Abstract:
This invention concerns peristaltic pumps and an adjustment mechanism for adjusting a compression force imposed on a hose. The adjustment mechanism includes at least a gear unit and a counterpart for the gear unit. The counterpart is operatively coupled to a rotor, wherein the gear unit in cooperation with the counterpart are configured to adjust a gap between the rotor outer surface and the pump cavity inner perimeter.
Abstract:
Manufacturing optical devices (e.g., for cameras) includes providing and allocating mount elements to lens modules wherein the mount elements are to be arranged within the optical devices to define a fixed separation distance between the lens modules and the image sensor plane. The mount elements have variable mount FFL sections by means of which the geometrical distance between the lens module and the image sensor plane is adjusted for each lens module, individually or in groups dependent on the optical properties of the lens modules, to compensate the variation of the lens module values among the lens modules, so that the focal planes of the lens modules falls into the image sensor plane.
Abstract:
The invention relates to an optical light guide element (1) having a first end section (8) with a light entrance area (6) designed for facing a light-transparent opening (50) and having a second end section (9) with a light exit area (7) designed for facing a light sensor (52), wherein the light entrance area (6) is defined by a surface area on the optical light guide element (1) which faces the light-transparent opening (50) and the first end section (8) forms an inclined surface area (2) which has an acute angle with the surface area of the light entrance area (6).
Abstract:
Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.
Abstract:
A spacer wafer (1) for a wafer stack (8) includes a spacer body (10) with a first surface (11) and a second surface (12), and is intended to be sandwiched between a first wafer (6) and a second wafer (7). That is, the spacer (1) is to keep a first wafer (6) placed against the first surface (11) and a second wafer (7) placed against the second surface (12) at a constant distance from each other. The spacer (1) provides openings (13) arranged such that functional elements (9) of the first wafer (6) and of the second wafer (7) can be aligned with the openings. The spacer (1) is formed from a forming tool (2) by means of a shape replication process and is preferably made of a material hardened by curing. In a preferred embodiment, at least one of the first and second surface (11, 12) has edges (15) separating the surface (11, 12) from the openings (13), and the thickness of the spacer wafer (1) at the edges (15) exceeds the thickness of the spacer wafer (1) at surface locations around the edges (15).
Abstract:
A method for manufacturing a wafer scale package including at least one substrate having replicated optical elements. The method uses two substrates, at least one of which is pre-shaped and has at least one recess in its front surface. Optical elements are replicated on a first substrate by causing a replication tool to abut the first substrate. The second substrate is then attached to the first substrate in an abutting relationship in such a way that the optical element is contained in a cavity formed by the recess in one of the substrates in combination with the other substrate. Thereby, a well defined axial distance between the optical elements and the second substrate is achieved. Consequently, well defined axial distance between the optical elements and any other objects attached to the second substrate, e.g. further optical elements, image capturing devices, light sources, is also established.
Abstract:
An optical element is manufactured using a replication tool comprising a negative structural feature defined in a replication side of the replication tool, and a peripheral feature formed in the replication side of the replication tool adjacent the negative structural feature. The negative structural feature defines the shape of the optical element. A replication material is disposed between a substrate and the replication tool, which are moved toward each other. The peripheral feature confines the replication material to a predetermined area of the substrate. The replication material can be hardened to form the optical element from the replication material attached to the substrate.
Abstract:
The invention concerns the combination of optical elements with active optoelectronic to monolithic optoelectronic systems. An optoelectronic wafer (1) comprising active optical components (2) is provided with (micro-)optical structures. The optical structures (12, 13) are allocated to the active optical components (2), i.e. they are configured to influence light impinging on the active optical components (2) and/or originating from them in a desired manner. To this end they are either aligned to the optical components or otherwise adjusted to serve this purpose. The combined active optical components/optical structures are separated for example by dicing the semiconductor wafer with the optical structures into parts containing at least one active optical component (2) and at least one optical structure (12, 13).
Abstract:
A light emitting device includes an electroluminescent element (1), a housing (2) and current supply device for the electroluminescent element. A micro-optical element (12) is coupled to the housing (2) and arranged such that it influences light emitted by the electroluminescent element (1). The micro-optical element may be made up of micro-optical structures on a surface of an at least partially transparent layer (11) coupled to the housing (2). The micro-optical structures may, for example, be manufactured by directly imprinting them on the at least partially transparent layer (11) coupled to the housing or by casting an at least partially transparent layer (11) including the electroluminescent element to a body of the light emitting device. The diffractive optical features of the micro-optical element (12) are designed according to the position, size and shape of the one or more electroluminescent elements (1), and output light distribution of the one or more electroluminescent elements (1).
Abstract:
An illumination system including at least one light source such as an electroluminescent element, e.g. a light emitting diode (LED), and at least one optical element whose surface is structured by diffraction and/or refraction type optical microstructures. In order to shape the beam, the optical element includes at least two sections whose optical microstructures and therefore optical properties are different from one another. The pattern of the microstructures in each of the at least two sections is, at least over a predetermined angular range, rotationally symmetric with respect to the optical axis or another symmetry axis.