Power clamp with correlated electron material device

    公开(公告)号:US10734805B2

    公开(公告)日:2020-08-04

    申请号:US15381393

    申请日:2016-12-16

    Applicant: ARM Limited

    Abstract: A circuit is provided for limiting an applied voltage applied between a power line and an electrical ground. The circuit includes a transistive element connected between the power line and the electrical ground to provide a channel, where current flow through the channel is controlled by a control voltage provided to a control terminal of the transistive element. A first Correlated Electron Material (CEM) device having an impedance state is coupled between the power line and a first node, and a sensing circuit coupled between the first node and the control terminal of the transistive element. The sensing circuit is configured to detect a voltage drop across the CEM device and to provide the control voltage. The channel of the transistive element is opened when the detected voltage drop across the CEM device exceeds a threshold. The CEM device may contain a transition metal oxide (TMO), for example.

    Bismuth-Doped Ferroelectric Devices
    8.
    发明申请

    公开(公告)号:US20200227515A1

    公开(公告)日:2020-07-16

    申请号:US16248496

    申请日:2019-01-15

    Applicant: Arm Limited

    Abstract: Briefly, embodiments of claimed subject matter relate to devices and methods for formation of ferroelectric materials utilizing transition metals, transition metal oxides, post transition metals, and/or post transition metal oxides, which may be doped with bismuth (Bi) in a concentration of between about 0.001% to about 25.0%. Alternatively, a dopant may include bismuth oxide (Bi2O3) or may include bismuth aluminum oxide ((BixAl1−x)2O3). In particular embodiments, such utilization of bismuth and/or related dopants may bring about stabilization of relatively thin ferroelectric devices.

    Method for manufacture of a CEM device

    公开(公告)号:US10580981B1

    公开(公告)日:2020-03-03

    申请号:US16057515

    申请日:2018-08-07

    Applicant: Arm Limited

    Abstract: A method for the manufacture of a correlated electron material device which method comprises forming a conductive substrate and forming a layer of a correlated electron material on the conductive substrate, wherein the forming of the correlated electron material layer comprises: forming a layer of a metal rich transition or other metal compound; and annealing the layer of the metal rich transition or other metal compound in an atmosphere containing a gaseous precursor for an electron-back donating extrinsic ligand capable of occupying an anion vacancy within the transition or other metal compound; wherein the annealing provides that an anion vacancy within the transition or other metal compound is occupied by an electron back-donating extrinsic ligand; and wherein the annealing is carried out at a predetermined temperature and for a predetermined time whereby to activate electron back-donation from a transition or other metal cation to the electron back-donating extrinsic ligand occupying the anion vacancy.

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