公开(公告)号：US20170130009A1

公开(公告)日：2017-05-11

申请号：US15414212

申请日：2017-01-24

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Eiichi NISHI ,  Toru SASAKI ,  Nobutaka KIDERA

IPC: C08J3/12 ,  B32B7/12 ,  B32B5/16 ,  H05K3/00 ,  C08F214/26 ,  H05K1/03 ,  H05K3/06 ,  B32B15/08 ,  C08J5/24

Abstract: To provide a method capable of producing, by means of mechanical pulverization, a resin powder having a high bulk density and an average particle size of at most 50 μm from resin particles containing a fluorocopolymer as the main component and having a melting point of from 260 to 320° C., such as PFA. The method is to obtain a resin powder having an average particle size of from 0.02 to 50 μm by subjecting resin particles (A) having an average particle size of at least 100 μm to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component; and said fluorocopolymer (X1) has a unit (1) based on a monomer containing at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene, and has a melting point of from 260 to 320° C.

公开(公告)号：US20180050516A1

公开(公告)日：2018-02-22

申请号：US15786876

申请日：2017-10-18

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Wataru KASAI ,  Toru SASAKI ,  Masatoshi ABE

IPC: B32B15/08 ,  B32B37/06 ,  B32B7/12 ,  C23F1/00 ,  C09J7/02 ,  C09J5/06 ,  H05K1/03 ,  H05K3/06

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B27/30 ,  B32B37/06 ,  B32B2307/306 ,  B32B2309/02 ,  B32B2457/08 ,  C08F214/262 ,  C08F214/265 ,  C09J5/06 ,  C09J7/00 ,  C09J7/25 ,  C09J7/35 ,  C09J127/18 ,  C09J129/10 ,  C09J135/00 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2427/00 ,  C09J2479/086 ,  C23F1/00 ,  H05K1/0353 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/06 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/068

Abstract: To provide a material for a printed circuit board which is less likely to be warped in a high temperature region (from 150 to 200° C.) while maintaining electrical properties, a metal laminate, methods for producing them, and a method for producing a printed circuit board.A material having a fluorinated resin layer is subjected to a heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.

公开(公告)号：US20180038523A1

公开(公告)日：2018-02-08

申请号：US15722625

申请日：2017-10-02

Applicant: Asahi Glass Company, Limited

Inventor： Eiichi NISHI ,  Tomoya HOSODA ,  Toru SASAKI

IPC: F16L11/12 ,  C08F214/26 ,  B32B27/32 ,  B32B27/34 ,  B32B1/08 ,  B32B27/08

Abstract: To provide a laminate which is formed from resins and is excellent in heat resistance and excellent in flexibility and mechanical properties under high-temperature conditions and which undergoes no separation of layers even when contacted with oil such as engine oil for a long period of time. The laminate comprises a first layer containing a fluorinated copolymer and a second layer containing a polyamide directly laminated on the first layer, wherein the fluorinated copolymer has units based on tetrafluoroethylene, units based on ethylene, units based on a copolymerizable another monomer not having a carbonyl group, and carbonyl group-containing groups, wherein the amounts of the respective units are in specific ranges, and the tensile elongation at 200° C. of the fluorinated copolymer is at least 200%, and the melting point of the polyamide and the flexural elastic modulus at 23° C. of the second layer are in specific ranges.

公开(公告)号：US20160242274A1

公开(公告)日：2016-08-18

申请号：US15140912

申请日：2016-04-28

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Eiichi NISHI ,  Toru SASAKI ,  Yasuhiko MATSUOKA ,  Wataru KASAI

IPC: H05K1/02 ,  H05K3/46 ,  C09J127/18 ,  H05K1/03 ,  H01P3/08 ,  C09J7/02 ,  H05K3/06 ,  H05K3/22

Abstract: To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm.

Abstract translation: 为了提供一种粘合剂膜，其包括聚酰亚胺膜和直接层压的氟化树脂层，其中抑制了在与高温回流焊接相对应的气氛中的起泡（发泡）和柔性金属层压体。 一种粘合膜，其具有含有在聚酰亚胺膜的一面或两面直接层叠的含氟共聚物（A）的氟化树脂层，其中，所述含氟共聚物（A）的熔点为280℃以上，320以下 ℃，可熔融成型，并且具有选自含有羰基的基团，羟基，环氧基和异氰酸酯基团中的至少一种官能团，氟化树脂层具有 厚度为1至20μm。

公开(公告)号：US20180213637A1

公开(公告)日：2018-07-26

申请号：US15925990

申请日：2018-03-20

Applicant: Asahi Glass Company, Limited

Inventor： Tomoya HOSODA ,  Toru SASAKI ,  Nobutaka KIDERA ,  Tatsuya TERADA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0271 ,  B32B7/02 ,  B32B27/30 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/16 ,  H05K3/0011 ,  H05K3/0014 ,  H05K3/0055 ,  H05K3/422 ,  H05K3/427 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/10098 ,  H05K2203/0789 ,  H05K2203/095

Abstract: To provide a process for producing a wiring substrate with conduction failure in a hole formed in an electrical insulator layer suppressed even without conducting an etching treatment using metal sodium, and with unexpected deformation such as warpage suppressed even when the electrical insulator layer contains no woven fabric or non-woven fabric comprising reinforcing fibers. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, an electrical insulator layer 10 which contains a specific fluororesin layer (A) 16 and a heat resistant resin layer (B) 18, contains no reinforcing fiber to substrate, and has a dielectric constant of from 2.0 to 3.5 and a linear expansion coefficient of from 0 to 35 ppm/° C., and a second conductor layer 14, applying, to an inner wall surface 20a of the hole 20, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer 22 on the inner wall surface 20a of the hole 20.

公开(公告)号：US20180154614A1

公开(公告)日：2018-06-07

申请号：US15888116

申请日：2018-02-05

Applicant: Asahi Glass Company, Limited

Inventor： Tomoya HOSODA ,  Takashi SATO ,  Toru SASAKI ,  Yoji NAKAJIMA ,  Seigo KOTERA ,  Junetsu NAKAMURA

IPC: B32B15/085 ,  B32B27/08 ,  B32B27/32 ,  B32B27/34 ,  B32B27/28 ,  B32B5/26 ,  B32B37/06 ,  B29C70/46

CPC classification number: B32B15/085 ,  B29C43/20 ,  B29C43/34 ,  B29C70/465 ,  B29K2027/12 ,  B29K2077/00 ,  B29K2081/04 ,  B29K2105/0872 ,  B29K2307/04 ,  B29K2995/0016 ,  B29K2995/0058 ,  B29K2995/0098 ,  B32B5/26 ,  B32B5/28 ,  B32B15/08 ,  B32B27/08 ,  B32B27/286 ,  B32B27/322 ,  B32B27/34 ,  B32B37/06 ,  B32B2262/106 ,  B32B2307/3065 ,  B32B2307/714

Abstract: To provide a method for producing a formed product comprising a fiber-reinforced composite material which is excellent in flame retardancy and chemical resistance and which can be formed into a complicated shape; and a laminated substrate which is used for the production method.A laminated substrate comprising at least one prepreg layer containing a reinforcing fiber sheet and a resin matrix, and at least one polymer layer containing a fluorinated polymer, wherein at least one interface where the prepreg layer and the polymer layer are in contact with each other is present, and adhesive functional groups are present in the surface of the polymer layer at the interface; and a method for producing a formed product, which comprises forming the above laminated substrate with heating.

公开(公告)号：US20160078979A1

公开(公告)日：2016-03-17

申请号：US14944657

申请日：2015-11-18

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Yasuhiko MATSUOKA ,  Toru SASAKI ,  Wataru KASAI

IPC: H01B3/30 ,  B32B27/28 ,  H01B13/08 ,  B29C65/00 ,  H01B3/44 ,  B32B27/08 ,  B29C65/02

CPC classification number: H01B3/306 ,  B29C63/0065 ,  B29C63/02 ,  B29C65/022 ,  B29C66/5326 ,  B29K2627/18 ,  B29K2679/08 ,  B29L2009/00 ,  B29L2031/3412 ,  B29L2031/3462 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B2250/24 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/712 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2457/04 ,  B32B2605/18 ,  C08F214/262 ,  C08J5/121 ,  C08J2327/12 ,  C08J2379/08 ,  H01B3/445 ,  H01B13/0891 ,  C08F214/26 ,  C08F216/1408

Abstract: To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

Abstract translation: 为了提供一种绝缘胶带，其中聚酰亚胺膜和氟化树脂膜以优异的粘合性层压，以及一种制造结构的方法，其包括用这种用于覆盖的绝缘带覆盖导体，随后进行热处理。 覆盖用绝缘带包括直接层叠在聚酰亚胺膜的一面或两面的聚酰亚胺膜和氟化树脂膜，其中，氟化树脂膜含有熔点为220〜320℃的氟化共聚物（A） 并且可以熔融模制，并且其具有至少一种选自由含羰基的基团，羟基，环氧基和异氰酸酯基组成的组中的官能团。