摘要:
The invention relates to an optical light guide element (1) having a first end section (8) with a light entrance area (6) designed for facing a light-transparent opening (50) and having a second end section (9) with a light exit area (7) designed for facing a light sensor (52), wherein the light entrance area (6) is defined by a surface area on the optical light guide element (1) which faces the light-transparent opening (50) and the first end section (8) forms an inclined surface area (2) which has an acute angle with the surface area of the light entrance area (6).
摘要:
A light emitting device includes an electroluminescent element (1), a housing (2) and current supply device for the electroluminescent element. A micro-optical element (12) is coupled to the housing (2) and arranged such that it influences light emitted by the electroluminescent element (1). The micro-optical element may be made up of micro-optical structures on a surface of an at least partially transparent layer (11) coupled to the housing (2). The micro-optical structures may, for example, be manufactured by directly imprinting them on the at least partially transparent layer (11) coupled to the housing or by casting an at least partially transparent layer (11) including the electroluminescent element to a body of the light emitting device. The diffractive optical features of the micro-optical element (12) are designed according to the position, size and shape of the one or more electroluminescent elements (1), and output light distribution of the one or more electroluminescent elements (1).
摘要:
An optical module for a camera device, the camera device including an image capturing element arranged on a base substrate portion, and has a top lens element and optionally further lens elements for imaging an object on the image capturing element, and further a baffle defining a predetermined field of view of the image capturing element. The baffle includes a generally transparent baffle substrate portion having a front surface and a rear surface, a generally non-transparent first layer with a plurality of first openings on the front surface and a generally non-transparent second layer with a plurality of second openings on the rear surface. The top lens element is arranged on the front and/or the rear surface of the baffle substrate, which leads to a reduced number layers/substrates in the module and to a reduced number of reflections on material-air interfaces, for example. The baffle has an improved ability to suppress unwanted light and enables protection of the inner part of the device as well as manufacture on wafer scale.
摘要:
A light emitting device includes an electroluminescent element (1), a housing (2) and current supply device for the electroluminescent element. A micro-optical element (12) is coupled to the housing (2) and arranged such that it influences light emitted by the electroluminescent element (1). The micro-optical element may be made up of micro-optical structures on a surface of an at least partially transparent layer (11) coupled to the housing (2). The micro-optical structures may, for example, be manufactured by directly imprinting them on the at least partially transparent layer (11) coupled to the housing or by casting an at least partially transparent layer (11) including the electroluminescent element to a body of the light emitting device. The diffractive optical features of the micro-optical element (12) are designed according to the position, size and shape of the one or more electroluminescent elements (1), and output light distribution of the one or more electroluminescent elements (1).
摘要:
An illumination system including at least one light source such as an electroluminescent element, e.g. a light emitting diode (LED), and at least one optical element whose surface is structured by diffraction and/or refraction type optical microstructures. In order to shape the beam, the optical element includes at least two sections whose optical microstructures and therefore optical properties are different from one another. The pattern of the microstructures in each of the at least two sections is, at least over a predetermined angular range, rotationally symmetric with respect to the optical axis or another symmetry axis.
摘要:
A wafer scale package includes two or more substrates (wafers) that are stacked in an axial direction and a plurality of replicated optical elements. An optical device includes one or more optical elements. The wafer scale package and the device include one or more cavities that house the optical elements, while the end faces of the package or the device are planar and do not have replicated optical elements thereon. The number of double sided substrates is reduced, and design and manufacture of the optical device is improved.
摘要:
An illumination system including at least one light source such as an electroluminescent element, e.g. a light emitting diode (LED), and at least one optical element whose surface is structured by diffraction and/or refraction type optical microstructures. In order to shape the beam, the optical element includes at least two sections whose optical microstructures and therefore optical properties are different from one another. The pattern of the microstructures in each of the at least two sections is, at least over a predetermined angular range, rotationally symmetric with respect to the optical axis or another symmetry axis.
摘要:
An optical module for a camera device, the camera device including an image capturing element arranged on a base substrate portion, and has a top lens element and optionally further lens elements for imaging an object on the image capturing element, and further a baffle defining a predetermined field of view of the image capturing element. The baffle includes a generally transparent baffle substrate portion having a front surface and a rear surface, a generally non-transparent first layer with a plurality of first openings on the front surface and a generally non-transparent second layer with a plurality of second openings on the rear surface. The top lens element is arranged on the front and/or the rear surface of the baffle substrate, which leads to a reduced number layers/substrates in the module and to a reduced number of reflections on material-air interfaces, for example. The baffle has an improved ability to suppress unwanted light and enables protection of the inner part of the device as well as manufacture on wafer scale.