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公开(公告)号：US10030287B2
公开(公告)日：2018-07-24
申请号：US13577400
申请日：2011-02-08
Applicant: Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
Inventor： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
Abstract: A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.
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公开(公告)号：US09734937B2
公开(公告)日：2017-08-15
申请号：US14005224
申请日：2012-03-16
Applicant: Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
Inventor： Seigi Aoyama , Toru Sumi , Hiromitsu Kuroda , Hideyuki Sagawa
Abstract: Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 μm or less in a surface layer having a depth of 50 μm from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.
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公开(公告)号：US09234263B2
公开(公告)日：2016-01-12
申请号：US13317463
申请日：2011-10-19
Applicant: Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama , Masayoshi Goto , Takahiko Hanada , Takahiro Sato , Hidenori Abe
Inventor： Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama , Masayoshi Goto , Takahiko Hanada , Takahiro Sato , Hidenori Abe
CPC classification number: C22C9/00 , B23K31/00 , B32B15/20 , C22C1/02 , C22C1/1036 , C22F1/00 , C22F1/08 , Y10T428/1266 , Y10T428/12667 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291
Abstract: A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element,?
Abstract translation: 焊件包括彼此焊接的金属材料。 至少一种金属材料包括包含不可避免的杂质的纯铜，大于2质量ppm的氧，以及选自Mg，Zr，Nb，Fe，Si，Al，Ca，V，Ni ，Mn，Ti和Cr。 一种焊接件的制造方法，其特征在于，以不低于1100℃，不高于1320℃的熔融铜温度，通过SCR连续铸造，熔融稀释的铜合金材料，形成熔融金属 从熔融金属中，通过对铸造棒进行热轧而形成稀铜合金构件，并将稀铜合金构件焊接到金属材料上。 稀铜合金材料包括纯铜，超过2质量ppm的氧和添加元素，
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公开(公告)号：US08769813B2
公开(公告)日：2014-07-08
申请号：US12842671
申请日：2010-07-23
Applicant: Toru Sumi , Tsukasa Iwasita , Kenichi Egami , Kazuyuki Watanabe , Hiroshi Okikawa
Inventor： Toru Sumi , Tsukasa Iwasita , Kenichi Egami , Kazuyuki Watanabe , Hiroshi Okikawa
IPC: H01R43/04
CPC classification number: H01R4/023 , Y10T29/49172 , Y10T29/49176 , Y10T29/49179 , Y10T29/49181 , Y10T29/49183 , Y10T29/4919 , Y10T29/49227
Abstract: A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
Abstract translation: 通过将连接端子与并联布置的两条单线导体电连接来提供布线材料。 连接端子设置有用于存储两条单线导体的管状部分，两条单线导体插入管状部分中，电阻焊接通过从管状部分的外部承载电力进行 管状部和单线导体相互接触的状态，连接端子与两条单线导体电连接。
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公开(公告)号：US07832099B2
公开(公告)日：2010-11-16
申请号：US11792839
申请日：2005-12-09
Applicant: Toru Sumi , Tsukasa Iwasita , Kenichi Egami , Kazuyuki Watanabe , Hiroshi Okikawa
Inventor： Toru Sumi , Tsukasa Iwasita , Kenichi Egami , Kazuyuki Watanabe , Hiroshi Okikawa
CPC classification number: H01R4/023 , Y10T29/49172 , Y10T29/49176 , Y10T29/49179 , Y10T29/49181 , Y10T29/49183 , Y10T29/4919 , Y10T29/49227
Abstract: A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
Abstract translation: 通过将连接端子与并联布置的两条单线导体电连接来提供布线材料。 连接端子设置有用于存储两条单线导体的管状部分，两条单线导体插入管状部分中，电阻焊接通过从管状部分的外部承载电力进行 管状部和单线导体相互接触的状态，连接端子与两条单线导体电连接。
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Patent Agency Ranking
公开(公告)号：US09805836B2
公开(公告)日：2017-10-31
申请号：US13317461
申请日：2011-10-19
Applicant: Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama
Inventor： Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama
CPC classification number: H01B1/026 , B22D11/004 , C22C9/00
Abstract: A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.
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公开(公告)号：US08835766B2
公开(公告)日：2014-09-16
申请号：US13317462
申请日：2011-10-19
Applicant: Seigi Aoyama , Toru Sumi , Masayoshi Goto
Inventor： Seigi Aoyama , Toru Sumi , Masayoshi Goto
IPC: H01B11/02
CPC classification number: H01B1/026
Abstract: An audio/video cable includes a plurality of parallel arranged insulated wires or twisted pair insulated wires each including a copper conductor and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The surface layer includes a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 μm toward inside of the soft dilute copper alloy material is not more than 20 μm.
Abstract translation: 音频/视频电缆包括多个平行布置的绝缘电线或双绞线绝缘电线，每根电线包括铜导体和形成在其周边上的绝缘层。 铜导体包括含有纯铜，添加元素和不可避免的杂质作为平衡的软的稀铜合金材料。 软的稀铜合金材料包括具有表面层中的晶粒小于内部晶粒的晶粒尺寸分布的再结晶结构。 表面层包括晶体结构，使得从软表面层的表面到柔性稀铜合金材料的内部的平均晶粒尺寸直到50μm的深度不大于20μm。
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8.发明授权公开(公告)号：US08779294B2
公开(公告)日：2014-07-15
申请号：US13276680
申请日：2011-10-19
Applicant: Toru Sumi , Seigi Aoyama , Hiromitsu Kuroda , Hideyuki Sagawa
Inventor： Toru Sumi , Seigi Aoyama , Hiromitsu Kuroda , Hideyuki Sagawa
CPC classification number: H01B1/026 , B22F2998/00 , C22C9/00 , C22F1/08 , C22C32/00
Abstract: The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-ppm or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.
Abstract translation: 本发明提供一种具有高导电性和高弯曲耐久性的柔性扁平电缆及其制造方法。 本发明是一种柔性扁平电缆，其包括施加在导体上的导体和绝缘膜，其中导体由至少一种选自镁（Mg），锆（Zr），铌（Nb）， 钙（Ca），钒（V），镍（Ni），锰（Mn），钛（Ti）和铬（Cr） 2质量ppm以上的氧气; 余量是不可避免的杂质和铜，其中导体具有这样的再结晶织构，导体的内部区域中的晶粒尺寸大，表面积的晶粒尺寸小于内部区域的晶粒尺寸，其中 导体的两侧夹在绝缘膜之间。
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公开(公告)号：US20130042949A1
公开(公告)日：2013-02-21
申请号：US13571781
申请日：2012-08-10
Applicant: Hideyuki Sagawa , Seigi Aoyama , Hiromitsu Kuroda , Toru Sumi , Keisuke Fujito , Ryohei Okada , Shinichi Masui
Inventor： Hideyuki Sagawa , Seigi Aoyama , Hiromitsu Kuroda , Toru Sumi , Keisuke Fujito , Ryohei Okada , Shinichi Masui
CPC classification number: C22F1/08 , B21C1/003 , C22C9/00 , H01B1/026 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/4321 , H01L2224/43848 , H01L2224/45124 , H01L2224/45147 , H01L2224/45565 , H01L2224/45611 , H01L2224/45618 , H01L2224/45639 , H01L2224/45655 , H01L2224/45664 , H01L2924/10253 , H01L2924/00014 , H01L2924/01022 , H01L2924/01012 , H01L2924/0104 , H01L2924/01041 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01025 , H01L2924/01024 , H01L2924/01016 , H01L2924/01008 , H01L2924/01205
Abstract: A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%.
Abstract translation: 软 - 稀铜合金材料的制造方法包括：软 - 稀铜合金的塑性加工，其包含选自Ti，Mg，Zr，Nb，Ca，V，Ni， Mn和Cr，余量由铜和不可避免的杂质组成，以及随后的软 - 稀铜铜合金的退火处理。 退火处理前塑料加工的加工率不小于50％。
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10.发明申请公开(公告)号：US20120097904A1
公开(公告)日：2012-04-26
申请号：US13317461
申请日：2011-10-19
Applicant: Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama
Inventor： Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama
CPC classification number: H01B1/026 , B22D11/004 , C22C9/00
Abstract: A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.
Abstract translation: 在存在氢的环境中使用的稀铜合金材料包括包含不可避免的杂质的纯铜，大于2质量ppm的氧，以及选自Mg，Zr，Nb，Ca，V，Fe ，Al，Si，Ni，Mn，Ti和Cr，添加元素能够与氧结合形成氧化物。 制造耐氢脆性特性优异的稀铜合金构件的制造方法，其特征在于，在铜熔融温度不低于1100℃，不高于1320℃的条件下，通过SCR连续铸造，熔融稀释铜合金材料 制造熔融金属，从熔融金属形成铸棒，并通过热轧铸造棒形成稀铜合金构件。
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