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公开(公告)号：US20240186248A1
公开(公告)日：2024-06-06
申请号：US18523131
申请日：2023-11-29
发明人： Belgacem HABA , Cyprian Emeka UZOH , Rajesh KATKAR
IPC分类号： H01L23/528 , H01L23/00 , H01L23/367 , H01L23/498 , H01L25/065
CPC分类号： H01L23/5286 , H01L23/3672 , H01L23/49816 , H01L23/49822 , H01L24/05 , H01L24/13 , H01L25/0657 , H01L2224/05009 , H01L2224/05025 , H01L2224/13007 , H01L2224/13026 , H01L2225/06513 , H01L2225/06527 , H01L2924/01029 , H01L2924/1427 , H01L2924/1431 , H01L2924/15311
摘要： An assembly may include a reconstituted element having a front surface and a back surface, the reconstituted element comprising: a semiconductor die having a front side and a back side, the semiconductor die including circuitry closer to the front side than to the back side and a via extending from the back side of the semiconductor die to connect to the circuitry, an insulating material disposed along a side surface of the semiconductor die, a power rail extending from the front surface to the back surface of the reconstituted element and configured to deliver power to the semiconductor die; and an interconnect structure configured to electrically connect the power rail to the via and to deliver power to the semiconductor die from the back side of the semiconductor die.
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公开(公告)号：US20240332267A1
公开(公告)日：2024-10-03
申请号：US18617086
申请日：2024-03-26
发明人： Belgacem HABA , Cyprian Emeka UZOH , Rajesh KATKAR
IPC分类号： H01L25/10 , H01L21/48 , H01L23/00 , H01L23/48 , H01L23/498 , H01L23/528
CPC分类号： H01L25/105 , H01L21/4857 , H01L23/481 , H01L23/49838 , H01L23/5286 , H01L24/08 , H01L2224/08145 , H01L2224/08225
摘要： In some embodiments, a structure comprises an active element having a frontside and a backside opposite the frontside, the active element having active circuitry nearer the frontside than the backside and a power redistribution element having a frontside hybrid bonded to the backside of the active element, the power redistribution element comprising a first plurality of contact pads on the frontside of the power redistribution element and a second plurality of contact pads on a backside of the power redistribution element opposite the frontside of the power redistribution element, a pitch of the first plurality of contact pads is smaller than a pitch of the second plurality of contact pads, the power redistribution element configured to supply at least one of power and ground to the active element.
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公开(公告)号：US20240298454A1
公开(公告)日：2024-09-05
申请号：US18590388
申请日：2024-02-28
发明人： Belgacem HABA
IPC分类号： H10B80/00 , H01L23/00 , H01L25/00 , H01L25/065 , H01L25/18
CPC分类号： H10B80/00 , H01L24/08 , H01L24/80 , H01L25/0652 , H01L25/18 , H01L25/50 , H01L2224/08145 , H01L2224/80895 , H01L2224/80896 , H01L2225/06562 , H01L2225/06582 , H01L2924/1431 , H01L2924/1436
摘要： A bonded structure is disclosed. The bonded structure can include a carrier. The bonded structure can include a first memory unit disposed on the carrier having a first memory channel and a first plurality of memory dies directly hybrid bonded to one another. The bonded structure can also include a second memory unit having a second memory channel different from the first memory channel and a second plurality of memory dies directly hybrid bonded to one another. The second memory unit can be stacked on top of the first memory unit. The bonded structure can include a serializer-deserializer disposed in or on the carrier and electrically connected to the first and second memory channels of the first and second memory units. The serializer-deserializer can have an external channel configured to electrically connect the bonded structure to a processor.
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公开(公告)号：US20240266255A1
公开(公告)日：2024-08-08
申请号：US18398984
申请日：2023-12-28
IPC分类号： H01L23/473 , H01L21/48 , H01L23/00
CPC分类号： H01L23/4735 , H01L21/4871 , H01L24/08 , H01L24/80 , H01L2224/08221 , H01L2224/80896
摘要： A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid communication with the inlet and outlet, forming a plurality of nozzles on the first side of a second substrate, and forming a plurality of channels on the second side of the second substrate opposite the first side of the second substrate. The plurality of channels is aligned with the plurality of nozzles, and the second side of the first substrate is bonded to the first side of the second substrate.
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公开(公告)号：US20230245950A1
公开(公告)日：2023-08-03
申请号：US18160979
申请日：2023-01-27
发明人： Belgacem HABA , Patrick VARIOT , Rajesh KATKAR , Hong SHEN
IPC分类号： H01L23/44 , F28F13/12 , H10B80/00 , H01L23/38 , H01L25/065 , H01L23/00 , H01L23/467
CPC分类号： H01L23/44 , F28F13/12 , H10B80/00 , H01L23/38 , H01L25/0655 , H01L24/05 , H01L24/08 , H01L23/467 , H01L2224/08225 , H01L2224/05647
摘要： An integrated device package is disclosed. The integrated device package can include a carrier, and a cap bonded to the carrier. The carrier and the cap at least partially define a cavity that is configured to receive a coolant. The integrated device package can include an inorganic material layer disposed at least on a portion of the carrier. At least a portion of the inorganic material layer is exposed to the cavity and configured to contact the coolant. The cap can be directly bonded to the carrier without an intervening adhesive. The integrated device package can include an integrated device die that is disposed in the cavity and bonded to the carrier. The integrated device die can be directly bonded to the carrier without an intervening adhesive.
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