公开(公告)号：US20130003322A1

公开(公告)日：2013-01-03

申请号：US13407612

申请日：2012-02-28

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H04N5/64 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/1034 ,  H05K2203/0278

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

摘要翻译： 根据一个实施例，电子设备包括壳体和壳体中的柔性印刷线路板。 柔性印刷布线板包括通孔，绝缘体，第一导电图案和第二导电图案。 通孔周围的绝缘体包括第一表面和与第一表面相对的第二表面。 第一导电图案连接到第一表面上的通孔。 第二导电图案连接到第二表面上的通孔。

公开(公告)号：US20120250269A1

公开(公告)日：2012-10-04

申请号：US13328439

申请日：2011-12-16

申请人： Akihiko HAPPOYA ,  Sadahiro TAMAI

发明人： Akihiko HAPPOYA ,  Sadahiro TAMAI

IPC分类号： H05K1/02

CPC分类号： H05K1/118 ,  H05K1/147 ,  H05K2201/10128

摘要： According to one embodiment, a television receiver includes a housing, a circuit board, and a flexible printed wiring board. The flexible printed wiring board is electrically connected to the circuit board, and includes an inner layer, a first outer layer, a second outer layer, a first conductive layer, a second conductive layer, and a conductive portion. The inner layer is provided with a first surface and a second surface. The first outer layer covers the first surface. The second outer layer covers the second surface. The first conductive layer is buried in the first surface and is in contact with the first outer layer. The second conductive layer is buried in the second surface and is in contact with the second outer layer. The conductive portion passes through the inner layer and electrically connects between the first conductive layer and the second conductive layer.

摘要翻译： 根据一个实施例，电视接收机包括壳体，电路板和柔性印刷线路板。 柔性印刷布线板电连接到电路板，并且包括内层，第一外层，第二外层，第一导电层，第二导电层和导电部分。 内层设置有第一表面和第二表面。 第一外层覆盖第一表面。 第二外层覆盖第二表面。 第一导电层被埋在第一表面中并且与第一外层接触。 第二导电层被埋在第二表面中并且与第二外层接触。 导电部分穿过内层并在第一导电层和第二导电层之间电连接。

公开(公告)号：US20070277998A1

公开(公告)日：2007-12-06

申请号：US11806203

申请日：2007-05-30

申请人： Daigo Suzuki ,  Jun Karasawa ,  Sadahiro Tamai

发明人： Daigo Suzuki ,  Jun Karasawa ,  Sadahiro Tamai

IPC分类号： H05K1/03

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2203/0228

摘要： According to one embodiment, a printed wiring board includes a first layer, a flexible sheet member disposed at a part on a surface of the first layer, and a second layer which is disposed on the first layer and the flexible sheet member, a part of the second layer which corresponds to the flexible sheet member including an opening region.

摘要翻译： 根据一个实施例，印刷电路板包括第一层，设置在第一层的表面上的一部分的柔性片构件，以及设置在第一层和柔性片构件上的第二层， 所述第二层对应于包括开口区域的柔性片构件。

公开(公告)号：US20130081568A1

公开(公告)日：2013-04-04

申请号：US13463580

申请日：2012-05-03

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： B05C5/02 ,  B05C13/02 ,  B05C11/00

CPC分类号： H05K3/022 ,  H05K1/189 ,  H05K3/0091 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/0191 ,  Y10T156/10

摘要： According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

公开(公告)号：US09155203B2

公开(公告)日：2015-10-06

申请号：US13463580

申请日：2012-05-03

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： B05B7/06 ,  B05C13/02 ,  H01L21/4763 ,  H05K3/02 ,  H05K3/40 ,  H05K1/18 ,  H05K3/28

CPC分类号： H05K3/022 ,  H05K1/189 ,  H05K3/0091 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/0191 ,  Y10T156/10

摘要： According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

摘要翻译： 根据一个实施例，一种装置包括：被配置为部分地在第一导体层的表面上提供第二导体层的器件; 配置为在所述第一导体层的表面上部分地提供第一绝缘层的器件; 在第一导体层和设置在第一导体层的表面上的第一绝缘层的状态下，将第一导体层，第二导体层，第一绝缘层和第三导体层集成的器件为 从与第一导体层相对的一侧覆盖第三导体层; 通过以通过积分获得的结构部分地去除第一导体层和第三导体层中的至少一个而形成导体图案的装置; 以及被配置为覆盖所述结构的两侧的装置。

公开(公告)号：US08767405B2

公开(公告)日：2014-07-01

申请号：US13093593

申请日：2011-04-25

申请人： Kota Tokuda ,  Sadahiro Tamai

发明人： Kota Tokuda ,  Sadahiro Tamai

IPC分类号： H05K5/00

CPC分类号： H05K1/189 ,  G06F1/1616 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2009

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

摘要翻译： 根据一个实施例，电子设备包括容纳在壳体中的壳体和柔性印刷电路板。 柔性印刷电路板包括基部，导电部分，第一粘合部分，盖部分，刚性加强板和第二粘合部分。 导电部分层压到基部。 第一粘合部分层压到导电部分并且包括第一开口。 盖部分层压到第一粘合剂部分并且包括与第一开口连续的第二开口。 刚性加强板与盖部相对。 第二粘合剂部分穿透第一和第二开口并插入在盖部分和加强板之间。

公开(公告)号：US20100326706A1

公开(公告)日：2010-12-30

申请号：US12797285

申请日：2010-06-09

申请人： Kiyomi Muro ,  Sadahiro Tamai

发明人： Kiyomi Muro ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0715

摘要： According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a conductive layer including a signal line and a ground line, a second insulating layer layered on the conductive layer and including openings open to above the ground line, a ground layer covering the signal line and electrically connected to the ground line, and a third insulating layer covering the ground layer. The ground layer includes first and second conductive pastes. The first conductive paste is filled in the openings so as to cover the ground line exposed to bottoms of the openings. The second conductive paste is applied so as to continuously cover the first conductive paste and the second insulating layer. The second conductive paste has a smaller volume resistivity than the first conductive paste.

摘要翻译： 根据一个实施例，电子设备包括柔性印刷线路板。 印刷布线板包括：导电层，包括信号线和接地线;层叠在导电层上的第二绝缘层，并且包括开到地线上方的开口;覆盖信号线并电连接到接地线的接地层 以及覆盖所述接地层的第三绝缘层。 接地层包括第一和第二导电浆料。 将第一导电膏填充在开口中以覆盖暴露于开口底部的接地线。 施加第二导电浆料以连续地覆盖第一导电浆料和第二绝缘层。 第二导电糊具有比第一导电糊更小的体积电阻率。

公开(公告)号：US20120228009A1

公开(公告)日：2012-09-13

申请号：US13473449

申请日：2012-05-16

申请人： Kiyomi Muro ,  Sadahiro Tamai

发明人： Kiyomi Muro ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0715

摘要： According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a plurality of insulating layers, a conductive layer, and a ground layer. The ground layer comprises a first conductive paste filled in a plurality of openings of a second insulating layer so as to cover a ground line exposed to bottoms of the plurality of openings. The ground layer further comprises a second conductive paste applied so as to continuously cover the first conductive paste and the second insulating layer. The first and second conductive pastes each contain conductive particles and binder resin that binds the conductive particles, and the second conductive paste has the conductive particles whose amount as compared to the binder resin is larger than the first conductive paste such that a volume resistivity of the second conductive paste becomes smaller than that of the first conductive paste.

摘要翻译： 根据一个实施例，电子设备包括柔性印刷线路板。 印刷布线板包括多个绝缘层，导电层和接地层。 接地层包括填充在第二绝缘层的多个开口中的第一导电膏，以覆盖暴露于多个开口的底部的接地线。 接地层还包括施加以连续覆盖第一导电浆料和第二绝缘层的第二导电浆料。 第一和第二导电膏各自包含导电颗粒和结合导电颗粒的粘合剂树脂，并且第二导电糊具有与粘合剂树脂相比的量大于第一导电糊的导电颗粒，使得其的体积电阻率 第二导电糊比第一导电糊小。

公开(公告)号：US20120051004A1

公开(公告)日：2012-03-01

申请号：US13093593

申请日：2011-04-25

申请人： Kota Tokuda ,  Sadahiro Tamai

发明人： Kota Tokuda ,  Sadahiro Tamai

IPC分类号： H05K1/02

CPC分类号： H05K1/189 ,  G06F1/1616 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2009

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

摘要翻译： 根据一个实施例，电子设备包括容纳在壳体中的壳体和柔性印刷电路板。 柔性印刷电路板包括基部，导电部分，第一粘合部分，盖部分，刚性加强板和第二粘合部分。 导电部分层压到基部。 第一粘合部分层压到导电部分并且包括第一开口。 盖部分层压到第一粘合剂部分并且包括与第一开口连续的第二开口。 刚性加强板与盖部相对。 第二粘合剂部分穿透第一和第二开口并插入在盖部分和加强板之间。

公开(公告)号：US20090244859A1

公开(公告)日：2009-10-01

申请号：US12345069

申请日：2008-12-29

申请人： Kiyomi MURO ,  Sadahiro Tamai

发明人： Kiyomi MURO ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618

摘要： According to one embodiment, a plurality of bumps are formed by repeatedly applying conductive paste to the conductive pattern portion, a plurality of bump-guiding openings are provided in the cover layer to align with the plurality of bumps, a plurality of crushed portions are formed by crushing heads of the plurality of bumps protruding from the cover layer through the bump-guiding openings, and a ground layer is formed on the cover layer. The ground layer is electrically connected to the plurality of crushed portions.

摘要翻译： 根据一个实施例，通过将导电膏重复地施加到导电图案部分而形成多个凸起，在覆盖层中设置多个凸起引导开口以与多个凸起对准，形成多个压碎部 通过从覆盖层突出的多个凸块的头部通过凸块引导孔破碎，并且在覆盖层上形成接地层。 接地层与多个压碎部电连接。