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公开(公告)号:US09574268B1
公开(公告)日:2017-02-21
申请号:US13284738
申请日:2011-10-28
申请人: Todd Dunn , Carl White , Mike Halpin , Eric Shero , Herbert Terhorst , Jerry Winkler
发明人: Todd Dunn , Carl White , Mike Halpin , Eric Shero , Herbert Terhorst , Jerry Winkler
IPC分类号: C23C16/455 , C23C16/453
CPC分类号: C23C16/45544 , C23C16/455 , C23C16/45512 , C23C16/45561 , C23C16/45563 , C23C16/45565 , C23C16/4557 , C23C16/45574 , C23C16/45576 , C23C16/45589 , H01L21/0228 , H01L21/0262 , H01L21/28556
摘要: A vapor deposition device includes a reactor including a reaction chamber and an injector for injecting vapor into the reaction chamber. The device also includes a manifold for delivering vapor to the injector. The manifold includes a manifold body having an internal bore, a first distribution channel disposed within the body in a plane intersecting the longitudinal axis of the bore, and a plurality of supply channels disposed within the body and in flow communication with the first distribution channel and with the bore. Each of the first supply channels is disposed at an acute angle with respect to the longitudinal axis of the bore, and each of the supply channels connects with the bore at a different angular position about the longitudinal axis. The distribution channel (and thus, the supply channels) can be connected with a common reactant source. Related deposition methods are also described.
摘要翻译: 气相沉积装置包括反应器,该反应器包括反应室和用于将蒸汽注入反应室的喷射器。 该装置还包括用于将蒸气输送到喷射器的歧管。 歧管包括具有内孔的歧管主体,在与所述孔的纵向轴线相交的平面内设置在所述主体内的第一分配通道,以及设置在所述主体内并与所述第一分配通道流动连通的多个供应通道,以及 与孔。 每个第一供应通道相对于孔的纵向轴线以锐角设置,并且每个供应通道在与纵向轴线不同的角度位置处与孔连通。 分配通道(因此,供应通道)可以与常见的反应物源连接。 还描述了相关的沉积方法。
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公开(公告)号:US09096931B2
公开(公告)日:2015-08-04
申请号:US13312591
申请日:2011-12-06
申请人: Andrew M. Yednak, III , Todd Dunn , Carl White , Michael Manasco
发明人: Andrew M. Yednak, III , Todd Dunn , Carl White , Michael Manasco
IPC分类号: F16K49/00 , C23C16/455 , F16K27/00
CPC分类号: C23C16/45561 , C23C16/45512 , F16K27/003 , F16K49/002 , Y10T137/0318 , Y10T137/6416 , Y10T137/6606 , Y10T137/7036
摘要: A valve assembly including a mounting block having a first surface, a plurality of valves connected to the mounting block first surface, at least one fluid line connecting the plurality of valves spaced apart from the mounting block first surface, a heating element spaced apart from the at least one fluid line and located within a first insulating layer, and wherein the first insulating layer extends less than completely around the at least one fluid line.
摘要翻译: 一种阀组件,包括具有第一表面的安装块,连接到安装块第一表面的多个阀,连接多个与所述安装块第一表面间隔开的阀的至少一个流体管线,与所述安装块间隔开的加热元件 至少一个流体管线并且位于第一绝缘层内,并且其中所述第一绝缘层的延伸小于完全围绕所述至少一个流体管线。
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公开(公告)号:US09202727B2
公开(公告)日:2015-12-01
申请号:US13411271
申请日:2012-03-02
申请人: Todd Dunn , Carl White , Michael Halpin , Eric Shero , Jerry Winkler
发明人: Todd Dunn , Carl White , Michael Halpin , Eric Shero , Jerry Winkler
IPC分类号: F27D5/00 , H01L21/67 , F27B17/00 , F27D3/00 , H01L21/687
CPC分类号: H01L21/67103 , F27B17/0025 , F27D3/0084 , F27D5/0037 , H01L21/68785
摘要: A substrate supporting assembly in a reaction space includes a heater, a substrate support member, and a shim positioned between the heater and the substrate support member. The shim may be removably secured between the heater and the substrate support member. The shim may further include an inner surface defining a perimeter of a gap. The gap may be further defined by a bottom surface of the substrate support member and a top surface of the heater. The substrate support member may further include a shoulder positioned radially outside of a substrate support position and wherein the shim inner surface is radially aligned with the substrate support member shoulder.
摘要翻译: 反应空间中的基板支撑组件包括加热器,基板支撑构件和位于加热器和基板支撑构件之间的垫片。 垫片可以可拆卸地固定在加热器和衬底支撑构件之间。 垫片还可包括限定间隙周长的内表面。 间隙可以由衬底支撑构件的底表面和加热器的顶表面进一步限定。 衬底支撑构件还可以包括位于衬底支撑位置的径向外侧的肩部,并且其中垫片内表面与衬底支撑构件肩部径向对准。
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公开(公告)号:US09017481B1
公开(公告)日:2015-04-28
申请号:US13284642
申请日:2011-10-28
申请人: Fred Pettinger , Carl White , Dave Marquardt , Sokol Ibrani , Eric Shero , Todd Dunn , Kyle Fondurulia , Mike Halpin
发明人: Fred Pettinger , Carl White , Dave Marquardt , Sokol Ibrani , Eric Shero , Todd Dunn , Kyle Fondurulia , Mike Halpin
IPC分类号: C23C16/455 , C23C16/44 , H01J37/32
CPC分类号: H01L21/02104 , C23C16/4409 , C23C16/4411 , C23C16/45565 , C23C16/4557 , C23C16/45572 , H01J37/3244 , H01J37/32449 , H01J37/32522 , H01J37/32532
摘要: Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.
摘要翻译: 提供了与管理半导体工艺模块的工艺进料条件有关的实施例。 在一个示例中,提供了一种用于半导体处理模块的气体通道板。 示例性气体通道板包括热交换表面,其包括通过中间间隔彼此分离的多个热交换结构。 示例性气体通道板还包括热交换流体引导板支撑表面,用于在多个热交换结构之上支撑热交换流体导向板,使得多个热交换结构的至少一部分与热交换流体间隔开 导演板。
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公开(公告)号:US20130230814A1
公开(公告)日:2013-09-05
申请号:US13411271
申请日:2012-03-02
申请人: Todd Dunn , Carl White , Michael Halpin , Eric Shero , Jerry Winkler
发明人: Todd Dunn , Carl White , Michael Halpin , Eric Shero , Jerry Winkler
CPC分类号: H01L21/67103 , F27B17/0025 , F27D3/0084 , F27D5/0037 , H01L21/68785
摘要: A substrate supporting assembly in a reaction space includes a heater, a substrate support member, and a shim positioned between the heater and the substrate support member. The shim may be removably secured between the heater and the substrate support member. The shim may further include an inner surface defining a perimeter of a gap. The gap may be further defined by a bottom surface of the substrate support member and a top surface of the heater. The substrate support member may further include a shoulder positioned radially outside of a substrate support position and wherein the shim inner surface is radially aligned with the substrate support member shoulder.
摘要翻译: 反应空间中的基板支撑组件包括加热器,基板支撑构件和位于加热器和基板支撑构件之间的垫片。 垫片可以可拆卸地固定在加热器和衬底支撑构件之间。 垫片还可包括限定间隙周长的内表面。 间隙可以由衬底支撑构件的底表面和加热器的顶表面进一步限定。 衬底支撑构件还可以包括位于衬底支撑位置的径向外侧的肩部,并且其中垫片内表面与衬底支撑构件肩部径向对准。
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公开(公告)号:US08251818B1
公开(公告)日:2012-08-28
申请号:US12869954
申请日:2010-08-27
申请人: Todd Dunn , Gopinath Venktatramanan
发明人: Todd Dunn , Gopinath Venktatramanan
IPC分类号: A63F13/00
CPC分类号: A63F13/44 , A63B69/0053 , A63F13/54 , A63F13/80 , A63F2300/6027 , A63F2300/638 , A63F2300/8094
摘要: A reflex training system operates on a computer or other processing system, having hand and foot controls for response to stimuli. The use of a computer allows the system to be portable and used in a variety of locations. The system is highly configurable and can be used for training for individuals having different needs and at different levels. The configurability relates to the types of stimuli presented to the user, the types of responses required by the user, and the characteristics of different levels. The system provides a variety of reports relating to performance so that progress can be reviewed. The system can be operated on-line to create a community of users.
摘要翻译: 反射训练系统在计算机或其他处理系统上操作,具有用于响应于刺激的手和脚控制。 使用计算机允许系统可移植并在各种位置使用。 该系统是高度可配置的,可以用于具有不同需求和不同级别的个人的培训。 可配置性涉及呈现给用户的刺激类型,用户所需的响应类型以及不同级别的特征。 该系统提供了与性能有关的各种报告,以便对进度进行审查。 该系统可以在线运行,以创建一个用户社区。
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公开(公告)号:US08933375B2
公开(公告)日:2015-01-13
申请号:US13535214
申请日:2012-06-27
申请人: Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
发明人: Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
CPC分类号: H01L21/67103 , F28D15/00 , H01L21/67109 , H01L21/68714 , H01L21/68742
摘要: A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
摘要翻译: 晶片处理装置可以包括具有顶侧和背面的基座,具有间隔构件和加热构件的基座加热器,可移除地安装在基座和基座加热器之间的垫片,由基座背面形成的空腔,基座 加热器和垫片,与空腔连通的流体入口以及与空腔连通的多个流体出口。
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公开(公告)号:US20140000843A1
公开(公告)日:2014-01-02
申请号:US13535214
申请日:2012-06-27
申请人: Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
发明人: Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
IPC分类号: H01L21/324 , F28F7/00
CPC分类号: H01L21/67103 , F28D15/00 , H01L21/67109 , H01L21/68714 , H01L21/68742
摘要: A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
摘要翻译: 晶片处理装置可以包括具有顶侧和背面的基座,具有间隔构件和加热构件的基座加热器,可移除地安装在基座和基座加热器之间的垫片,由基座背面形成的空腔,基座 加热器和垫片,与空腔连通的流体入口以及与空腔连通的多个流体出口。
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公开(公告)号:US20130104992A1
公开(公告)日:2013-05-02
申请号:US13312591
申请日:2011-12-06
申请人: Andrew M. Yednak, III , Todd Dunn , Carl White , Michael Manasco
发明人: Andrew M. Yednak, III , Todd Dunn , Carl White , Michael Manasco
IPC分类号: F16K49/00
CPC分类号: C23C16/45561 , C23C16/45512 , F16K27/003 , F16K49/002 , Y10T137/0318 , Y10T137/6416 , Y10T137/6606 , Y10T137/7036
摘要: A valve assembly including a mounting block having a first surface, a plurality of valves connected to the mounting block first surface, at least one fluid line connecting the plurality of valves spaced apart from the mounting block first surface, a heating element spaced apart from the at least one fluid line and located within a first insulating layer, and wherein the first insulating layer extends less than completely around the at least one fluid line.
摘要翻译: 一种阀组件,包括具有第一表面的安装块,连接到安装块第一表面的多个阀,连接多个与所述安装块第一表面间隔开的阀的至少一个流体管线,与所述安装块间隔开的加热元件 至少一个流体管线并且位于第一绝缘层内,并且其中所述第一绝缘层的延伸小于完全围绕所述至少一个流体管线。
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