公开(公告)号：US08031474B2

公开(公告)日：2011-10-04

申请号：US11627844

申请日：2007-01-26

Applicant: Minoru Ogawa ,  Kazuto Nishimoto

Inventor： Minoru Ogawa ,  Kazuto Nishimoto

IPC: H05K1/18

CPC classification number: G02B6/138 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1533 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/186 ,  H05K3/365 ,  H05K3/386 ,  H05K3/4015 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0272 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/064 ,  H05K2201/09163 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.

Abstract translation: 印刷电路板组件具有多个印刷电路板，它们被堆叠而彼此机械地和电连接，并且提供了将相邻的两个印刷电路板彼此连接的连接层。 连接层包括绝缘部分和导电部分。 绝缘部分包含绝缘部件并且粘附到相邻的两个印刷电路板中的每一个。 导电部分穿过绝缘部分并连接相邻的两个印刷电路板的电极端子。

公开(公告)号：USD576919S1

公开(公告)日：2008-09-16

申请号：US29285124

申请日：2007-03-21

Applicant: Takanori Ito ,  Kuniaki Toyooka ,  Katsumi Nakashima ,  Kazumi Kowaki ,  Minoru Ogawa ,  Takeo Sowa ,  Shigetoshi Kozai

Designer： Takanori Ito ,  Kuniaki Toyooka ,  Katsumi Nakashima ,  Kazumi Kowaki ,  Minoru Ogawa ,  Takeo Sowa ,  Shigetoshi Kozai

公开(公告)号：US20060274510A1

公开(公告)日：2006-12-07

申请号：US11458178

申请日：2006-07-18

Applicant: Masakazu Nakada ,  Minoru Ogawa

Inventor： Masakazu Nakada ,  Minoru Ogawa

IPC: H05K7/00 ,  H01R43/00

CPC classification number: H05K3/4632 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0394 ,  H05K2203/0425 ,  Y10T29/49117

Abstract: To improve reliability of interlayer connection of a multilayer wiring board. Plural metal conductor pattern layers are formed on a base material made of thermoplastic resin. Then, high melting metal containing copper, low melting metal containing tin, and binder resin are packed into a via hole. Subsequently, predetermined heat and pressure are applied. Then, while half-melted metal mixture droplets of the low and high melting metals and melted binder resin are phase separated from each other, the surfaces of the conductor patterns that face the openings of the via and the low melting metal are alloyed with each other to form an alloy layer as well as the high and low meting metals are alloyed with each other to form a columnar-shaped interlayer connection part. As a result, an intermediate layer is formed between the outer surface of the columnar-shaped interlayer connection part and inner surface of the via hole.

Abstract translation: 为了提高多层布线基板的层间连接的可靠性。 在由热塑性树脂制成的基材上形成多个金属导体图案层。 然后，将含有铜，含锡低熔点金属和粘合剂树脂的高熔点金属包装在通孔中。 随后，施加预定的热和压力。 然后，当低熔点金属和高熔点金属和熔融粘合剂树脂的半熔融金属混合物液滴彼此相分离时，面向通孔和低熔点金属的开口的导体图案的表面彼此合金化 以形成合金层以及高低温金属彼此合金化以形成柱状的层间连接部。 结果，在柱状层间连接部的外表面和通孔的内表面之间形成中间层。

公开(公告)号：USD532732S1

公开(公告)日：2006-11-28

申请号：US29238986

申请日：2005-09-23

Applicant: Minoru Ogawa ,  Kuniaki Toyooka ,  Kenichi Onoue

Designer： Minoru Ogawa ,  Kuniaki Toyooka ,  Kenichi Onoue

公开(公告)号：USD528474S1

公开(公告)日：2006-09-19

申请号：US29239665

申请日：2005-09-29

Applicant: Hisao Hara ,  Kenichi Onoue ,  Minoru Ogawa ,  Yoshiyasu Neuchi

Designer： Hisao Hara ,  Kenichi Onoue ,  Minoru Ogawa ,  Yoshiyasu Neuchi

公开(公告)号：USD527839S1

公开(公告)日：2006-09-05

申请号：US29239340

申请日：2005-09-28

Applicant: Hisao Hara ,  Minoru Ogawa ,  Koji Katsuno

Designer： Hisao Hara ,  Minoru Ogawa ,  Koji Katsuno

公开(公告)号：US06797367B2

公开(公告)日：2004-09-28

申请号：US10357183

申请日：2003-02-03

Applicant: Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

Inventor： Minoru Ogawa ,  Masahiro Izumi ,  Shigeyasu Itoh ,  Shingetsu Yamada ,  Shuuji Suzuki ,  Hiroo Kurosaki

IPC: B32B300

CPC classification number: H05K3/4632 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/095 ,  H05K3/041 ,  H05K3/045 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2203/0108 ,  H05K2203/065 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T428/24917 ,  Y10T428/249994

Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.

Abstract translation: 具有耐热性高的多层布线基板，其能够低温熔融而不发生树脂流动，能够实现高精度，细致的导电布线，理想地应用于低体积高混合物制造配置，并且还具有 与使用这种多层布线板的半导体装置安装板一起提供对环境的影响很小，以及制造这种多层布线板的方法。 在多层布线板中，形成布线电路和通孔的槽形成在由包含结晶熔融峰值温度至少为260℃的聚芳基酮树脂的热塑性树脂组合物形成的绝缘基板和无定形聚醚酰亚胺树脂中 主要成分，金属箔被嵌入槽内，使得箔的表面突出到绝缘基板的表面，并且通过固化导电膏形成的导电材料用于填充通孔。

公开(公告)号：US4988631A

公开(公告)日：1991-01-29

申请号：US514263

申请日：1990-04-25

Applicant: Minoru Ogawa ,  Koichiro Sakamoto ,  Toshiyuki Tamura ,  Kazushige Katsuumi

Inventor： Minoru Ogawa ,  Koichiro Sakamoto ,  Toshiyuki Tamura ,  Kazushige Katsuumi

IPC: H01L27/146

CPC classification number: H01L27/14665 ,  H01L27/14643

Abstract: The present invention, in a photoelectric conversion device including a sensor portion and a thin film transistor portion for the purpose of switching disposed on the same substrate, is manufactured by, first, forming gate electrodes for a thin film transistor portion on the surface of the substrate by a thin film technique, and then, depositing an insulating film, an a-Si film, and electrodes on the insulating substrate so as to be laminated to one after another and commonly covering the sensor portion and the thin film transistor portion, whereby the sensor portion and the thin film transistor portion are enabled to be provided in one series of processing while the device is put in a vacuum chamber.

公开(公告)号：US09149762B2

公开(公告)日：2015-10-06

申请号：US13637950

申请日：2011-03-07

Applicant: Yasuyuki Matsumura ,  Takashi Maeda ,  Minoru Ogawa ,  Eiji Negishi

Inventor： Yasuyuki Matsumura ,  Takashi Maeda ,  Minoru Ogawa ,  Eiji Negishi

IPC: B01D53/22 ,  B01D67/00 ,  C23C18/16 ,  B01D69/12 ,  B01D71/02 ,  C01B3/50 ,  B01D69/10 ,  B01D65/10

CPC classification number: B01D53/228 ,  B01D65/108 ,  B01D67/0069 ,  B01D67/0083 ,  B01D69/105 ,  B01D69/12 ,  B01D71/022 ,  B01D2325/04 ,  C01B3/505 ,  C01B2203/0405 ,  C23C18/1633

Abstract: A defect-free hydrogen separation membrane includes a metal thin membrane. The metal thin membrane includes a first metal layer composed of palladium on a porous support without substantial penetration into surface pores of the porous support and a second metal layer on the first metal layer. The second metal layer is a product of palladium deposition and closes defects being open on the surface of the first metal layer.

Abstract translation: 无缺陷氢分离膜包括金属薄膜。 金属薄膜包括由多孔载体上的钯构成的第一金属层，而不会大量渗入多孔载体的表面孔中，而在第一金属层上包括第二金属层。 第二金属层是钯沉积的产物，并且闭合在第一金属层的表面上开口的缺陷。

公开(公告)号：US20090288537A1

公开(公告)日：2009-11-26

申请号：US12468940

申请日：2009-05-20

Applicant: Hisahiro Hirayama ,  Minoru Ogawa ,  Hideaki Tabuchi

Inventor： Hisahiro Hirayama ,  Minoru Ogawa ,  Hideaki Tabuchi

IPC: B26D7/01 ,  B26D5/08 ,  G05B15/00 ,  B26D7/27

CPC classification number: B26D1/08 ,  B26D5/00 ,  B26D7/015 ,  B26D2007/0056 ,  Y10T83/7647 ,  Y10T83/849 ,  Y10T83/8821

Abstract: A machine includes a table (2) on which a sheet bundle (3) is placed, a cutting blade (4) cutting four sides of the sheet bundle, a blade receiving plate (5) arranged on the table, a positioning block (6) arranged on the table in parallel to the blade receiving plate for slide movement in directions toward and away from the blade receiving plate, an operation data storage section (15) storing data of a order of cutting of sides of the sheet bundle, data of a distance between a cutting line of the positioning block and the sheet bundle for each cutting operation accordance with the order of cutting, and data of both a direction and an angle of rotation of the sheet bundle for each cutting operation, and an indication section (16) indicating the order of cutting. The indication section displays on a display (11) the order of the cutting operation, the distance between the cutting line of the positioning block and the sheet bundle for the cutting operation, and the image indicating the direction of the sheet bundle with respect to the positioning block of the cutting operation, based on the data stored in the operation data storage section each time the cutting operation is carried out.

Abstract translation: 一种机器包括一个放置纸摞（3）的工作台（2），切割片材摞四边的切割刀片（4），设置在工作台上的刀片接收板（5），定位块 ），其平行于所述刀片接收板，以朝向和远离所述刀片接收板的方向滑动;操作数据存储部（15），存储所述纸张束的侧面切割顺序的数据;数据 根据切割顺序，每个切割操作的定位块的切割线和片材束之间的距离，以及用于每个切割操作的片材摞的方向和旋转角度的数据以及指示部（ 16）表示切割顺序。 指示部分在显示器（11）上显示切割操作的顺序，定位块的切割线与切割操作的纸张束之间的距离，以及指示纸张捆的方向相对于 基于每次执行切割操作时存储在操作数据存储部中的数据，进行切割操作的定位块。