知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.016 seconds)

    Separator systems for electrochemical cells
    6.
    发明申请
    Separator systems for electrochemical cells 审中-公开
    电化学电池分离系统

    公开(公告)号：US20070201186A1

    公开(公告)日：2007-08-30

    申请号：US11363610

    申请日：2006-02-28

    Applicant: John Norton ,  Thomas Miltich ,  Anthony Rorvick ,  Christian Nielsen ,  Mark Breyen ,  Joseph Lessar ,  Paul Pignato

    Inventor： John Norton ,  Thomas Miltich ,  Anthony Rorvick ,  Christian Nielsen ,  Mark Breyen ,  Joseph Lessar ,  Paul Pignato

    IPC: H01G9/00

    CPC classification number: H01G9/02

    Abstract: A capacitor cell is presented. The capacitor cell includes an anode, a cathode spaced from and operatively associated with the anode, an electrolyte operatively associated with the anode and the cathode. A layered separator includes a plurality of separator material layers disposed between the anode and cathode. The plurality of separator material layers includes a first layer and a second layer. The first layer is characterized by a first value of a physical property and the second layer is characterized by a second value of the physical property.

    Abstract translation: 提出了一个电容器单元。 电容器电池包括阳极，与阳极间隔开并且与阳极可操作地相关联的电解质，与阳极和阴极可操作地连接的电解质。 分层隔板包括设置在阳极和阴极之间的多个隔板材料层。 多个隔板材料层包括第一层和第二层。 第一层的特征在于物理性质的第一值，第二层的特征在于物理性质的第二值。

    Methods of applying separator members to an electrode of a capacitor
    7.
    发明申请
    Methods of applying separator members to an electrode of a capacitor 有权
    将分离器部件施加到电容器的电极的方法

    公开(公告)号：US20050117277A1

    公开(公告)日：2005-06-02

    申请号：US10618048

    申请日：2003-07-11

    Applicant: John Norton ,  Anthony Rorvick ,  Mark Breyen ,  Paul Pignato ,  Thomas Miltich

    Inventor： John Norton ,  Anthony Rorvick ,  Mark Breyen ,  Paul Pignato ,  Thomas Miltich

    IPC: H01G9/02

    CPC classification number: H01G9/02 ,  Y10T29/41 ,  Y10T29/417

    Abstract: A sealed electrode enclosed in separator material is provided for use in a capacitor cell. The separator may either be adhered to the electrode in sheets, or may be formed into a pouch, which is used to enclose the electrode. A method of preparing the electrode sealed with separator is described in which an adhesive is used to secure the pouch to the electrode before sealing it. The prefabricated electrode and separator combination may be used in both coiled capacitor cells and flat capacitor cells that are often used in implantable medical devices. Electrodes prepared in this fashion can be efficiently and reliably aligned within the case of a capacitor cell, and have no exposed electrode surfaces that could lead to short-circuiting within the cell.

    Abstract translation: 封闭在隔板材料中的密封电极被提供用于电容器电池中。 分离器可以以片状粘合到电极上，或者可以形成为用于包围电极的袋。 描述了用分离器密封的电极的制备方法，其中使用粘合剂将密封袋密封到电极上。 预制电极和分离器组合可以用于经常在可植入医疗装置中使用的线圈式电容器电池和扁平电容器电池。 以这种方式制备的电极可以在电容器电池的情况下被有效且可靠地对准，并且没有暴露的电极表面可能导致电池内的短路。

    INTERCONNECTION OF CONDUCTOR TO FEEDTHROUGH
    9.
    发明申请
    INTERCONNECTION OF CONDUCTOR TO FEEDTHROUGH 有权
    导体互相连接

    公开(公告)号：US20130035733A1

    公开(公告)日：2013-02-07

    申请号：US13196698

    申请日：2011-08-02

    Applicant: Mark Breyen ,  Tom Miltich ,  Gordon Munns

    Inventor： Mark Breyen ,  Tom Miltich ,  Gordon Munns

    IPC: A61N1/375 ,  H05K3/00 ,  H05K7/00

    CPC classification number: A61N1/3754 ,  B23K35/3013 ,  B23K35/322 ,  B23K2101/38 ,  Y10T29/49149

    Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof

    Abstract translation: 互连导体和可植入医疗装置的密封馈通的方法包括将导线焊接到馈通上的垫。 馈通包括陶瓷绝缘体和通过气密地结合到绝缘体上的通孔。 通道包括铂金。 焊盘接合到绝缘体并且电连接到通孔，包括铂，并且具有至少50μm的厚度。 铅包括铌，铂，钛，钽，钯，金，镍，钨及其氧化物及其合金中的至少一种

    Electrical interconnection structures and method
    10.
    发明申请
    Electrical interconnection structures and method 有权
    电互连结构及方法

    公开(公告)号：US20070179555A1

    公开(公告)日：2007-08-02

    申请号：US11343107

    申请日：2006-01-30

    Applicant: Rajesh Iyer ,  William Taylor ,  Joseph Lessar ,  Mark Breyen ,  Daniel Koch

    Inventor： Rajesh Iyer ,  William Taylor ,  Joseph Lessar ,  Mark Breyen ,  Daniel Koch

    IPC: A61N1/00

    CPC classification number: A61N1/3754

    Abstract: An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.

    Abstract translation: 用于可植入医疗设备的电互连结构包括具有从其延伸的销的馈通。 销定义第一端和中间部分。 在销的第一端形成接合表面，并且接合表面的表面积大于其中间部分的销的横截面面积。

Patent Agency Ranking