公开(公告)号：US20100290331A1

公开(公告)日：2010-11-18

申请号：US12727928

申请日：2010-03-19

申请人： Yasuhiro KAIZAKI ,  Tetsuro Sawai ,  Sumitoshi Kawasaki

发明人： Yasuhiro KAIZAKI ,  Tetsuro Sawai ,  Sumitoshi Kawasaki

IPC分类号： G11B7/00 ,  H05K1/00

CPC分类号： G11B7/126 ,  H05K1/025 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/0792

摘要： A signal current wiring line is configured to carry a signal current from a first circuit block to a second circuit block. A return current wiring line is configured to carry a return current from the second circuit block to the first circuit block. The signal current wiring line and the return current wiring line are stacked with an offset in the width direction so as to form a region between the surface of the casing on the second wiring line side and the signal current wiring line where the signal current wiring line faces the surface of the casing on the second wiring line side without the return current wiring line intervening between them.

摘要翻译： 信号电流布线被配置为将信号电流从第一电路块传送到第二电路块。 返回电流布线被配置为承载从第二电路块到第一电路块的返回电流。 信号电流布线和回流布线在宽度方向上以偏移方式堆叠，以形成第二布线侧的壳体的表面与信号电流布线之间的区域 面对第二布线侧的壳体的表面，而不会在它们之间插入返回电流布线。

公开(公告)号：US07450397B2

公开(公告)日：2008-11-11

申请号：US11388705

申请日：2006-03-24

申请人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai

发明人： Atsushi Saita ,  Toshikazu Imaoka ,  Tetsuro Sawai

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/024 ,  B32B15/08 ,  H05K1/0242 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0191 ,  H05K2201/035 ,  H05K2201/0715 ,  H05K2201/098 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same potential, a dielectric material layer provided between the first and second conductors, and a third conductor embedded in the dielectric material layer. In the wiring board, a thickness of the dielectric material layer in a first region located between the third conductor and the first conductor is larger than a thickness of the dielectric material layer in a second region located between the third conductor and the second conductor. Moreover, a cross-sectional shape of the third conductor is trapezoidal in which angles of respective ends of the third conductor on a side closer to the second conductor are obtuse.

摘要翻译： 开发了可以使线路变窄和/或可以减小传输损耗的布线板。 布线板包括保持在相同电位的第一导体和第二导体，设置在第一和第二导体之间的介电材料层和嵌入电介质材料层中的第三导体。 在布线板中，位于第三导体和第一导体之间的第一区域中的电介质材料层的厚度大于位于第三导体和第二导体之间的第二区域中的电介质材料层的厚度。 此外，第三导体的横截面形状是梯形的，其中第三导体在更靠近第二导体的一侧的各端的角度是钝的。

公开(公告)号：US07432580B2

公开(公告)日：2008-10-07

申请号：US11314039

申请日：2005-12-20

申请人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

发明人： Akihiro Sato ,  Satoru Sekiguchi ,  Kiyokazu Kamado ,  Kazunari Kurokawa ,  Makoto Tsubonoya ,  Kiyoshi Mita ,  Yoichi Nabeta ,  Tetsuro Sawai ,  Toshikazu Imaoka

IPC分类号： H01L23/58 ,  H05K7/00

CPC分类号： H01L23/645 ,  H01F2017/008 ,  H01F2017/0086 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12034 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.

摘要翻译： 一种半导体装置，包括基板，固定在基板的一侧的半导体芯片，形成在基板的另一侧并与半导体芯片电连接的螺旋形线圈，以及形成在该基板的表面上的导电图案 面向半导体芯片的衬底的侧面，用于稳定线圈的电感特性。

公开(公告)号：US20080158091A1

公开(公告)日：2008-07-03

申请号：US11966130

申请日：2007-12-28

申请人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

发明人： Toshikazu Imaoka ,  Takeshi Otsuka ,  Tetsuro Sawai

IPC分类号： H01Q1/52

CPC分类号： H01Q1/2283 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q7/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor module includes a multilayer board, a first circuit element mounted on the multilayer board, a second circuit element stacked on the first circuit element, an interposer board, provided between the first circuit element and the second circuit element, which includes an antenna conductor, a passive element, mounted on the multilayer board, which is connected to the antenna conductor, and a molded resin layer which seals the respective elements. The antenna conductor is structured by a spiral-shaped wiring pattern and the both ends of the antenna conductor are connected to the passive element via a bonding wire. The antenna conductor functions as a loop antenna with the passive element inserted.

摘要翻译： 半导体模块包括多层板，安装在多层板上的第一电路元件，堆叠在第一电路元件上的第二电路元件，设置在第一电路元件和第二电路元件之间的插入板，其包括天线导体 安装在与天线导体连接的多层板上的无源元件和密封各元件的模制树脂层。 天线导体由螺旋状的布线图形构成，天线导体的两端通过接合线与无源元件连接。 天线导体用作插入无源元件的环形天线。

公开(公告)号：US20080078571A1

公开(公告)日：2008-04-03

申请号：US11861712

申请日：2007-09-26

申请人： Toshikazu Imaoka ,  Tetsuro Sawai

发明人： Toshikazu Imaoka ,  Tetsuro Sawai

IPC分类号： H05K1/11

CPC分类号： H05K1/0245 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6638 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/0248 ,  H05K2201/09236 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device mounting board includes: a wiring layer; opposing signal wires formed on respective conductive layers, being arranged in parallel with each other; a pair of pad electrodes formed on the top of the wiring layer; a pair of pad electrodes formed on the bottom of the wiring layer; conductor parts which are formed through insulating layers and establish electrical connection between the top and bottom conductive layers; a circuit device mounted on the top side of the wiring layer; and a pair of signal electrodes formed on this circuit device, being connected to the pair of pad electrodes via conductive members. A line extending from one of the pad electrodes on the top to one of the pad electrodes on the bottom through one signal wire and a line extending from the other pad electrode on the top to the other pad electrode on the bottom through the other signal wire constitute a pair of differential transmission lines of equal lengths.

摘要翻译： 装置安装板包括：布线层; 形成在各个导电层​​上的相对的信号线彼此平行布置; 形成在所述布线层的顶部上的一对焊盘电极; 形成在布线层的底部的一对焊盘电极; 导体部分，其通过绝缘层形成并且在顶部和底部导电层之间建立电连接; 安装在所述布线层的上侧的电路装置; 以及形成在该电路装置上的一对信号电极，经由导电部件与一对焊盘电极连接。 从顶部的一个焊盘电极延伸到底部的焊盘电极之一，通过一个信号线和从顶部的另一个焊盘电极延伸到底部的另一焊盘电极的另一个信号线 构成长度相等的差动传输线对。

公开(公告)号：US20060194559A1

公开(公告)日：2006-08-31

申请号：US11354231

申请日：2006-02-15

申请人： Akira Hyogo ,  Satoshi Tanaka ,  Tetsuro Sawai ,  Kenichi Agawa ,  Hirotada Honma ,  Ryutaro Saito ,  Tomoki Hikichi ,  Keitaro Sekine

发明人： Akira Hyogo ,  Satoshi Tanaka ,  Tetsuro Sawai ,  Kenichi Agawa ,  Hirotada Honma ,  Ryutaro Saito ,  Tomoki Hikichi ,  Keitaro Sekine

IPC分类号： H04B1/26

CPC分类号： H04B1/26 ,  H03D7/165

摘要： A radio-frequency circuit comprises a low-noise amplifier, an NMOS mixer for converting a radio-frequency signal output from the low-noise amplifier into an intermediate-frequency signal, a polyphase filter for removing image noises, and a PMOS mixer for converting the intermediate-frequency signal passed through the polyphase filter into a baseband signal.

摘要翻译： 射频电路包括低噪声放大器，用于将从低噪声放大器输出的射频信号转换为中频信号的NMOS混频器，用于去除图像噪声的多相滤波器，以及用于转换的PMOS混合器 中频信号通过多相滤波器进入基带信号。

公开(公告)号：US06538537B2

公开(公告)日：2003-03-25

申请号：US10131482

申请日：2002-04-25

申请人： Masao Nishida ,  Tetsuro Sawai

发明人： Masao Nishida ,  Tetsuro Sawai

IPC分类号： H01P700

CPC分类号： H03B5/1852 ,  H01P1/2007

摘要： A chip capacitor is arranged on a microstrip conductor forming a microstrip line. The chip capacitor has a dielectric material and electrodes provided on both ends thereof. The electrodes of the chip capacitor are connected to the microstrip conductor. A resonance frequency is decided by the length of the microstrip conductor between the electrodes of the chip capacitor, the dielectric constant and the thickness of the dielectric substrate and the capacitance value of the chip capacitor.

公开(公告)号：US5559457A

公开(公告)日：1996-09-24

申请号：US215193

申请日：1994-03-21

申请人： Hisanori Uda ,  Tetsuro Sawai ,  Toshikazu Imaoka ,  Toshikazu Hirai ,  Yasoo Harada

发明人： Hisanori Uda ,  Tetsuro Sawai ,  Toshikazu Imaoka ,  Toshikazu Hirai ,  Yasoo Harada

IPC分类号： H03D7/00 ,  H03D7/12 ,  H03D7/14 ,  H03D9/06 ,  H04B1/28 ,  H04B1/26

CPC分类号： H03D7/1441 ,  H03D7/1458 ,  H03D2200/0007 ,  H03D2200/0084 ,  H03D2200/0088 ,  H03D7/125 ,  H03D9/0658

摘要： A double-balanced mixer circuit which consumes less power, and is capable of operating on a low voltage power source, because an output of a first signal having a phase lag of 90.degree. from a first frequency signal and an output of a second signal having a phase lead of 90.degree. over the first frequency signal are provided by means of a first phase shifter, an output of a third signal having a phase lag of 90.degree. from a second frequency signal and an output of fourth signal having a phase lead of 90.degree. over the second frequency signal are provided by means of a second phase shifter, thereby generating a radio frequency signal by mixing the first signal and the third signal in a first dual gate circuit, and generating a radio frequency signal by mixing the second signal and the fourth signal in a second dual gate circuit.

摘要翻译： 一种双平衡混频器电路，其消耗较少的功率，并且能够在低电压电源上工作，因为与第一频率信号相差90度的第一信号的输出和具有第一信号的第二信号的输出， 通过第一移相器提供90°以上的第一频率信号的相位引导，从第二频率信号输出具有90°的相位滞后的第三信号和具有相位引导的第四信号的输出 通过第二移相器提供第二频率信号的90°，从而通过在第一双门电路中混合第一信号和第三信号来产生射频信号，并且通过混合第二信号来产生射频信号 以及第二双门电路中的第四信号。

公开(公告)号：US5528509A

公开(公告)日：1996-06-18

申请号：US214821

申请日：1994-03-17

申请人： Tetsuro Sawai ,  Shigeyuki Murai ,  Tsutomu Yamaguchi ,  Yasoo Harada

发明人： Tetsuro Sawai ,  Shigeyuki Murai ,  Tsutomu Yamaguchi ,  Yasoo Harada

IPC分类号： H03F1/02 ,  G06F17/50 ,  H03G3/00 ,  H03F3/16

CPC分类号： G06F17/5063

摘要： The S-parameters of a transistor are measured at a plurality of bias points, and using a tentatively decided load resistance value, the S-parameters on the load curve are examined, based on which the power gain and input/output power characteristics are obtained to determine the optimum load. Then, by using a linear simulator, input and output circuits are designed so that the optimum load can be realized.

摘要翻译： 在多个偏置点测量晶体管的S参数，并且使用暂时确定的负载电阻值，检查负载曲线上的S参数，基于该参数获得功率增益和输入/输出功率特性 以确定最佳负载。 然后，通过使用线性模拟器，设计输入和输出电路，以便实现最佳负载。

公开(公告)号：US07907390B2

公开(公告)日：2011-03-15

申请号：US11693316

申请日：2007-03-29

申请人： Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

发明人： Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

IPC分类号： H01L23/34 ,  H05K5/00 ,  H05K7/00

CPC分类号： H01L23/142 ,  H01L23/3737 ,  H01L23/467 ,  H01L23/498 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/0265 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/10969 ,  H05K2203/0369 ,  H05K2203/049 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit device includes a metal substrate; and a plurality of circuit elements, mounted on the metal substrate, which electrically connects to the metal substrate. The metal substrate is made of a copper plate of high thermal conductivity. The metal substrate is demarcated into a plurality of sections by insulating films added with a filler for enhancing the thermal conductivity in resin. The circuit elements, which have respective independent operating potentials on a side of the metal substrate of the circuit elements, are respectively provided on separated copper plates.

摘要翻译： 电路装置包括金属基板; 以及多个电路元件，安装在与金属基板电连接的金属基板上。 金属基板由具有高导热性的铜板制成。 通过添加有填充剂的绝缘膜将金属基板划分为多个部分，以提高树脂中的导热性。 在电路元件的金属基板的一侧具有各自的独立工作电位的电路元件分别设置在分离的铜板上。