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公开(公告)号：US10384050B2
公开(公告)日：2019-08-20
申请号：US15316482
申请日：2015-06-24
Applicant: Mallika Kamarajugadda , Mark Breyen , Suping Lyu , Bernard Q. Li , Qin Zhang , Jacob Popp , Medtronic, Inc.
Inventor： Mallika Kamarajugadda , Mark Breyen , Suping Lyu , Bernard Q. Li , Qin Zhang , Jacob Popp
Abstract: An implantable medical leads has a conductor that includes one or more metal wires and one or more carbon nanotube wires extending in substantially the same direction as the one or more metal wires. Such conductors may result in less MRI-induced heating at electrodes of leads than conductors that do not contain carbon nanotubes.
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2.发明授权Etch-stop layers for patterning block structures for reducing thermal protrusion 有权蚀刻停止层，用于图案化用于减少热突起的块结构公开(公告)号：US07411264B2
公开(公告)日：2008-08-12
申请号：US10991569
申请日：2004-11-18
Applicant: Mallika Kamarajugadda , Michael C. Kautzky , Stacy C. Wakham , David C. Seets , Arun Natarajun
Inventor： Mallika Kamarajugadda , Michael C. Kautzky , Stacy C. Wakham , David C. Seets , Arun Natarajun
IPC: H01L29/82
CPC classification number: G11B5/3163 , G11B5/1278 , G11B5/3106 , G11B5/3133 , G11B5/3136
Abstract: The present invention provides a thin-film structure that includes an etch-stop layer having a first side and a second side, a patterned compensation layer for dissipating thermal energy, and an etch-vulnerable layer, where the etch-stop layer substantially impedes etching. The patterned compensation layer is adjacent the first side of the etch-stop layer, and the etch-vulnerable layer is adjacent the second side of the etch-stop layer.
Abstract translation: 本发明提供了一种薄膜结构，其包括具有第一侧和第二侧的蚀刻停止层，用于耗散热能的图案化补偿层和蚀刻弱化层，其中蚀刻停止层基本上阻止蚀刻 。 图案化补偿层邻近蚀刻停止层的第一侧，并且蚀刻脆弱层与蚀刻停止层的第二侧相邻。
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公开(公告)号：US20100330800A1
公开(公告)日：2010-12-30
申请号：US12492206
申请日：2009-06-26
Applicant: Ivan Petrov Ivanov , Wei Tian , Mallika Kamarajugadda , Paul E. Anderson
Inventor： Ivan Petrov Ivanov , Wei Tian , Mallika Kamarajugadda , Paul E. Anderson
IPC: H01L21/768 , B05D1/36 , C23C14/24 , C23C16/50 , C23C16/515 , C23C14/34 , C23C14/38
CPC classification number: H01L21/76846 , C23C14/024 , C23C14/16 , C23C14/34 , H01L21/76856 , H01L23/53238 , H01L2924/0002 , H01L2924/00
Abstract: A method of forming a layer of alpha-tantalum on a substrate including the steps of depositing a layer of titanium nitride on a substrate; and depositing a layer of alpha-tantalum on the layer of titanium nitride, wherein the deposition of the alpha-tantalum is carried out at temperatures below about 300° C.
Abstract translation: 一种在衬底上形成α钽层的方法，包括以下步骤：在衬底上沉积氮化钛层; 以及在所述氮化钛层上沉积一层α-钽，其中所述α-钽的沉积在低于约300℃的温度下进行。
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4.发明申请Etch-stop layers for patterning block structures for reducing thermal protrusion 有权蚀刻停止层，用于图案化用于减少热突起的块结构公开(公告)号：US20060102956A1
公开(公告)日：2006-05-18
申请号：US10991569
申请日：2004-11-18
Applicant: Mallika Kamarajugadda , Michael Kautzky , Stacey Wakeham , David Seets , Arun Natarajan
Inventor： Mallika Kamarajugadda , Michael Kautzky , Stacey Wakeham , David Seets , Arun Natarajan
IPC: H01L23/62
CPC classification number: G11B5/3163 , G11B5/1278 , G11B5/3106 , G11B5/3133 , G11B5/3136
Abstract: The present invention provides a thin-film structure that includes an etch-stop layer having a first side and a second side, a patterned compensation layer for dissipating thermal energy, and an etch-vulnerable layer, where the etch-stop layer substantially impedes etching. The patterned compensation layer is adjacent the first side of the etch-stop layer, and the etch-vulnerable layer is adjacent the second side of the etch-stop layer.
Abstract translation: 本发明提供了一种薄膜结构，其包括具有第一侧和第二侧的蚀刻停止层，用于耗散热能的图案化补偿层和蚀刻弱化层，其中蚀刻停止层基本上阻止蚀刻 。 图案化补偿层邻近蚀刻停止层的第一侧，并且蚀刻脆弱层与蚀刻停止层的第二侧相邻。
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公开(公告)号：US08039394B2
公开(公告)日：2011-10-18
申请号：US12492206
申请日：2009-06-26
Applicant: Ivan Petrov Ivanov , Wei Tian , Mallika Kamarajugadda , Paul E. Anderson
Inventor： Ivan Petrov Ivanov , Wei Tian , Mallika Kamarajugadda , Paul E. Anderson
IPC: H01L21/44
CPC classification number: H01L21/76846 , C23C14/024 , C23C14/16 , C23C14/34 , H01L21/76856 , H01L23/53238 , H01L2924/0002 , H01L2924/00
Abstract: A method of forming a layer of alpha-tantalum on a substrate including the steps of depositing a layer of titanium nitride on a substrate; and depositing a layer of alpha-tantalum on the layer of titanium nitride, wherein the deposition of the alpha-tantalum is carried out at temperatures below about 300° C.
Abstract translation: 一种在衬底上形成α钽层的方法，包括以下步骤：在衬底上沉积氮化钛层; 以及在所述氮化钛层上沉积一层α-钽，其中所述α-钽的沉积在低于约300℃的温度下进行。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20090274932A1
公开(公告)日：2009-11-05
申请号：US12150980
申请日：2008-05-02
Applicant: Mallika Kamarajugadda , Jixiong Han , Joseph Skorjanec
Inventor： Mallika Kamarajugadda , Jixiong Han , Joseph Skorjanec
CPC classification number: G11B5/8404 , C23C14/352 , G11B5/7325 , G11B5/7379 , G11B5/851
Abstract: A sputtered metal film recording medium includes a substrate, a texture promotion layer sputtered on a first side of the substrate, a seed layer deposited on the texture promotion layer, an intermediate layer including a chromium alloy deposited on the seed layer, and a longitudinal magnetic recording layer including a cobalt alloy deposited on the intermediate layer. The texture promotion layer configures in-plane orientation of a cobalt structure in the magnetic recording layer.
Abstract translation: 溅射金属膜记录介质包括基板，溅射在基板的第一面上的纹理促进层，沉积在纹理促进层上的晶种层，沉积在晶种层上的包含铬合金的中间层以及纵向磁性 包括沉积在中间层上的钴合金的记录层。 纹理促进层构成磁记录层中的钴结构的面内取向。
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公开(公告)号：US06842308B1
公开(公告)日：2005-01-11
申请号：US09845619
申请日：2001-04-30
Applicant: Ladislav R. Pust , Youping Mei , Sunita Gangopadhyay , Jumna P. Ramdular , Mallika Kamarajugadda
Inventor： Ladislav R. Pust , Youping Mei , Sunita Gangopadhyay , Jumna P. Ramdular , Mallika Kamarajugadda
IPC: G11B5/60
CPC classification number: G11B5/6005 , G11B5/3136
Abstract: A head for a magnetic drive that includes a substrate with a thermal expansion rate CTE1. A transducer in the head has a bond to the substrate and has a transducer thermal expansion rate CTE2 that is greater than CTE1. A restraint layer in the substrate has a bond to one side of the transducer and has a first restraint layer thermal expansion rate CTE3 that is lower than CTE1. The restraint layer restrains protrusion of the transducer beyond the substrate at higher operating temperatures.
Abstract translation: 一种用于磁驱动器的磁头，其包括具有热膨胀率CTE1的基板。 头部中的换能器具有与基底的结合，并且具有大于CTE1的换能器热膨胀率CTE2。 衬底中的约束层具有与换能器的一侧的结合，并且具有低于CTE1的第一约束层热膨胀率CTE3。 限制层在更高的工作温度下限制了换能器超出基板的突出。
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公开(公告)号：US20170189669A1
公开(公告)日：2017-07-06
申请号：US15316482
申请日：2015-06-24
Applicant: Mallika KAMARAJUGADDA , Mark BREYEN , Suping LYU , Bernard Q. LI , Qin ZHANG , Jacob POPP , Medtronic, Inc.
Inventor： Mallika Kamarajugadda , Mark Breyen , Suping Lyu , Bernard Q. Li , Qin Zhang , Jacob Popp
CPC classification number: A61N1/00 , A61N1/04 , A61N1/05 , A61N1/086 , A61N1/3718 , G01R33/285 , G01R33/288
Abstract: An implantable medical leads has a conductor that includes one or more metal wires and one or more carbon nanotube wires extending in substantially the same direction as the one or more metal wires. Such conductors may result in less MRI-induced heating at electrodes of leads than conductors that do not contain carbon nanotubes.
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9.发明授权Negative thermal expansion dielectrics for thermal pole tip protrusion compensation 有权用于热极尖突起补偿的负热膨胀电介质公开(公告)号：US07102853B2
公开(公告)日：2006-09-05
申请号：US10607894
申请日：2003-06-27
Applicant: Declan Macken , Jeremy Adam Thurn , Mallika Kamarajugadda , Michael Christopher Kautzky
CPC classification number: G11B5/3136 , G11B5/10 , G11B5/102 , G11B5/105 , G11B5/3103 , G11B5/3133 , G11B5/3163 , G11B5/332 , G11B5/3903 , G11B5/40
Abstract: A slider having a magnetic read/write head and including, a base coat, a reader element having a transducer, a writer element, the writer element including at least one conductive coil, the coil being electrically insulated by a composition which has a negative coefficient of thermal expansion, and an overcoat.
Abstract translation: 一种具有磁读/写头的滑块，包括底涂层，具有换能器的读取器元件，写入器元件，所述写入器元件包括至少一个导电线圈，所述线圈由具有负系数的组合物电绝缘 的热膨胀和外涂层。
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公开(公告)号：US06989963B2
公开(公告)日：2006-01-24
申请号：US10421538
申请日：2003-04-23
Applicant: Michael Christopher Kautzky , Mallika Kamarajugadda , Song Sheng Xue
Inventor： Michael Christopher Kautzky , Mallika Kamarajugadda , Song Sheng Xue
IPC: G11B5/147
CPC classification number: B82Y25/00 , B82Y10/00 , G11B5/17 , G11B5/313 , G11B5/3133 , G11B5/3136 , G11B5/3909 , G11B5/3967 , G11B5/40 , G11B2005/3996
Abstract: A data transducer is used for writing data to a disc and has an air bearing surface. The data transducer also includes a bottom pole and a top pole separated from the bottom pole at the air bearing surface by a write gap. A core is formed between the bottom pole and the top pole and a conductive coil is positioned within the core. The data transducer further includes an insulator conformed to turns of the conductive coil and a core fill deposited within the entire core wherein the core fill is a high-thermal conductivity material. The insulator and core fill dissipate thermal energy away from the conductive coil.
Abstract translation: 数据传感器用于将数据写入盘中并具有空气轴承表面。 数据传感器还包括底极和顶极，其通过写入间隙与空气支承表面处的底极分离。 在底极和顶极之间形成芯，并且导电线圈定位在芯内。 数据传感器还包括符合导电线圈的匝和沉积在整个芯内的芯填充物的绝缘体，其中芯填充物是高导热性材料。 绝缘体和芯填充物将热能远离导电线圈。
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