Invention Application
- Patent Title: Dilute copper alloy material and method of manufacturing dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement
- Patent Title (中): 稀铜铜合金材料及其耐氢脆性能优良的稀铜合金材料制造方法
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Application No.: US13317461Application Date: 2011-10-19
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Publication No.: US20120097904A1Publication Date: 2012-04-26
- Inventor: Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama
- Applicant: Hiromitsu Kuroda , Toru Sumi , Hideyuki Sagawa , Seigi Aoyama
- Applicant Address: JP Ibaraki JP Tokyo
- Assignee: Hitachi Wire and Rod LTD.,Hitachi Cable, Ltd
- Current Assignee: Hitachi Wire and Rod LTD.,Hitachi Cable, Ltd
- Current Assignee Address: JP Ibaraki JP Tokyo
- Priority: JP2010-235268 20101020
- Main IPC: H01B1/02
- IPC: H01B1/02 ; B22D25/02 ; B22D11/12

Abstract:
A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.
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