公开(公告)号：US09097833B2

公开(公告)日：2015-08-04

申请号：US13373095

申请日：2011-11-04

Applicant: Yoshinobu Suehiro ,  Koji Tasumi ,  Osamu Ito

Inventor： Yoshinobu Suehiro ,  Koji Tasumi ,  Osamu Ito

IPC: F21V3/00 ,  F21V8/00 ,  F21V29/76 ,  F21Y103/00

CPC classification number: G02B6/0085 ,  F21V29/76 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0021 ,  G02B6/0031 ,  G02B6/0078 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting device includes a light source including an inorganic material substrate, a light emitting element mounted on a mounting surface of the inorganic material substrate, and a metalized pattern formed on a non-mounting surface of the inorganic material substrate on which the light emitting element is not mounted, a mounting substrate including an mounting surface on which the light source is mounted, and a conductor pattern formed on the mounting surface and bonded to the metalized pattern, and an optical member disposed on the mounting surface of the mounting substrate so as to guide a light emitted from the light source in a predetermined direction. The optical member includes a heat absorbing surface at least a part of which faces the conductor pattern of the mounting substrate, and a heat radiating surface that radiates heat of the light source conducted from the conductor pattern via the heat absorbing surface.

Abstract translation: 发光装置包括：光源，其包括无机材料基板，安装在无机材料基板的安装面上的发光元件和形成在无机材料基板的非安装面上的金属化图案， 元件没有安装，安装基板包括其上安装有光源的安装表面和形成在安装表面上并结合到金属化图案的导体图案，以及设置在安装基板的安装表面上的光学构件， 以引导从光源发射的光沿预定方向。 光学构件包括至少一部分面向安装基板的导体图案的吸热表面，以及散热表面，其辐射从导体图案经由吸热表面传导的光源的热量。

公开(公告)号：US08523626B2

公开(公告)日：2013-09-03

申请号：US11898364

申请日：2007-09-11

Applicant: Yoshinobu Suehiro

Inventor： Yoshinobu Suehiro

IPC: H01J9/24 ,  H01J61/60

CPC classification number: H01L33/501 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/40 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A light emitting device has a light emitting element, a mounting portion and a sealing part. On the mounting portion, the light emitting element is mounted and a circuit pattern is formed to supply power to the light emitting element. The sealing part is formed on the mounting portion, sealing the light emitting element, and formed of a glass and a phosphor uniformly dispersed in the glass. The phosphor is adapted to emit a wavelength-converted light by being excited by a light emitted from the light emitting element.

Abstract translation: 发光装置具有发光元件，安装部和密封部。 在安装部分上，安装发光元件，并且形成电路图案以向发光元件供电。 密封部分形成在安装部分上，密封发光元件，并由玻璃和均匀分散在玻璃中的荧光体形成。 磷光体适于通过被从发光元件发射的光激发而发射波长转换的光。

公开(公告)号：US08309969B2

公开(公告)日：2012-11-13

申请号：US12623135

申请日：2009-11-20

Applicant: Yoshinobu Suehiro ,  Koji Tasumi

Inventor： Yoshinobu Suehiro ,  Koji Tasumi

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00

CPC classification number: H05K1/021 ,  F21K9/00 ,  F21K9/232 ,  F21K9/90 ,  F21V5/043 ,  F21V7/005 ,  F21V29/505 ,  F21V29/70 ,  F21V29/75 ,  F21V29/763 ,  F21V29/767 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0085 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/09701 ,  H05K3/341 ,  H05K2201/0347 ,  H05K2201/0373 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014

Abstract: A light emitting device includes a light-emitting portion including a metal part including a metal able to be bonded to a solder material, and a heat dissipation member that includes aluminum, aluminum alloy, magnesium or magnesium alloy and a bonding portion processed to be bonded to the solder material. The metal part of the light-emitting portion is bonded via the solder material to the bonding portion of the heat dissipation member. The solder material includes a material unable to be directly bonded to the heat dissipation member, the metal part of the light-emitting portion is formed by metalizing an insulation of ceramic or semiconductor, and the bonding portion includes a thermal expansion coefficient between that of the heat dissipation member and that of the insulation.

Abstract translation: 发光装置包括：发光部，其包括具有能够与焊料接合的金属的金属部，以及包含铝，铝合金，镁或镁合金的散热构件和加工成粘合的接合部 焊接材料。 发光部的金属部通过焊料粘合到散热部件的接合部。 焊料材料包括不能直接接合到散热构件的材料，发光部分的金属部分通过金属化陶瓷或半导体的绝缘体而形成，并且接合部分包括热膨胀系数 散热构件和隔热构件。

公开(公告)号：US08294160B2

公开(公告)日：2012-10-23

申请号：US12929331

申请日：2011-01-14

Applicant: Yoshinobu Suehiro ,  Seiji Yamaguchi

Inventor： Yoshinobu Suehiro ,  Seiji Yamaguchi

IPC: H01L27/15

CPC classification number: H01L33/56 ,  F21K9/00 ,  H01L24/97 ,  H01L33/44 ,  H01L33/486 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of making a light emitting device, includes a mounting and a light emitting element on a substrate; hot-pressing a glass material on the light emitting element to form a glass sealing portion for sealing the light emitting element; and forming a phosphor layer on a surface of the glass sealing portion.

Abstract translation: 一种制造发光器件的方法，在衬底上包括安装件和发光元件; 在发光元件上热压玻璃材料，形成用于密封发光元件的玻璃密封部分; 以及在所述玻璃密封部的表面上形成荧光体层。

公开(公告)号：US20120171789A1

公开(公告)日：2012-07-05

申请号：US13419093

申请日：2012-03-13

Applicant: Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

Inventor： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC: H01L33/52 ,  H01L33/64

CPC classification number: H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Abstract translation: 一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子 并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。

公开(公告)号：US08154047B2

公开(公告)日：2012-04-10

申请号：US12923788

申请日：2010-10-07

Applicant: Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

Inventor： Yoshinobu Suehiro ,  Mitsuhiro Inoue ,  Hideaki Kato ,  Kunihiro Hadame ,  Ryoichi Tohmon ,  Satoshi Wada ,  Koichi Ota ,  Kazuya Aida ,  Hiroki Watanabe ,  Yoshinori Yamamoto ,  Masaaki Ohtsuka ,  Naruhito Sawanobori

IPC: H01L33/56

CPC classification number: H01L33/56 ,  C03B23/20 ,  C03C8/24 ,  C03C27/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

Abstract translation: 固体元件装置包括固体元件，用于从固体元件接收电力并向其提供电力的电力接收和供应部件，以及用于密封固体元件的无机密封材料。 无机密封材料包括选自SiO 2-Nb 2 O 5系，B 2 O 3 -F系，P 2 O 5 -F系，P 2 O 5·ZnO系，SiO2-B2O3-La2O3系，SiO2-B2O3系低 熔化眼镜。

公开(公告)号：US08129743B2

公开(公告)日：2012-03-06

申请号：US12222183

申请日：2008-08-04

Applicant: Yoshinobu Suehiro ,  Shigeo Takaya

Inventor： Yoshinobu Suehiro ,  Shigeo Takaya

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/387 ,  H01L33/44 ,  H01L33/54 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2924/00014

Abstract: A light emitting device includes a light emitting element, an element mounting board including a wiring layer on an element mounting surface thereof, and a sealing portion that seals the light emitting element. The light emitting element includes a contact electrode including a transparent conductive film, a transparent dielectric layer formed on a surface of the contact electrode and including a refractive index lower than the contact electrode, and a pad electrode electrically connected to the contact electrode. The light emitting element is flip-chip mounted on the wiring layer. A part of the transparent dielectric layer is formed between the contact electrode and the pad electrode.

Abstract translation: 发光装置包括发光元件，在元件安装表面上包括布线层的元件安装板和密封发光元件的密封部。 发光元件包括：接触电极，包括透明导电膜，形成在接触电极的表面上并且包括比接触电极低的折射率的透明电介质层，以及与接触电极电连接的焊盘电极。 发光元件被倒装安装在布线层上。 在接触电极和焊盘电极之间形成透明介电层的一部分。

公开(公告)号：US20110114989A1

公开(公告)日：2011-05-19

申请号：US12926253

申请日：2010-11-04

Applicant: Yoshinobu Suehiro ,  Seiji Yamaguchi ,  Katsunori Arakane ,  Koji Tasumi

Inventor： Yoshinobu Suehiro ,  Seiji Yamaguchi ,  Katsunori Arakane ,  Koji Tasumi

IPC: H01L33/56 ,  H01L21/603

CPC classification number: H01L33/56 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00

Abstract: A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.

Abstract translation: 一种制造发光器件的方法包括用于形成从安装基板的前表面延伸到后表面的通孔的孔形成工艺，用于在内表面上连续形成电路图案的图案形成工艺 安装基板中的通孔，从安装基板的前表面上的通孔的端部到发光元件的安装部，并且在后表面上的通孔的周边 的安装基板，将发光元件安装在安装部上的安装工序以及通过加热软化的无机材料配置在安装基板的表面上并进入通孔的热压工序 同时通过将无机材料压入和粘合到安装基板的表面来密封发光元件。

公开(公告)号：US20110104834A1

公开(公告)日：2011-05-05

申请号：US12929331

申请日：2011-01-14

Applicant: Yoshinobu Suehiro ,  Seiji Yamaguchi

Inventor： Yoshinobu Suehiro ,  Seiji Yamaguchi

IPC: H01L33/48

CPC classification number: H01L33/56 ,  F21K9/00 ,  H01L24/97 ,  H01L33/44 ,  H01L33/486 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of making a light emitting device, includes a mounting and a light emitting element on a substrate; hot-pressing a glass material on the light emitting element to form a glass sealing portion for sealing the light emitting element; and forming a phosphor layer on a surface of the glass sealing portion.

Abstract translation: 一种制造发光器件的方法，在衬底上包括安装件和发光元件; 在发光元件上热压玻璃材料，以形成用于密封发光元件的玻璃密封部分; 以及在所述玻璃密封部的表面上形成荧光体层。

公开(公告)号：US07858997B2

公开(公告)日：2010-12-28

申请号：US11717050

申请日：2007-03-13

Applicant: Naoki Yoshimura ,  Yoshinobu Suehiro ,  Yuji Takahashi ,  Koichi Ota ,  Mamoru Mitomo ,  Tadashi Endo ,  Masakazu Komatsu

Inventor： Naoki Yoshimura ,  Yoshinobu Suehiro ,  Yuji Takahashi ,  Koichi Ota ,  Mamoru Mitomo ,  Tadashi Endo ,  Masakazu Komatsu

IPC: H01L29/22

CPC classification number: C04B35/597 ,  C04B35/584 ,  C04B35/6455 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3852 ,  C04B2235/3865 ,  C04B2235/3869 ,  C04B2235/3873 ,  C04B2235/766 ,  C04B2235/80 ,  C09K11/0883 ,  C09K11/7734 ,  G02F2001/133614 ,  H01L33/502 ,  H01L2224/49107 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12041 ,  Y02B20/181

Abstract: A light emitting apparatus has a light emitting element with an emission wavelength in the range of 360 to 550 nm and a rare-earth element doped oxide nitride phosphor or cerium ion doped lanthanum silicon nitride phosphor. Part of light radiated from the light emitting element is wavelength-converted by the phosphor. The light emitting apparatus radiates white light generated by a mixture of the wavelength-converted light and the other part of light radiated from the light emitting element.

Abstract translation: 发光装置具有发光波长在360〜550nm范围内的发光元件和稀土元素掺杂氧化物氮化物荧光体或铈离子掺杂氮化镧氮化镓荧光体。 从发光元件辐射的光的一部分被磷光体波长转换。 发光装置照射由波长转换光和从发光元件辐射的光的另一部分的混合产生的白光。