公开(公告)号：US20240360343A1

公开(公告)日：2024-10-31

申请号：US18643234

申请日：2024-04-23

申请人： tesa SE

发明人： Stefan Kramp ,  Michael Egger

IPC分类号： C09J7/38 ,  C09J7/26 ,  C09J11/08 ,  C09J133/10

CPC分类号： C09J7/385 ,  C09J7/26 ,  C09J11/08 ,  C09J133/10 ,  C09J2301/1242 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2301/416 ,  C09J2301/50 ,  C09J2423/00 ,  C09J2433/00

摘要： A reactive pressure-sensitive adhesive element that includes: i) a carrier layer; ii) a first adhesive layer arranged on a first surface of the carrier layer that comprises a first UV-curable pressure-sensitive adhesive; and iii) a second adhesive layer arranged on a second surface of the carrier layer facing away from the first surface, wherein the second adhesive layer comprises a second UV-curable pressure-sensitive adhesive. Each of the first and second UV-curable pressure-sensitive adhesives, based on a mass of the respective pressure-sensitive adhesive, comprises: x) one or more poly (meth) acrylate compounds in a combined mass fraction from 35% to 85%; y) one or more polymerizable epoxy compounds in a combined mass fraction from 10% to 50%; and z) one or more photoinitiators in a combined mass fraction from 0.1% to 5%. Further, the carrier layer comprises a foam carrier, the foam carrier comprising one or more polyolefins.

公开(公告)号：US20240343948A1

公开(公告)日：2024-10-17

申请号：US18694926

申请日：2022-09-27

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Jian Li ,  Prince P. Antony

IPC分类号： C09J7/38 ,  C09J5/06

CPC分类号： C09J7/383 ,  C09J5/06 ,  C09J2301/302 ,  C09J2301/408 ,  C09J2301/50 ,  C09J2400/283

摘要： The tape includes a backing and a pressure-sensitive adhesive applied from an aqueous dispersion on the backing. The pressure-sensitive adhesive includes an at least partially crosslinked elastomer, a tackifying resin, and sulfur. A process for making the tape includes applying an aqueous dispersion of an elastomer, the tackifying resin, and the sulfur to the backing and drying the aqueous dispersion to provide the pressure-sensitive adhesive on the backing. A process of using the tape includes applying the tape to a surface and exposing the surface to a temperature of at least 150° C.

公开(公告)号：US20240324075A1

公开(公告)日：2024-09-26

申请号：US18126148

申请日：2023-03-24

申请人： Nemo Power Tools Ltd.

发明人： Nimrod Rotem

IPC分类号： H05B6/10 ,  C09J7/35

CPC分类号： H05B6/10 ,  C09J7/35 ,  C09J2301/204 ,  C09J2301/304 ,  C09J2301/314 ,  C09J2301/408 ,  C09J2301/50

摘要： An inductive gluing sheet is utilized in an induction-assisted adhesive activation method in which the inductive gluing sheet includes a heat-activated adhesive substrate and a conductive substrate embedded therein. When a magnetic field is applied to the conductive substrate through a first surface or a second surface covering the inductive gluing sheet, an electric current is induced in the conductive substrate. The heat created by the electric current transfers to the heat-activated adhesive substrate via conduction and activates the heat-activated adhesive substrate. This allows for direct heating of an adhesive layer through one or more objects and even allows for reversibility of the adhesion setting process.

公开(公告)号：US20240274460A1

公开(公告)日：2024-08-15

申请号：US18564794

申请日：2022-05-27

申请人： MITSUI CHEMICALS TOHCELLO, INC.

发明人： Hiroto YASUI ,  Hiroyoshi KURIHARA ,  Jin KINOSHITA

IPC分类号： H01L21/683 ,  C09J7/22 ,  C09J133/10 ,  H01L21/304

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J133/10 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/416 ,  C09J2301/50 ,  H01L21/304 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

摘要： A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at −15° C. is defined as E′ (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured, E′ (100° C.) is 1.0×106 to 3.5×107 Pa, and E′) (100° C./E′ (−15° C.) is 2.0×10−3 to 1.5×10−2.

公开(公告)号：US20240199926A1

公开(公告)日：2024-06-20

申请号：US18354989

申请日：2023-07-19

申请人： SK Innovation Co., Ltd. ,  SK Geo Centric Co., Ltd.

发明人： Bu Yeon Hwang ,  Sang Ha Son ,  Dong Hyun Woo ,  Ji Hyeon Choi

IPC分类号： C09J123/08 ,  C09J201/00

CPC分类号： C09J123/0869 ,  C09J201/00 ,  C09J2301/312 ,  C09J2301/50

摘要： Provided is an adhesive composition including an ethylene-acrylic acid copolymer and a post-consumer recycled resin (PCR), wherein the ethylene-acrylic acid copolymer has a melt index (190° C., 2.16 kg, ASTM D1238) of 1 to 30 g/10 min, and the PCR has a melt index (190° C., 2.16 kg, ASTM D1238) of 1 to 10 g/10 min, and a preparation method thereof, which can have excellent processability, low gel content, and excellent adhesive strength by easily distinguishing a certain level of PCR resin by a capillary rheometer and mixing the PCR resin with an ethylene-acrylic acid copolymer.

公开(公告)号：US20240141212A1

公开(公告)日：2024-05-02

申请号：US18051756

申请日：2022-11-01

申请人： II-VI Delaware, Inc.

发明人： Sam Salamone ,  Sean McAnany ,  Glenn Evans

IPC分类号： C09J11/04 ,  C09J5/06 ,  C09J163/00

CPC分类号： C09J11/04 ,  C09J5/06 ,  C09J163/00 ,  C09J2301/408 ,  C09J2301/50

摘要： An epoxy-based glue includes an epoxy material, and a solids component including diamond powder and silicon-carbide particles. The adhesive material may be used to form reaction-bonded silicon-carbide bonding reaction-bonded silicon-carbide parts together. The present disclosure also relates to a method of assembling a product from preforms, including locating an adhesive layer, containing diamond powder, between opposed preform surfaces, carbonizing the layer, and infiltrating molten silicon into the preforms and the carbonized layer to convert the preforms into corresponding reaction-bonded silicon-carbide parts, and to convert the carbonized layer into a reaction-bonded silicon-carbide bonding region with a reduced amount of residual silicon. An assembled product, including at least two reaction-bonded silicon-carbide parts bonded together by processing a diamond-containing adhesive, is also disclosed.

公开(公告)号：US20240117223A1

公开(公告)日：2024-04-11

申请号：US18275940

申请日：2022-02-07

申请人： tesa SE

发明人： Judith GRUENAUER ,  Thilo DOLLASE ,  Bernd LUEHMANN ,  Jessika GARGIULO

IPC分类号： C09J7/38 ,  C09J7/26 ,  C09J11/08 ,  C09J153/02

CPC分类号： C09J7/387 ,  C09J7/26 ,  C09J11/08 ,  C09J153/02 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/50

摘要： The invention relates to polyvinal aromate-polydiene-block copolymer-based adhesive compounds that contain at least one type of a cationically curable reactive resin and that result, when cured, in improved thermal shear strength. The invention further relates to adhesive strips that contain at least one layer of such an adhesive compound, and a method of production.

公开(公告)号：US11905438B2

公开(公告)日：2024-02-20

申请号：US17252348

申请日：2019-06-20

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Niklas M. Matzeit ,  Pierre R. Bieber ,  Petra M Stegmaier ,  Eike H. Klünker ,  Dmitri D. Iarikov ,  Jeffrey M. Imsande ,  Shijing Cheng ,  Michele A. Craton ,  George J. Clements

IPC分类号： C09J133/08 ,  C08J3/24 ,  C09J7/38 ,  B29C48/08 ,  B29C48/285 ,  B29C48/40 ,  C08J3/00 ,  C08F220/18 ,  B29K33/04 ,  C08K3/011 ,  C08K5/00

CPC分类号： C09J133/08 ,  B29C48/08 ,  B29C48/288 ,  B29C48/40 ,  C08F220/1808 ,  C08J3/005 ,  C08J3/247 ,  C09J7/385 ,  B29K2033/04 ,  C08F2810/20 ,  C08J3/24 ,  C08J2333/08 ,  C08K3/011 ,  C08K5/0025 ,  C09J2203/326 ,  C09J2203/354 ,  C09J2301/304 ,  C09J2301/50 ,  C08F220/1808 ,  C08F220/06

摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; −57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.

公开(公告)号：US20240052213A1

公开(公告)日：2024-02-15

申请号：US18546658

申请日：2022-02-14

申请人： THE SCHOOL CORPORATION KANSAI UNIVERSITY ,  OSAKA SODA CO., LTD.

发明人： Hideya KAWASAKI ,  Suguru HASHIDATE ,  Ryo KATOU ,  Takamichi MORI ,  Junichiro MINAMI

IPC分类号： C09J9/02 ,  C09J11/04 ,  C09J163/00

CPC分类号： C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J2301/50

摘要： Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1).
[In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.]

公开(公告)号：US20230407149A1

公开(公告)日：2023-12-21

申请号：US18035910

申请日：2021-10-20

申请人： Denka Company Limited

发明人： Chie NAKAMURA ,  Tomoaki TANAKA ,  Sota TOKUI ,  Mizuki HASUMI

IPC分类号： C09J133/10 ,  C09J11/06 ,  C09J7/38

CPC分类号： C09J133/10 ,  C09J11/06 ,  C09J7/385 ,  C09J2301/416 ,  C09J2301/312 ,  C09J2203/326 ,  C09J2301/50

摘要： Provided is an adhesive tape having a base material layer and an adhesive layer disposed on the base material layer, wherein the adhesive layer contains a radical photoinitiator and polymer A having polymerizable carbon double bonds, a tensile modulus of elasticity of the adhesive layer after ultraviolet irradiation is 400 MPa or less, and an elongation at break of the adhesive layer after ultraviolet irradiation is 16% or more.