发明授权
US08933375B2 Susceptor heater and method of heating a substrate 有权
受体加热器和加热基材的方法

Susceptor heater and method of heating a substrate
摘要:
A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
公开/授权文献
信息查询
0/0