Abstract:
A planar STT-MRAM includes apparatus, made by a method of operating and a method of manufacturing a spin-torque magnetoresistive memory and a plurality of magnetoresistive memory element having a ferromagnetic recording layer forming a flux closure with a self-aligned ferromagnetic soft adjacent layer which has an electric field enhanced perpendicular anisotropy through an interface interaction with a dielectric functional layer. The energy switch barrier of the soft adjacent layer is reduced under an electric field along a perpendicular direction with a proper voltage on a digital line from a control circuitry; accordingly, the in-plane magnetization of the recording layer is readily reversible in a low spin-transfer switching current.
Abstract:
The invention disclosed a method to make hard mask with ultra-small dimensions for fabricating integrated nonvolatile random access memory, for example, a magnetic-random-access memory (MRAM), a resistance random access memory (RRAM), a phase change random access memory (PCRAM), or a ferroelectric random access memory (FRAM). Instead of directly depositing hard mask material on top of the memory film stack element, we first make ultra-small VIA holes on a pattern transfer molding (PTM) layer using a reverse memory mask, then fill in the hard mask material into the VIA holes within the PTM material. Ultra-small hard mask pillars are formed after removing the PTM material. To improve the adhesion of the hard mask pillars with the underneath memory stack element, a hard mask sustaining (HMS) layer is added below PTM. Using PTM as the mask, array of HM ditches are first formed in the HMS layer to implant a hard mask seed in it before filling the main portion of the hard mask in the PTM VIAs. For a better formation of the HMS ditches, an etching stop layer can be used below the HMS layer to allow some over-etch of the HMS without punching into the memory film stack. Due to a better materials adhesion between HMS and the hard mask, a stronger hard mask array can be formed.
Abstract:
Present invention includes an apparatus of and method of making a spin-transfer-torque magnetoresistive memory with three terminal magnetoresistive memory element(s) having highly conductive bottom electrodes overlaid on top of a SHE-metal layer in the regions outside of an MTJ stack. The memory cell has a bit line positioned adjacent to selected ones of the plurality of magnetoresistive memory elements to supply a reading current across the magnetoresistive element stack and two highly conductive bottom electrodes overlaid and electrically contacting on top of a SHE-metal layer in the outside of an MTJ region and to supply a bi-directional spin Hall effect recording current, and accordingly to switch the magnetization of the recording layer. Thus magnetization of a recording layer can be readily switched or reversed to the direction in accordance with a direction of a current along the SHE-metal layer by applying a low write current.
Abstract:
This invention is about a method to make magnetic random access memory with small footprint directly on CMOS VIA with a self-aligned etching process. The process schemes of the method proceeds as: (1) Etch MTJ and BE using one or more of RIE and/or IBE processes with Ta as hard mask; (2) Etch BE using one or more of RIE and/or IBE processes with Ta & sidewall protection layer on MTJ as hard mask; and (3) Etch a part of MTJ and BE using one or more of RIE and/or IBE processes with Ta & sidewall protection layer on top portion of MTJ as hard mask. All the three schemes lead the BE to be self-aligned to MTJ cells, the photo overlay margin is not necessary and circuits could be made extremely small with lower manufacturing cost; The invention also provides schemes to prevent the electrical shorting across the tunnel barrier layer. Through trimming and sidewall protection deposition process, device performance and electrical/magnetic properties could be greatly improved.
Abstract:
A planar STT-MRAM includes apparatus, made by a method of operating and a method of manufacturing a spin-torque magnetoresistive memory and a plurality of magnetoresistive memory element having a ferromagnetic recording layer forming a flux closure with a self-aligned ferromagnetic soft adjacent layer which has an electric field enhanced perpendicular anisotropy through an interface interaction with a dielectric functional layer. The energy switch barrier of the soft adjacent layer is reduced under an electric field along a perpendicular direction with a proper voltage on a digital line from a control circuitry; accordingly, the in-plane magnetization of the recording layer is readily reversible in a low spin-transfer switching current.
Abstract:
A STT-MRAM comprises apparatus and a method of manufacturing a plurality of magnetoresistive memory element having a dielectric thermal buffer layer between a thin top electrode of the MTJ element and a bit line, and a bit-line VIA electrically connecting the top electrode and the bit line having a vertical distance away from the location of the MTJ stack. In a laser thermal annealing, a short wavelength of a laser has a shallow thermal penetration depth and a high thermal resistance from the bit line to the MTJ stack only causes a temperature rise of the MTJ stack being much smaller than that of the bit line. As the temperature of the MTJ element during the laser thermal annealing of bit line copper layer is controlled under 300-degree C., possible damages on MTJ and magnetic property can be avoided.