occurrence and a non-occurrence of an event, the one of the occurrence and the non-occurrence resulting in an event determination; and processing a code having an event bit, said processing in accordance with the determination and the code, by determining if the event bit corresponds to the event determination, and if the event bit does not correspond to the event determination, encoding the code to generate a poison bit that corresponds to the event determination.

    摘要翻译: 在一个实施例中,一种方法提供确定事件的发生和不发生之一,发生和不发生中的一个导致事件确定; 以及通过确定所述事件位是否对应于所述事件确定来处理具有事件位的代码,根据所述确定和所述代码的所述处理,以及如果所述事件位不对应于所述事件确定,则对所述代码进行编码以产生 与事件确定相对应的毒物位。

    Integrated multi-chip module having a conformal chip/heat exchanger
interface
    6.
    发明授权
    Integrated multi-chip module having a conformal chip/heat exchanger interface 失效
    具有保形片/热交换器接口的集成多芯片模块

    公开(公告)号:US5323292A

    公开(公告)日:1994-06-21

    申请号:US957309

    申请日:1992-10-06

    申请人: Dennis Brzezinski

    发明人: Dennis Brzezinski

    摘要: A multi-chip module having a conformal heat transfer interface to adapt to variations in the height and angle of integrated circuit chips and to achieve a thermal energy path between each chip and a heat sink. The conformal heat transfer interface includes a deformable metallic membrane and a liquid under pressure. The liquid has a high thermal conductivity and provides a pressure for deforming the metallic membrane to compensate for non-coplanarity of the chips. The module integrates the structural support, RF shielding, contamination-protection elements, and the heat-dissipating mechanism that are desired in the design of multi-chip modules. Double-sided cooling of the module significantly improves the thermal characteristics of a module, even in the absence of the conformal heat transfer interface.

    摘要翻译: 一种具有保形传热接口以适应集成电路芯片的高度和角度变化并实现每个芯片与散热器之间的热能路径的多芯片模块。 保形传热界面包括可变形金属膜和压力下的液体。 液体具有高导热性,并且提供用于使金属膜变形以补偿芯片的非共面性的压力。 该模块集成了多芯片模块设计中所需的结构支持,RF屏蔽,污染保护元件和散热机制。 模块的双面冷却显着提高了模块的热特性,即使没有保形传热接口。

    Poison bit error checking code scheme
    8.
    发明申请
    Poison bit error checking code scheme 有权
    毒码错误检查码方案

    公开(公告)号:US20100169739A1

    公开(公告)日:2010-07-01

    申请号:US12317849

    申请日:2008-12-29

    IPC分类号: H03M13/05 G06F11/10

    CPC分类号: G06F11/1012 G06F11/1064

    摘要: In one embodiment, a method provides determining one of an occurrence and a non-occurrence of an event, the one of the occurrence and the non-occurrence resulting in an event determination; and processing a code having an event bit, said processing in accordance with the determination and the code, by determining if the event bit corresponds to the event determination, and if the event bit does not correspond to the event determination, encoding the code to generate a poison bit that corresponds to the event determination.

    摘要翻译: 在一个实施例中,一种方法提供确定事件的发生和不发生之一,发生和不发生中的一个导致事件确定; 以及通过确定所述事件位是否对应于所述事件确定来处理具有事件位的代码,根据所述确定和所述代码的所述处理,以及如果所述事件位不对应于所述事件确定,则对所述代码进行编码以产生 与事件确定相对应的毒物位。

    Mechanically floating multi-chip substrate
    10.
    发明授权
    Mechanically floating multi-chip substrate 失效
    机械浮动多芯片基板

    公开(公告)号:US5608610A

    公开(公告)日:1997-03-04

    申请号:US529373

    申请日:1995-09-18

    申请人: Dennis Brzezinski

    发明人: Dennis Brzezinski

    摘要: A multi-chip module includes a mechanically floated substrate on which integrated circuit devices are mounted. The substrate is located within a heat exchanger. In one embodiment, a spring or an array of springs biases the substrate upwardly to press the integrated circuit devices against a surface within the heat exchanger. The substrate is displaceable with respect to the heat exchanger, allowing accommodations to differences in thermal expansion coefficients and to non-uniformities resulting from less than exact manufacturing tolerances of the substrate, the heat exchanger and the integrated circuit devices. Another embodiment includes resting the substrate on a conformable membrane that is used to entrap a fixed volume of thermally-conductive liquid. The membrane-and-liquid arrangement mechanically floats the substrate and ensures a proper integrated circuit device/exchanger thermal interface. A flexible multi-conductor interconnect is electrically coupled to the substrate to allow conduction of signals to and from the substrate without interfering with the ability of the substrate to float mechanically. Also disclosed is a module in which the membrane-and-liquid arrangement is used at the integrated circuit device side of the substrate to achieve a deformable electrical and thermal flow path from the integrated circuit devices to the heat exchanger. The membrane adapts to variations in the heights and/or angles of the integrated circuit devices.

    摘要翻译: 多芯片模块包括其上安装有集成电路装置的机械浮动基板。 衬底位于热交换器内。 在一个实施例中,弹簧或弹簧阵列向上偏压衬底以将集成电路装置压靠在热交换器内的表面。 衬底相对于热交换器可移位,允许调节热膨胀系数的差异和由于衬底,热交换器和集成电路器件的精确制造公差导致的不均匀性。 另一个实施方案包括将基底搁置在用于捕获固定体积的导热液体的适形膜上。 膜和液体布置机械漂浮基板并确保适当的集成电路设备/交换器热接口。 柔性多导体互连电耦合到衬底,以允许信号传导到衬底和从衬底传导,而不会干扰衬底机械浮动的能力。 还公开了一种模块,其中膜和液体布置用于基板的集成电路器件侧,以实现从集成电路器件到热交换器的可变形的电和热流动路径。 膜适应于集成电路器件的高度和/或角度的变化。