摘要:
A scratch or similar surface roughness in a solid surface is reduced by gas cluster ion beam irradiation. A gas-cluster-ion-beam solid surface smoothing method includes an irradiation step in which the solid surface is irradiated with a gas cluster ion beam. The irradiation step includes a process of causing clusters from a plurality of directions to collide with at least an area (spot) irradiated with the gas cluster ion beam in the solid surface. Collision of clusters from a plurality of directions with the spot can be brought about by emitting a divergent gas cluster ion beam which releases clusters in diverging directions with respect to the beam center, for example.
摘要:
In a method of irradiating a gas cluster ion beam on a solid surface and smoothing the solid surface, the angle formed between the solid surface and the gas cluster ion beam is chosen to be between 1° and an angle less than 30°. In case the solid surface is relatively rough, the processing efficiency is raised by first irradiating a beam at an irradiation angle θ chosen to be something like 90° as a first step, and subsequently at an irradiation angle θ chosen to be 1° to less than 30° as a second step. Alternatively, the set of the aforementioned first step and second step is repeated several times.
摘要:
A solid surface is processed while corner portions of a relief structure are protected from deformation. A method of processing a solid surface with a gas cluster ion beam includes a cluster protection layer formation step of forming, on the solid surface, a relief structure having protrusions with a cluster protection layer formed to cover an upper part thereof and recesses without the cluster protection layer; an irradiation step of emitting a gas cluster ion beam onto the solid surface having the relief structure formed in the cluster protection layer formation step; and a removal step of removing the cluster protection layer. A thickness T of the cluster protection layer satisfies T > nY + ( b 2 Y 2 n - nY 2 ( b 4 - 16 a 2 ) 1 2 2 ) 1 2 , where n is a dose of the gas cluster ion beam, and Y is an etching efficiency of the cluster protection layer, expressed as an etching volume per cluster (a and b are constants).
摘要翻译:处理浮雕结构的角部以防止变形的实心表面。 用气体簇离子束处理固体表面的方法包括:簇保护层形成步骤,在固体表面上形成具有突起的浮雕结构,所述突起具有形成为覆盖其上部的簇保护层和没有簇的凹部 保护层; 在所述簇保护层形成工序中形成有具有所述浮雕结构的固体表面上的气体簇离子束的照射工序; 以及去除簇保护层的去除步骤。 簇保护层的厚度T满足T> nY +(b 2 Y 2 n-nY 2(b 4 - 16 a 2)1 2 2)1 2,其中n是气体簇的剂量 离子束,Y是簇保护层的蚀刻效率,表示为每簇的蚀刻体积(a和b是常数)。
摘要:
A method for flattening a sample surface by irradiating the sample surface with a gas cluster ion beam, generates clusters of source gas in a cluster generating chamber, ionizes the generated clusters in an ionization chamber, accelerates the ionized cluster beam in an electric field of an accelerating electrode, selects a cluster size using a magnetic field of a sorting mechanism, and irradiates the surface of a sample. An irradiation angle between the sample surface and the gas cluster ion beam is less than 30° and an average cluster size of the gas cluster ion beam is 50 or above.
摘要:
A method for flattening a sample surface by irradiating the sample surface with a gas cluster ion beam, generates clusters of source gas in a cluster generating chamber, ionizes the generated clusters in an ionization chamber, accelerates the ionized cluster beam in an electric field of an accelerating electrode, selects a cluster size using a magnetic field of a sorting mechanism, and irradiates the surface of a sample. An irradiation angle between the sample surface and the gas cluster ion beam is less than 30° and an average cluster size of the gas cluster ion beam is 50 or above.
摘要:
In a cluster ion beam irradiation apparatus including an apparatus for measuring size and energy distribution of gas cluster ions by using the time of flight (TOF) mass spectrometry, a unit for applying a retarding voltage is disposed in a stage preceding a TOF measuring instrument including a drift tube and a current measuring instrument. By measuring the size and energy distribution of the gas cluster ions and adjusting ionization conditions, cluster ions having predetermined energy and size are supplied to a work surface. In addition, a product of a pressure in an ion transportation device and an ion transportation length is controlled so as to satisfy the relation P×L≦30/N2/3/E1/2 Pa.m, where N is the size of gas cluster ions used for irradiation, and E is kinetic energy (eV) of the gas cluster ions.
摘要翻译:在包括用于通过使用飞行时间(TOF)质谱法测量气体簇离子的尺寸和能量分布的装置的集束离子束照射装置中,在TOF测量仪器之前的阶段中设置用于施加延迟电压的单元,包括 漂移管和电流测量仪器。 通过测量气体团簇离子的尺寸和能量分布并调节电离条件,将具有预定能量和尺寸的簇离子供应到工作表面。 此外,控制离子输送装置中的压力和离子输送长度的乘积,以满足关系式PxL <= 30 / N 2/3 / E 1/2 Pa.m,其中N是用于照射的气体簇离子的大小,E是气体簇离子的动能(eV)。
摘要:
In a dry etching method in which clusters formed by agglomeration of atoms or molecules are ionized and accelerated as a cluster ion beam for irradiation of an object surface to etch away therefrom its constituent atoms, the clusters are mixed clusters 42 formed by agglomeration of two or more kinds of atoms or molecules, and the mixed clusters 42 contain atoms 43 of at least one of argon, neon, xenon and krypton, and a component 44 that is deposited on the object surface to form a thin film by reaction therewith. With this method, it is possible to provide an extremely reduced sidewall surface roughness and high vertical machining accuracy.
摘要:
A method for processing a sample using an electrically neutral reactive cluster is provided. The surface of a sample is processed by jetting out a mixed gas that is composed of a reactive gas and a gas with a boiling point lower than that of the reactive gas from a gas jetting part of a vacuum process room in which the sample is placed by a pressure in a range in which the mixed gas is not liquefied, in a predetermined direction, while adiabatically-expanding the mixed gas, thereby generating a reactive cluster and jetting the reactive cluster against the sample in the vacuum process room.
摘要:
A method for processing a sample using an electrically neutral reactive cluster is provided. The surface of a sample is processed by jetting out a mixed gas that is composed of a reactive gas and a gas with a boiling point lower than that of the reactive gas from a gas jetting part of a vacuum process room in which the sample is placed by a pressure in a range in which the mixed gas is not liquefied, in a predetermined direction, while adiabatically-expanding the mixed gas, thereby generating a reactive cluster and jetting the reactive cluster against the sample in the vacuum process room.
摘要:
In a dry etching method in which clusters formed by agglomeration of atoms or molecules are ionized and accelerated as a cluster ion beam for irradiation of an object surface to etch away therefrom its constituent atoms, the clusters are mixed clusters 42 formed by agglomeration of two or more kinds of atoms or molecules, and the mixed clusters 42 contain atoms 43 of at least one of argon, neon, xenon and krypton, and a component 44 that is deposited on the object surface to form a thin film by reaction therewith. With this method, it is possible to provide an extremely reduced sidewall surface roughness and high vertical machining accuracy.