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公开(公告)号：US11905438B2
公开(公告)日：2024-02-20
申请号：US17252348
申请日：2019-06-20
发明人： Niklas M. Matzeit , Pierre R. Bieber , Petra M Stegmaier , Eike H. Klünker , Dmitri D. Iarikov , Jeffrey M. Imsande , Shijing Cheng , Michele A. Craton , George J. Clements
IPC分类号： C09J133/08 , C08J3/24 , C09J7/38 , B29C48/08 , B29C48/285 , B29C48/40 , C08J3/00 , C08F220/18 , B29K33/04 , C08K3/011 , C08K5/00
CPC分类号： C09J133/08 , B29C48/08 , B29C48/288 , B29C48/40 , C08F220/1808 , C08J3/005 , C08J3/247 , C09J7/385 , B29K2033/04 , C08F2810/20 , C08J3/24 , C08J2333/08 , C08K3/011 , C08K5/0025 , C09J2203/326 , C09J2203/354 , C09J2301/304 , C09J2301/50 , C08F220/1808 , C08F220/06
摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; −57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.
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2.发明公开公开(公告)号：US20230407148A1
公开(公告)日：2023-12-21
申请号：US18252198
申请日：2022-02-03
发明人： Boris Tasch , Adrian Thomas Jung , Elisabeth Cura , Eike H. Klünker , Wolf Steiger , Peter Bissinger
IPC分类号： C09J129/10 , C09J11/06
CPC分类号： C09J129/10 , C09J2301/50 , C09J2301/416 , C09J11/06
摘要： According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound; wherein the free-radical polymerization initiator is activated by visible light.
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公开(公告)号：US20210130661A1
公开(公告)日：2021-05-06
申请号：US16471595
申请日：2017-12-20
发明人： John W. McAllister , Jingjing Ma , Zhong Chen , Pierre R. Bieber , Petra M. Stegmaier , Eike H. Klünker
摘要： The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.
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公开(公告)号：US20210395579A9
公开(公告)日：2021-12-23
申请号：US17252348
申请日：2019-06-20
发明人： Niklas M. Matzeit , Pierre R. Bieber , Petra M Stegmaier , Eike H. Klünker , Dmitri D. Iarikov , Jeffrey M. Imsande , Shijing Cheng , Michele A. Craton , George J. Clements
IPC分类号： C09J133/08 , C08J3/00 , C08J3/24 , C09J7/38 , B29C48/40 , B29C48/285 , B29C48/08
摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; -57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.
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公开(公告)号：US20210269684A1
公开(公告)日：2021-09-02
申请号：US17252348
申请日：2019-06-20
发明人： Niklas M. Matzeit , Pierre R. Bieber , Petra M Stegmaier , Eike H. Klünker , Dmitri D. Iarikov , Jeffrey M. Imsande , Shijing Cheng , Michele A. Craton , George J. Clements
IPC分类号： C09J133/08 , C08J3/00 , C08J3/24 , C09J7/38 , B29C48/40 , B29C48/285 , B29C48/08
摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; -57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.
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公开(公告)号：US20190211233A1
公开(公告)日：2019-07-11
申请号：US16099313
申请日：2017-04-28
发明人： Pierre R. Bieber , Petra M. Stegmaier , Niklas M. Matzeit , Janina R. Overbeck , Siegfried R. Goeb , Joern Buettner , Claudia Parys , Eike H. Klünker , Andrew Satrijo , Nelson Goncalves Pimentel , Christiane Strerath
IPC分类号： C09J7/38 , C09J153/02
CPC分类号： C09J7/383 , C08L23/22 , C08L53/02 , C08L71/12 , C08L91/00 , C08L2205/02 , C09J153/02 , C09J153/025 , C09J2205/11 , C09J2205/31
摘要： The present disclosure relates to a pressure sensitive adhesive comprising: a) a multi-arm block copolymer of the formula Qn-Y, wherein: (i) Q represents an arm of the multi-arm block copolymer and each arm independently has the formula G-R, (ii) n represents the number of arms and is a whole number of at least 3, and (iii) Y is the residue of a multifunctional coupling agent, wherein each R is a rubbery block comprising a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or combinations thereof; and each G is a glassy block comprising a polymerized monovinyl aromatic monomer; b) a polymeric plasticizer having a weight average molecular weight Mw comprised between 10.000 and 100.000 g/mol; c) at least one hydrocarbon tackifier which is primarily compatible with the rubbery blocks; d) a glassy block compatible aromatic resin having a softening point value (RBSP) of at least 150 C, when measured by the ring and ball test method described in the experimental section; and e) optionally, a linear block copolymer of the formula L-(G)m, wherein L is a rubbery block comprising a polymerized olefin, a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or any combinations thereof; and wherein m is 1 or 2. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive and uses thereof.
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公开(公告)号：US20230235204A1
公开(公告)日：2023-07-27
申请号：US17927325
申请日：2021-05-21
发明人： Adrian T. Jung , Boris Ove Alexander Tasch , Elisabeth Cura , Eike H. Klünker , Peter Bissinger , Wolf Steiger , Dirk Hasenberg
IPC分类号： C09J163/00
CPC分类号： C09J163/00
摘要： The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.
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公开(公告)号：US11286407B2
公开(公告)日：2022-03-29
申请号：US16471595
申请日：2017-12-20
发明人： John W. McAllister , Jingjing Ma , Zhong Chen , Pierre R. Bieber , Petra M. Stegmaier , Eike H. Klünker
摘要： The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.
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9.发明申请公开(公告)号：US20210324247A1
公开(公告)日：2021-10-21
申请号：US17247194
申请日：2019-06-20
IPC分类号： C09J133/08
摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus; b) providing a hot melt processable pressure sensitive adhesive composition contained within a packaging material and forming a packaged pressure sensitive adhesive composition; c) providing a thermal crosslinking system; d) mixing the hot melt processable pressure sensitive adhesive composition and the thermal crosslinking system in the hot melt mixing apparatus thereby forming a hot melt blend, wherein the packaging material is melted and mixable with the hot melt blend; e) removing the hot melt blend from the hot melt mixing apparatus; and f) optionally, thermally crosslinking the hot melt blend. In another aspect, the present disclosure relates to a pressure sensitive adhesive comprising a hot melt processable pressure sensitive adhesive composition and a thermal crosslinking system as described above, and wherein the pressure sensitive adhesive has a Volatile Organic Compound (VOC) value of less than 1500 ppm, less than 1200 ppm, less than 1000 ppm, less than 800 ppm, less than 600 ppm, less than 500 ppm, less than 400 ppm, or even less than 300 ppm, when measured by thermal desorption analysis according to test method VDA278.
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