公开(公告)号：US12176264B1

公开(公告)日：2024-12-24

申请号：US18674581

申请日：2024-05-24

Applicant: Adeia Semiconductor Bonding Technologies Inc.

Inventor： Belgacem Haba ,  Gaius Gillman Fountain, Jr. ,  Laura Mirkarimi ,  Ron Zhang ,  Rajesh Katkar

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/36 ,  H01L25/065

Abstract: A device package comprising a cooling system. The cooling system comprises a first substrate, a first semiconductor device located on a first region of the first substrate, a second semiconductor device located on a second region of the first substrate, a first cold plate attached to the first semiconductor device, a second cold plate attached to the second semiconductor device, and a manifold having a first chamber volume and a second chamber volume. The first chamber volume comprises a first inlet coupled to a first coolant line, a first outlet coupled to the first cold plate, and a second outlet coupled to the second cold plate. The second chamber volume comprises a third outlet coupled to a second coolant line, a second inlet coupled to the first cold plate, and a third inlet coupled to the second cold plate.

公开(公告)号：US20250054837A1

公开(公告)日：2025-02-13

申请号：US18924480

申请日：2024-10-23

Applicant: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor： Thomas Workman ,  Ron Zhang ,  Kyong-Mo Bang ,  Belgacem Haba ,  Gaius Gillman Fountain, JR.

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/367

Abstract: A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid communication with the inlet and outlet, forming a plurality of nozzles on the first side of a second substrate, and forming a plurality of channels on the second side of the second substrate opposite the first side of the second substrate. The plurality of channels is aligned with the plurality of nozzles, and the second side of the first substrate is bonded to the first side of the second substrate.