公开(公告)号：US20180213637A1

公开(公告)日：2018-07-26

申请号：US15925990

申请日：2018-03-20

Applicant: Asahi Glass Company, Limited

Inventor： Tomoya HOSODA ,  Toru SASAKI ,  Nobutaka KIDERA ,  Tatsuya TERADA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0271 ,  B32B7/02 ,  B32B27/30 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/16 ,  H05K3/0011 ,  H05K3/0014 ,  H05K3/0055 ,  H05K3/422 ,  H05K3/427 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/10098 ,  H05K2203/0789 ,  H05K2203/095

Abstract: To provide a process for producing a wiring substrate with conduction failure in a hole formed in an electrical insulator layer suppressed even without conducting an etching treatment using metal sodium, and with unexpected deformation such as warpage suppressed even when the electrical insulator layer contains no woven fabric or non-woven fabric comprising reinforcing fibers. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, an electrical insulator layer 10 which contains a specific fluororesin layer (A) 16 and a heat resistant resin layer (B) 18, contains no reinforcing fiber to substrate, and has a dielectric constant of from 2.0 to 3.5 and a linear expansion coefficient of from 0 to 35 ppm/° C., and a second conductor layer 14, applying, to an inner wall surface 20a of the hole 20, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer 22 on the inner wall surface 20a of the hole 20.

公开(公告)号：US20170130009A1

公开(公告)日：2017-05-11

申请号：US15414212

申请日：2017-01-24

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Tomoya HOSODA ,  Eiichi NISHI ,  Toru SASAKI ,  Nobutaka KIDERA

IPC: C08J3/12 ,  B32B7/12 ,  B32B5/16 ,  H05K3/00 ,  C08F214/26 ,  H05K1/03 ,  H05K3/06 ,  B32B15/08 ,  C08J5/24

Abstract: To provide a method capable of producing, by means of mechanical pulverization, a resin powder having a high bulk density and an average particle size of at most 50 μm from resin particles containing a fluorocopolymer as the main component and having a melting point of from 260 to 320° C., such as PFA. The method is to obtain a resin powder having an average particle size of from 0.02 to 50 μm by subjecting resin particles (A) having an average particle size of at least 100 μm to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component; and said fluorocopolymer (X1) has a unit (1) based on a monomer containing at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene, and has a melting point of from 260 to 320° C.