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1.发明公开公开(公告)号：US20230407148A1
公开(公告)日：2023-12-21
申请号：US18252198
申请日：2022-02-03
发明人： Boris Tasch , Adrian Thomas Jung , Elisabeth Cura , Eike H. Klünker , Wolf Steiger , Peter Bissinger
IPC分类号： C09J129/10 , C09J11/06
CPC分类号： C09J129/10 , C09J2301/50 , C09J2301/416 , C09J11/06
摘要： According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound; wherein the free-radical polymerization initiator is activated by visible light.
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公开(公告)号：US20210222034A1
公开(公告)日：2021-07-22
申请号：US17251434
申请日：2019-06-28
IPC分类号： C09J7/40
摘要： An adhesive film liner comprising (a) a polymeric layer having a first and a second surface, the second surface being opposed to the first surface; (b) a first release layer located on top of the first surface of the polymeric layer, the first release layer comprising at least one polyurethane acrylate oligomer and/or at least one polyurethane methacrylate oligomer; and (c) a second release layer located on top of the second surface layer of the polymeric layer, the second release layer comprising at least one acrylate polymer.
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公开(公告)号：US20180273811A1
公开(公告)日：2018-09-27
申请号：US15775178
申请日：2016-11-17
发明人： Elisabeth Cura , Sohaib Elgimiabi
IPC分类号： C09J11/04 , C09J163/00 , C09J5/06 , C09J7/35
CPC分类号： C09J11/04 , C08G2650/56 , C08K3/04 , C08K7/00 , C08L71/00 , C09J5/06 , C09J7/35 , C09J163/00 , C09J2205/102 , C09J2463/00
摘要： The present disclosure provides a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; non-spherical particles. This composition can be useful for applications, for example, in the form of an adhesive film. Such applications can include bonding of parts (e.g., metal parts), especially those where bonding on an industrial scale is required. The structural adhesive composition may exhibit any one or more of advantageous adhesive strength, a certain resistance to corrosion, as well as a favourable cohesive failure mode.
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公开(公告)号：US20180282592A1
公开(公告)日：2018-10-04
申请号：US15775190
申请日：2016-11-14
发明人： Elisabeth Cura , Sohaib Elgimiabi
IPC分类号： C09J11/04 , C09J163/00 , C09J11/08 , C09J9/00 , C09J7/10
摘要： The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.
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公开(公告)号：US20180272646A1
公开(公告)日：2018-09-27
申请号：US15774621
申请日：2016-11-14
CPC分类号： B32B3/04 , B32B1/00 , B32B3/00 , B32B3/02 , B32B3/06 , B32B3/26 , B32B3/30 , B32B5/00 , B32B5/02 , B32B5/022 , B32B5/024 , B32B5/026 , B32B7/00 , B32B7/02 , B32B7/04 , B32B7/10 , B32B7/12 , B32B15/00 , B32B15/04 , B32B15/08 , B32B15/092 , B32B15/14 , B32B27/00 , B32B27/06 , B32B27/12 , B32B27/18 , B32B27/26 , B32B27/30 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/1207 , B32B38/0012 , B32B2250/00 , B32B2262/00 , B32B2262/0261 , B32B2262/0276 , B32B2262/062 , B32B2262/101 , B32B2262/106 , B32B2307/40 , B32B2307/546 , B32B2307/724 , B32B2307/726 , B32B2307/734 , B32B2363/00 , B32B2367/00 , B32B2405/00 , B32B2419/00 , B32B2605/00 , B32B2605/003 , B32B2605/08 , B32B2607/00
摘要： The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.
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6.发明申请ROLL OF AN ADHESIVE TAPE HAVING AN ADHESIVE LAYER COMPRISING A STRUCTURAL ADHESIVE AND ITS METHOD OF MANUFACTURE 审中-公开具有包含结构粘合剂的粘合层的粘合带的卷取及其制造方法公开(公告)号：US20160108290A1
公开(公告)日：2016-04-21
申请号：US14895327
申请日：2014-06-10
IPC分类号： C09J7/02
摘要： A roll of a double-sided adhesive tape wound around a core, with the tape (10) comprising first (5) and second major adhesive surfaces (4) and at least one adhesive layer comprising a structural adhesive (3) providing the second major adhesive surface (4). The first major adhesive surface (5) is protected by a first liner (1); the second major adhesive surface (4) is protected by a second liner (2), and the second liner (2) extends over the two edges (8, 9) of the second major surface to cover at least part of each first (5) and second minor surfaces (6, 7) of the tape (10).
摘要翻译： 一卷卷绕在芯上的双面胶带，其中带（10）包括第一（5）和第二主要粘合表面（4），以及至少一个粘合剂层，包括提供第二主要部分的结构粘合剂（3） 粘合剂表面（4）。 第一主粘合剂表面（5）由第一衬垫（1）保护; 第二主粘合剂表面（4）由第二衬垫（2）保护，并且第二衬垫（2）在第二主表面的两个边缘（8,9）上延伸以覆盖每个第一（5）的至少一部分 ）和带（10）的第二小表面（6,7）。
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公开(公告)号：US20150240136A1
公开(公告)日：2015-08-27
申请号：US14422876
申请日：2013-08-22
IPC分类号： C09J163/00 , B32B37/12 , C09J7/00 , B32B15/092 , B32B7/12
CPC分类号： C09J163/00 , B21D39/028 , B32B7/12 , B32B15/092 , B32B37/1207 , B32B2250/03 , B32B2605/003 , C08K3/36 , C08K5/0025 , C08K7/22 , C09J5/06 , C09J7/00 , C09J7/10 , C09J2201/61 , C09J2201/622 , C09J2400/163 , C09J2463/00 , Y10T403/477 , Y10T428/31522
摘要： This present disclosure relates to a structural adhesive film suitable for bonding a first metal part and a second part, and in particular for hem flange bonding of a first metal part and second part. More specifically, the present disclosure is directed to a structural adhesive film comprising a thermosettable composition which comprises an epoxy compound having a selected average epoxy equivalent weight, a thermoplastic resin having a selected softening point, and an epoxy curing agent. The present disclosure further relates to a thermoset structural adhesive film obtainable by thermosetting of the structural adhesive film of the disclosure, and to a two-part assembly comprising such a thermoset structural adhesive film In another aspect, the present disclosure is directed to a method for bonding a first metal part and a second part, in particular for hem flange bonding of a first metal part and second part.
摘要翻译： 本公开涉及适用于粘合第一金属部件和第二部件的结构粘合剂膜，特别是涉及第一金属部件和第二部件的下凸缘接合。 更具体地，本公开涉及包含可热固组合物的结构粘合剂膜，其包含具有选择的平均环氧当量的环氧化合物，具有选择的软化点的热塑性树脂和环氧固化剂。 本公开还涉及通过本发明的结构粘合剂膜的热固化获得的热固性结构粘合剂膜和包含这种热固性结构粘合剂膜的两部分组合。在另一方面，本公开涉及一种用于 接合第一金属部分和第二部分，特别是用于第一金属部分和第二部分的下摆法兰接合。
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公开(公告)号：US11879078B2
公开(公告)日：2024-01-23
申请号：US17281104
申请日：2019-10-03
发明人： Adrian T. Jung , Boris Tasch , Dirk Hasenberg , Olaf Ludewig , Elisabeth Cura
CPC分类号： C09J5/06 , C08G59/50 , C08G65/20 , C08G65/33317 , C08K5/0025 , C09J9/00
摘要： The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.
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公开(公告)号：US20220177749A1
公开(公告)日：2022-06-09
申请号：US17441319
申请日：2020-03-26
发明人： Elisabeth Cura , Boris Tasch , Adrian Jung
IPC分类号： C09J163/00 , C08G59/68
摘要： The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.
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公开(公告)号：US20230235204A1
公开(公告)日：2023-07-27
申请号：US17927325
申请日：2021-05-21
发明人： Adrian T. Jung , Boris Ove Alexander Tasch , Elisabeth Cura , Eike H. Klünker , Peter Bissinger , Wolf Steiger , Dirk Hasenberg
IPC分类号： C09J163/00
CPC分类号： C09J163/00
摘要： The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.
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