摘要:
A semiconductor product includes, a substrate with a first dielectric layer having contact hole fillings for contacting active areas in the substrate. A second dielectric layer with contact holes is provided therein. The contact holes have a width in a first lateral direction. The product further includes conductive lines, each conductive line passing over contact holes in the second dielectric layer and contacting a plurality of contact hole fillings in the first dielectric layer. The conductive lines have a width, in the first lateral direction, that is smaller than the width of the contact holes of the second dielectric layer. The conductive lines are in direct mechanical contact with the contact hole fillings and thereby remove the need to provide any conventional “contact to interconnect” structures.
摘要:
An array of charge-trapping multi-bit memory cells is arranged in a virtual-ground NAND architecture. The memory cells are erased by Fowler-Nordheim tunneling of electrons into the memory layers. The write operation is effected by hot hole injection. A write voltage is applied by a bitline to two NAND chains in series. The subsequent bitline on the side of the memory cell to be programmed is maintained on floating potential, whereas the bitline on the other side is set to an inhibit voltage, which is provided to inhibit a program disturb of an addressed memory cell which is not to be programmed. This virtual-ground NAND architecture of charge-trapping memory cells enables an increased storage density.
摘要:
A semiconductor memory having charge trapping memory cells, where the direction of current flow of each channel region of the memory transistors runs transversely with respect to the relevant word line, the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive local interconnects of source-drain regions are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and connected to the bit lines, wherein gate electrodes are arranged in trenches at least partly formed in the memory substrate.
摘要:
A memory element includes a number of material areas isolated from one another to form at least one area with changed electrical and/or magnetic characteristics in an isolation area, which material areas have or form free charge carriers. An information unit can correspondingly be written to, deleted, and/or read from by influencing the material areas by applying an electrical potential to line devices that are provided in areas.
摘要:
A semiconductor memory having charge trapping memory cells and fabrication method thereof. The direction of current flow of each channel region of the memory transistors runs transversely with respect to the relevant word line, the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive local interconnects of source-drain regions are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and connected to the bit lines, wherein gate electrodes are arranged in trenches at least partly formed in the memory substrate.
摘要:
A memory cell arrangement includes a first memory cell string having a plurality of serially source-to-drain-coupled transistors, at least some of them being memory cells, a second memory cell string having a plurality of serially source-to-drain-coupled transistors, at least some of them being memory cells. A dielectric material is between and above the first memory cell string and the second memory cell string. A source/drain line groove is defined in the dielectric material. The source/drain line groove extends from a source/drain region of one transistor of the first memory cell string to a source/drain region of the second memory cell string. Electrically conductive filling material is disposed in the source/drain line groove. Dielectric filling material is disposed in the source/drain line groove between the source/drain regions.
摘要:
An electronic circuit arrangement includes a storage unit set up for storing at least two analog electrical quantities. A first evaluation circuit is coupled to the storage unit and is set up in such a way that it assesses the at least two analog electrical quantities and provides a first assessment result. A second evaluation circuit is coupled to the storage unit and is set up in such a way that it assesses at least one of the at least two analog electrical quantities with a predetermined threshold value and provides a second assessment result.
摘要:
An electronic circuit arrangement includes at least one memory element in which at least two electrical quantities can be stored. A switching unit is electrically connected to the memory element and has at least one first circuit path and a second circuit path. A storage unit has a first partial storage unit and a second partial storage unit. Each partial storage unit is set up for storing at least one electrical quantity. The switching unit is set up in such a way that it can sequentially pass a first one of the at least two electrical quantities along the first circuit path to the first partial storage unit and a second one of the at least two electrical quantities along the second circuit path to the second partial storage unit.
摘要:
A method is provided for fabricating stacked non-volatile memory cells. A semiconductor wafer is provided having a plurality of diffusion regions forming buried bit lines. A charge-trapping layer and a conductive layer are deposited on the surface of the semiconductor wafer. Using a mask layer on top of the conductive layer, contact holes are formed wherein an insulating layer is formed. An etch stop layer is deposited on the surface of the semiconductor wafer. Above the etch stop layer, a dielectric layer is deposited and is patterned so as to form contact holes. Subsequently, the contact holes are enlarged through the etch stop layer and the insulating layer to the buried bit lines.
摘要:
The charge-trapping layer comprises two strips above the source and drain junctions. The thicknesses of the charge-trapping layer and the gate dielectric are chosen to facilitate Fowler-Nordheim-tunnelling of electrons into the strips during an erasure process. Programming is performed by injection of hot holes into the strips individually for two-bit storage.