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公开(公告)号：US11905438B2
公开(公告)日：2024-02-20
申请号：US17252348
申请日：2019-06-20
发明人： Niklas M. Matzeit , Pierre R. Bieber , Petra M Stegmaier , Eike H. Klünker , Dmitri D. Iarikov , Jeffrey M. Imsande , Shijing Cheng , Michele A. Craton , George J. Clements
IPC分类号： C09J133/08 , C08J3/24 , C09J7/38 , B29C48/08 , B29C48/285 , B29C48/40 , C08J3/00 , C08F220/18 , B29K33/04 , C08K3/011 , C08K5/00
CPC分类号： C09J133/08 , B29C48/08 , B29C48/288 , B29C48/40 , C08F220/1808 , C08J3/005 , C08J3/247 , C09J7/385 , B29K2033/04 , C08F2810/20 , C08J3/24 , C08J2333/08 , C08K3/011 , C08K5/0025 , C09J2203/326 , C09J2203/354 , C09J2301/304 , C09J2301/50 , C08F220/1808 , C08F220/06
摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; −57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.
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公开(公告)号：US20210395579A9
公开(公告)日：2021-12-23
申请号：US17252348
申请日：2019-06-20
发明人： Niklas M. Matzeit , Pierre R. Bieber , Petra M Stegmaier , Eike H. Klünker , Dmitri D. Iarikov , Jeffrey M. Imsande , Shijing Cheng , Michele A. Craton , George J. Clements
IPC分类号： C09J133/08 , C08J3/00 , C08J3/24 , C09J7/38 , B29C48/40 , B29C48/285 , B29C48/08
摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; -57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.
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公开(公告)号：US20210269684A1
公开(公告)日：2021-09-02
申请号：US17252348
申请日：2019-06-20
发明人： Niklas M. Matzeit , Pierre R. Bieber , Petra M Stegmaier , Eike H. Klünker , Dmitri D. Iarikov , Jeffrey M. Imsande , Shijing Cheng , Michele A. Craton , George J. Clements
IPC分类号： C09J133/08 , C08J3/00 , C08J3/24 , C09J7/38 , B29C48/40 , B29C48/285 , B29C48/08
摘要： The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; -57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.
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