摘要:
There are provided a processing liquid that is capable of suppressing pattern collapse of a fine metal structure, such as a semiconductor device and a micromachine, and a method for producing a fine metal structure using the same. The processing liquid for suppressing pattern collapse of a fine metal structure, contains a phosphate ester and/or a polyoxyalkylene ether phosphate ester, and the method for producing a fine metal structure, uses the same.
摘要:
There are provided a processing liquid for suppressing pattern collapse of a microstructure formed of polysilicon which includes at least one compound selected from the group consisting of pyridinium halides containing an alkyl group having 12, 14 or 16 carbon atoms, and water; and a method for producing a microstructure using the processing liquid.
摘要:
There are provided a processing liquid for suppressing pattern collapse of a microstructure formed of silicon oxide which includes at least one compound selected from the group consisting of a fluoroalkyl group-containing ammonium halide, a fluoroalkyl group-containing betaine compound and a fluoroalkyl group-containing amine oxide compound, and water; and a method for producing a microstructure formed of silicon oxide using the processing liquid.
摘要:
There are provided a processing liquid for suppressing pattern collapse of a fine metal structure, containing at least one member selected from the group consisting of an ammonium halide having a fluoroalkyl group, a betaine compound having a fluoroalkyl group, and an amine oxide compound having a fluoroalkyl group, and a method for producing a fine metal structure using the same.
摘要:
A cleaning composition of a semiconductor device for laminating an organosiloxane-based thin film and a photoresist layer in this order on a substrate having a low dielectric interlayer insulation film and a copper wiring or a copper alloy wiring, then applying selective exposure and development treatments to the subject photoresist layer to form a photoresist pattern, subsequently applying a dry etching treatment to the organosiloxane-based thin film and the low dielectric interlayer insulation film while using this resist pattern as a mask and then removing the organosiloxane-based thin film, a residue generated by the dry etching treatment, a modified photoresist having been modified by the dry etching treatment and an unmodified photoresist layer located in a lower layer than the modified photoresist, the cleaning composition containing from 15 to 20% by mass of hydrogen peroxide, from 0.0001 to 0.003% by mass of an amino polymethylene phosphonic acid, from 0.02 to 0.5% by mass of potassium hydroxide and water and having a pH of from 7.5 to 8.5, is provided. Also, a method for manufacturing a semiconductor device using the subject cleaning composition is provided.
摘要:
A cleaning liquid which comprises at least one selected from potassium hydroxide or sodium hydroxide in an amount of 0.01 to 10% by weight, water-soluble organic solvent in an amount of 5 to 80% by weight, a corrosion inhibitor at least one selected from the group consisting of group IX metal of the Periodic Table, group IX metal alloy and group XI metal of the Periodic Table in an amount of 0.0001% by weight and water. The present provides a cleaning liquid and a cleaning method both capable of removing photoresists or its deposits and attached articles on the surface of treated substances such as organosiloxane-based anti-reflection film, configuration protective coat or so without corroding the treated substances, particularly low dielectric constant film, group IX metals of the Periodic Table and their alloy, and group XI metals of the Periodic Table.
摘要:
A cleaning liquid is provided, which comprises an aqueous solution containing nitric acid, sulfuric acid, a fluorine compound, and a basic compound. The concentration of water in the cleaning liquid is 80% by weight or more, and the pH value of the cleaning liquid is from 1 to less than 3. The cleaning liquid is effective for removing etching residues formed in a dry etching process from semiconductor devices and display devices without oxidizing and corroding their metal wirings, particularly, copper wirings and the materials of insulating films.
摘要:
Emission of NOx during acid-piclding treatment of metals in an aqueous solution containing at least nitric acid is controlled by the addition of hydrogen peroxide. The addition amount of hydrogen peroxide is minimized to avoid excessive addition by monitoring the potentiostatic electrolytic current of the solution or by combinedly monitoring the potentiostatic electrolytic current and the redox potential of the solution.
摘要:
There are provided a processing liquid for suppressing pattern collapse of a fine metal structure, containing at least one member selected from an imidazolium halide having an alkyl group containing 12, 14 or 16 carbon atoms, a pyridinium halide having an alkyl group containing 14 or 16 carbon atoms, an ammonium halide having an alkyl group containing 14, 16 or 18 carbon atoms, a betaine compound having an alkyl group containing 12, 14 or 16 carbon atoms, and an amine oxide compound having an alkyl group containing 14, 16 or 18 carbon atoms, and a method for producing a fine metal structure using the same.
摘要:
There are provided a processing liquid for suppressing pattern collapse of a microstructure which includes at least one compound selected from the group consisting of an imidazolium halide containing an alkyl group having 12, 14 or 16 carbon atoms, a pyridinium halide containing an alkyl group having 14 or 16 carbon atoms and an ammonium halide containing an alkyl group having 16 or 18 carbon atoms, and water; and a method for producing a microstructure formed of silicon oxide using the processing liquid.