公开(公告)号：US20240387322A1

公开(公告)日：2024-11-21

申请号：US18235271

申请日：2023-08-17

Applicant: Adeia Semiconductor Bonding Technologies Inc.

Inventor： Gaius Gillman Fountain Jr. ,  Belgacem Haba ,  Kyong-Mo Bang

IPC: H01L23/473 ,  H01L21/48 ,  H01L23/00 ,  H01L23/427 ,  H01L23/467 ,  H01L25/18 ,  H10B80/00

Abstract: A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a semiconductor device and a cold plate attached to the semiconductor device. The cold plate comprises a top portion and a bottom portion horizontally adjacent to the top portion. The top portion comprises upper cavity dividers extending downwardly to define upper cavity volumes. The bottom portion comprises lower cavity dividers extending upwardly to define lower cavity volumes. The upper cavity dividers and the lower cavity dividers alternate across a horizontal length of the cold plate.