公开(公告)号：US12057383B2

公开(公告)日：2024-08-06

申请号：US18148001

申请日：2022-12-29

Applicant: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Rajesh Katkar ,  Gabriel Z. Guevara ,  Javier A. DeLaCruz ,  Shaowu Huang ,  Laura Willis Mirkarimi

IPC: H01L23/498 ,  H01G2/02 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L23/66 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L23/49838 ,  H01G2/02 ,  H01G4/1245 ,  H01G4/228 ,  H01G4/30 ,  H01G4/40 ,  H01L23/48 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5223 ,  H01L24/08 ,  H01L24/32 ,  H05K1/18 ,  H01G4/38 ,  H01L23/49816 ,  H01L23/66 ,  H01L24/05 ,  H01L24/80 ,  H01L2223/6666 ,  H01L2223/6672 ,  H01L2224/03845 ,  H01L2224/05005 ,  H01L2224/05017 ,  H01L2224/05556 ,  H01L2224/05567 ,  H01L2224/05576 ,  H01L2224/05647 ,  H01L2224/05686 ,  H01L2224/0807 ,  H01L2224/08265 ,  H01L2224/16265 ,  H01L2224/32265 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80948 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/185 ,  H05K2201/10015 ,  H01L2224/80203 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05686 ,  H01L2924/05442 ,  H01L2224/80948 ,  H01L2924/00014 ,  H01L2224/05556 ,  H01L2924/00012

Abstract: In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.

公开(公告)号：US20230317591A1

公开(公告)日：2023-10-05

申请号：US18148001

申请日：2022-12-29

Applicant: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

Inventor： Belgacem Haba ,  llyas Mohammed ,  Rajesh Katkar ,  Gabriel Z. Guevara ,  Javier A. DeLaCruz ,  Shaowu Huang ,  Laura Willis Mirkarimi

IPC: H01L23/498 ,  H01L23/00 ,  H01G4/30 ,  H01G4/228 ,  H01G4/12 ,  H01G4/40 ,  H05K1/18 ,  H01L23/48 ,  H01G2/02 ,  H01L23/522

CPC classification number: H01L23/49838 ,  H01L24/08 ,  H01L24/32 ,  H01L23/49827 ,  H01G4/30 ,  H01G4/228 ,  H01G4/1245 ,  H01G4/40 ,  H05K1/18 ,  H01L23/48 ,  H01G2/02 ,  H01L23/5223 ,  H01L23/49822 ,  H05K2201/10015 ,  H01L24/05 ,  H01L23/66

Abstract: In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.