公开(公告)号：US20250054837A1

公开(公告)日：2025-02-13

申请号：US18924480

申请日：2024-10-23

Applicant: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor： Thomas Workman ,  Ron Zhang ,  Kyong-Mo Bang ,  Belgacem Haba ,  Gaius Gillman Fountain, JR.

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/367

Abstract: A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid communication with the inlet and outlet, forming a plurality of nozzles on the first side of a second substrate, and forming a plurality of channels on the second side of the second substrate opposite the first side of the second substrate. The plurality of channels is aligned with the plurality of nozzles, and the second side of the first substrate is bonded to the first side of the second substrate.

公开(公告)号：US12191234B2

公开(公告)日：2025-01-07

申请号：US18235271

申请日：2023-08-17

Applicant: Adeia Semiconductor Bonding Technologies Inc.

Inventor： Gaius Gillman Fountain, Jr. ,  Belgacem Haba ,  Kyong-Mo Bang

IPC: H01L23/473 ,  H01L21/48 ,  H01L23/427 ,  H01L23/467 ,  H01L25/18 ,  H01L23/00 ,  H10B80/00

Abstract: A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a semiconductor device and a cold plate attached to the semiconductor device. The cold plate comprises a top portion and a bottom portion horizontally adjacent to the top portion. The top portion comprises upper cavity dividers extending downwardly to define upper cavity volumes. The bottom portion comprises lower cavity dividers extending upwardly to define lower cavity volumes. The upper cavity dividers and the lower cavity dividers alternate across a horizontal length of the cold plate.

公开(公告)号：US20240387322A1

公开(公告)日：2024-11-21

申请号：US18235271

申请日：2023-08-17

Applicant: Adeia Semiconductor Bonding Technologies Inc.

Inventor： Gaius Gillman Fountain Jr. ,  Belgacem Haba ,  Kyong-Mo Bang

IPC: H01L23/473 ,  H01L21/48 ,  H01L23/00 ,  H01L23/427 ,  H01L23/467 ,  H01L25/18 ,  H10B80/00

Abstract: A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a semiconductor device and a cold plate attached to the semiconductor device. The cold plate comprises a top portion and a bottom portion horizontally adjacent to the top portion. The top portion comprises upper cavity dividers extending downwardly to define upper cavity volumes. The bottom portion comprises lower cavity dividers extending upwardly to define lower cavity volumes. The upper cavity dividers and the lower cavity dividers alternate across a horizontal length of the cold plate.

公开(公告)号：US20230268300A1

公开(公告)日：2023-08-24

申请号：US18173690

申请日：2023-02-23

Applicant: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar ,  Thomas Workman ,  Gaius Gillman Fountain, Jr. ,  Guilian Gao ,  Jeremy Alfred Theil ,  Gabriel Z. Guevara ,  Kyong-Mo Bang ,  Laura Wills Mirkarimi

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/065 ,  H01L23/498 ,  H01L23/48

CPC classification number: H01L24/08 ,  H01L25/16 ,  H01L25/0657 ,  H01L25/0655 ,  H01L25/0652 ,  H01L23/49838 ,  H01L23/481 ,  H01L24/80 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2924/1011 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2224/08145 ,  H01L2224/08121 ,  H01L2224/08225

Abstract: A bonded structure can include a carrier including a first conductive contact and a second conductive contact, a first singulated element including a third conductive contact directly bonded to the first conductive contact without an adhesive, and a second singulated element including a fourth conductive contact directly bonded to the second conductive contact without an adhesive, wherein the first and second conductive contacts are spaced apart by a contact spacing of no more than 250 microns.