摘要:
A mold and a die-cast manufacturing method for the die-cast product, in which a main frame which is contiguously formed with a head pipe constitutes a portion of a hollow light-weight-metal-made vehicle-body frame. The mold includes a core for forming an inner space of the hollow vehicle-body frame. The core includes a core body and a plurality of splints mounted on the core body, the splints having approximately elliptical cross-sectional shapes. The long axes direction of ellipses of the splints are set parallel to a mold split surface of the mold. As a result, measurement of the positional accuracy of the splints is facilitated, a clearance between the splint and the mold can decrease by increasing the dimensional accuracy of splint mounting portions of the mold based on sizes of the splints, and the frame can be manufactured with high dimensional accuracy.
摘要:
A light-emitting device with an emission wavelength range of from 360 nm to 550 nm and a fluorescent material made of Ca—Al—Si—O—N oxynitride activated with Eu2+ are used so that a part of light emitted from the light-emitting device is emitted while the wavelength of the part of light is converted by the fluorescent material.
摘要:
The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.
摘要:
The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.
摘要:
A purple LED (19) is fixed onto lead frames (14, 15) in the cup (17a) of a frame (17) using a mount (21), and the purple LED (19) is sealed by filling a sealant (26) of transparent resin into the cup (17a). Red/green/blue phosphors (28-30) that absorb a light emitted by the purple LED (19) and emit lights having red, green, blue wavelengths different from the wavelength of this absorbed light are mixed into the sealant (26). A yellow phosphor (31) that absorbs a light emitted by the purple LED (19) and emits a light having a yellow wavelength different from the wavelength of this absorbed light is additionally mixed into the sealant (26) in such a white light emitting device.
摘要:
The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.
摘要:
The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.
摘要:
A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.
摘要翻译:一种固体元件器件的制造方法,其特征在于,提供具有GaN基LED元件(2)的含有玻璃的Al 2 O 3衬底(3),设置与所述衬底平行的P2O5-ZnO系低熔点玻璃,以及 在氮气气氛下,在60kgf的压力下进行在415℃以上的温度下的加压。 在这些条件下,低熔点玻璃的粘度为109泊,并且通过形成在含玻璃Al 2 O 3衬底(3)的表面上的氧化物粘合。 通过上述方法制造的固体元件装置可以通过在低温下工作的玻璃密封来制造,并且还具有高度可靠的密封结构。