摘要:
Disclosed is a test instrument for measuring an analyte in a liquid sample by a noble metal colloid aggregation measurement method. The test instrument involves a reaction chamber in which at least the liquid sample is to be reacted with a reagent, wherein the reagent is adhered on at least a part of a surface constituting the reaction chamber in a dried state, and the reagent enables the measurement of the analyte by a noble metal colloid aggregation measurement method. The test instrument additionally involves a supply section for supplying the liquid sample and a flow path for delivering the liquid sample that has been supplied to the supply section to the reaction chamber, wherein the liquid sample that has been supplied to the supply section is delivered to the reaction chamber through the flow path to cause the liquid sample to be brought into contact with the reagent that has been adhered in a dried state, thereby producing a difference in pressure between the supply section and the reaction chamber for the purpose of dispersing the reagent in the liquid sample. When the test instrument is used, the measurement based on an absorbance at a visible region can be achieved, the analyte can be measured accurately within a short time, and the measurement suitable for a POCT field can be achieved.
摘要:
A shoe 1 of the present invention includes an upper 2 made of a stretchable fabric. The stretchable fabric is integrated with a sole 3 in a state of being stretched. Further, a method of manufacturing the shoe 1 of the present invention is a method of manufacturing a shoe using a stretchable fabric for the upper 2. The method includes steps of: producing an upper pattern using a last having a size smaller than that of the sole 3 as a base; producing the upper 2 with the stretchable fabric being stretched by stretching the upper pattern and fitting the upper pattern onto a last having a size that matches the sole 3; and integrating the upper 2 with the stretchable fabric being stretched with the sole 3.
摘要:
A nonvolatile memory device (21) is provided with a semiconductor substrate, a plurality of active regions (3) formed on the semiconductor substrate and extending in a band, a plurality of select active elements (23) formed in the active regions (3) and having a first impurity diffusion region and a second impurity diffusion region, a plurality of first electrodes (13) electrically connected to the first impurity diffusion region, a variable resistance layer (12) electrically connected to the first electrodes (13), and a plurality of second electrodes electrically connected to the variable resistance layer (12). Among the plurality of first electrodes (13) and the plurality of second electrodes, an array direction of at least one pair of the first electrodes (13) and the second electrodes that are electrically connected to the same variable resistance layer (12), and a direction of extension of the activation regions (3) are not parallel.
摘要:
A semiconductor device includes an interlayer insulating film formed on a semiconductor substrate to cover a lower electrode, a side-wall insulating film formed on a side wall of a contact hole formed through the interlayer insulating film to a depth reaching the lower electrode, a heater formed in the interior of the contact hole defined by the side-wall insulating film, and a phase-change film in contact with the top surface of the heater. The heater is in contact with the lower electrode at the bottom surface within the contact hole, and the top surface thereof is located at a lower level than that of the top surface of the side-wall insulating film. The top surface of the heater is located at a lower level than the top surface of the side-wall insulating film by an extent equal to or greater than a thickness of the phase-change film.
摘要:
A nonvolatile memory device has a first insulating layer, a variable resistance layer provided on the first insulating layer and having a variable resistance material, and a first electrode and second electrode electrically connected with the variable resistance layer. The variable resistance layer has a variable resistance region as a data storing region and a thickness-changing region continuously extending from the variable resistance region and gradually becoming thicker from the variable resistance region.
摘要:
An upper structure for a shoe that improves a fit of the heel portion during heel contact with the ground to the push off motion of a foot. The upper structure includes an upper body 30, and an outside upper member 31 that overlaps the lateral side of the upper body 30 to cover the talus T of the foot and whose bottom side edge portion 31a is fixedly attached to the bottom surface of the upper body 30. The rear end portion A of the bottom side edge portion 31a of the outside upper member 31 is located at the rear of the load centerline C of the calcaneus and the rear side edge portion 31c of the outside upper member 31 is provided separately from the upper body 30 at the rear of the talus T of the foot. The instep side edge portion 31b of the outside upper member 31 is connected to the shoelace 4. On the lateral side of the heel portion of the upper body 30 is provided a region 10 that is expandable and contractible in the longitudinal direction. The top end of the region 10 extends to the opening of the upper body 30 and the bottom end B of the region 10 is disposed in front of the load centerline C of the calcaneus and below the height h that corresponds to 55% of the lateral ankle height H of the foot.
摘要:
A semiconductor device includes a field insulating film, a channel stopper, and a diffusion layer. The field insulating film is formed on one major surface of a semiconductor substrate of a first conductivity type to surround an element region. The channel stopper of the first conductivity type is formed immediately below the field insulating film. The diffusion layer of an opposite conductivity type is formed to be adjacent to the channel stopper. The impurity concentration peak position of the diffusion layer substantially coincides with that of the channel stopper.
摘要:
A memory cell is implemented by a series combination of a field effect transistor and a trench-stacked type storage capacitor, and an accumulating electrode is held in contact with a source region of the field effect transistor through an extremely narrow gap between a side spacer on a gate electrode of the field effect transistor and an isolation layer extending along a primary trench nested with the source region, wherein the side spacer is formed from a deposited doped polysilicon film and the isolation layer is formed by thermally oxidizing a wall portion of the primary trench so that the extremely narrow gap is defined without lithographic techniques.
摘要:
In a method for making contact holes in a semiconductor device according to the invention, a first insulating film is deposited on a semiconductor chip, a plurality of contact holes are formed by sequentially performing isotropic etching and anisotropic etching, a second insulating film is deposited after the portions of the first insulating film constituting peripheries of the contact holes are subjected to a reflow process, and residue sidewall insulators are formed for the contact holes by keeping portions of the second insulating film only at sidewall portions of the contact holes when the second Insulating film is etched-back by an anisotropic etching process. The structure thus obtained enables to provide the contact holes whose peripheral edges are gently tapered thereby improving the step coverage of the Interconnect wiring material at the contact hole portions. This enables to avoid a possibility for the interconnect wiring layer to be broken, which may otherwise be caused by a poor step coverage of the interconnect wiring layer. The method enhances the production yield in the fabrication of the device and also enhances the reliability of the product.
摘要:
A sole structure 1 for a shoe comprises an upper sheet portion 2 disposed on the upper side of the sole structure, and a plurality of curved sheet portions 3 (31-35) that are provided on the lower surface of the upper sheet portion 2, that have downwardly convexedly curved portions 31-35, respectively, and that are disposed side by side and partially overlapped with each other in the longitudinal direction. Each of the curved sheet portions 31-35 has a first end A (A1-A5) and a second end B (B1-B5) on the opposite sides of each of the downwardly convexedly curved portions 31-35. The first end A of the curved sheet portion 3 is located on the front side of the sole structure 1 and fixed to the lower surface of the upper sheet portion 2. The second end B of the curved sheet portion 3 is located on the rear side of the sole structure 1 and fixed to the external surface of the adjacent curved sheet portion 3.