公开(公告)号：US07751923B2

公开(公告)日：2010-07-06

申请号：US10541355

申请日：2003-12-09

申请人： Lothar Koenig ,  Bartholomeus Trommelen

发明人： Lothar Koenig ,  Bartholomeus Trommelen

IPC分类号： B29C39/00 ,  B29C45/76

CPC分类号： B29C47/92 ,  B29C47/0021 ,  B29C47/16 ,  B29C2947/92152 ,  B29C2947/92428 ,  B29C2947/92647 ,  B29C2947/92695 ,  B29C2947/92704 ,  B29C2947/92876 ,  B29C2947/92904 ,  B29C2947/92923

摘要： A process for the automatic control of the thickness of extruded film lowers the deviations in the thickness of the film more quickly after the start of the extrusion process. The process includes the measurement of the thickness profile of the film just extruded by means of a thickness-measuring probe. The thickness-measuring probe is moved along the surface of the film substantially perpendicular to the conveying direction of the extruded film. The thickness-measuring probe records a thickness profile of the film for each measuring cycle at least over parts of the expansion of the film perpendicular to its conveying direction. While providing statistical values in relation to older measured values, the latest measured values during a predetermined time-frame at the start of the extrusion process are more heavily weighted by a computer than those measured during the normal operation.

摘要翻译： 自动控制挤压薄膜厚度的方法可以在挤出过程开始之后更快地降低薄膜厚度的偏差。 该过程包括通过厚度测量探针刚刚挤出的膜的厚度分布的测量。 厚度测量探针沿膜的表面基本上垂直于挤出膜的输送方向移动。 厚度测量探针记录每个测量周期的薄膜的厚度分布至少在垂直于其输送方向的薄膜的膨胀部分上。 在提供与旧的测量值相关的统计值的同时，在挤出过程开始时的预定时间段内的最新测量值比计算机在正常操作期间测得的更重。

公开(公告)号：US08432024B2

公开(公告)日：2013-04-30

申请号：US12768134

申请日：2010-04-27

申请人： Manfred Schneegans ,  Lothar Koenig

发明人： Manfred Schneegans ,  Lothar Koenig

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3735 ,  H01L23/24 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/8382 ,  H01L2224/85045 ,  H01L2224/85054 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85948 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2924/0002 ,  H01L2924/05432 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/83205 ,  H01L2924/01006

摘要： An integrated circuit includes a chip including a copper bond pad metallization, and a copper bond wire including a copper ball. The copper ball is bonded directly to the copper bond pad.

摘要翻译： 集成电路包括包括铜焊垫金属化的芯片和包括铜球的铜焊丝。 铜球直接与铜焊盘接合。

公开(公告)号：US20060216369A1

公开(公告)日：2006-09-28

申请号：US10541355

申请日：2003-12-09

申请人： Lothar Koenig ,  Bartholomeus Trommelen

发明人： Lothar Koenig ,  Bartholomeus Trommelen

IPC分类号： B29C47/92

CPC分类号： B29C47/92 ,  B29C47/0021 ,  B29C47/16 ,  B29C2947/92152 ,  B29C2947/92428 ,  B29C2947/92647 ,  B29C2947/92695 ,  B29C2947/92704 ,  B29C2947/92876 ,  B29C2947/92904 ,  B29C2947/92923

摘要： The present invention relates to a process for the automatic control of the thickness of extruded film (8). The purpose of the invention is to lower the deviations in the thickness of the film more quickly after the start of the extrusion process. The process involves the measurement of the thickness profile of the film (8) just extruded by means of a thickness-measuring probe (12). The thickness-measuring probe (12) is moved along the surface of the film substantially perpendicular (x) to the conveying direction (z) of the extruded film (8). The thickness-measuring probe (12) records a thickness profile (P) of the film (8) for each measuring cycle (MZ) at least over parts of the expansion of the film (8) perpendicular (x) to its conveying direction (z). The process pursuant to the present invention is characterized by the fact that while providing the statistical values in relation to the older measured values the latest measured value(s) during a predetermined time-frame at the start of the extrusion process are more heavily weighted by the computer (14) than those measured during the normal operation.

摘要翻译： 本发明涉及自动控制挤出薄膜（8）的厚度的方法。 本发明的目的是在挤出过程开始之后更快地降低薄膜厚度的偏差。 该过程涉及通过厚度测量探针（12）刚刚挤出的膜（8）的厚度分布的测量。 厚度测量探针（12）沿着膜的表面基本上垂直于（x）移动到挤压膜（8）的输送方向（z）。 厚度测量探针（12）将薄膜（8）的每个测量循环（MZ）的厚度分布（P）至少在薄膜（8）的垂直（x）的膨胀部分的至少一部分上传送到其输送方向（ z）。 根据本发明的方法的特征在于，在提供关于较旧测量值的统计值的同时，在挤出过程开始时的预定时间段内的最新测量值被更加重地加权 计算机（14）比正常操作时测量的那些。

公开(公告)号：US20140193244A1

公开(公告)日：2014-07-10

申请号：US14237365

申请日：2012-08-06

申请人： Thomas Koerner ,  Lothar Koenig ,  William Passemard

发明人： Thomas Koerner ,  Lothar Koenig ,  William Passemard

IPC分类号： F01D25/16

CPC分类号： F01D25/16 ,  F01D25/186 ,  F01M5/021 ,  F02B39/14 ,  F05D2220/40 ,  F05D2240/53

摘要： A bearing housing (1) of an exhaust-gas turbocharger (2) having an oil inlet (3) which is connected to a connecting region (4) of an oil supply line (5), The connecting region (4) of the oil supply line (5) is in the form of a siphon (6).

摘要翻译： 具有与供油管路（5）的连接区域（4）连接的油入口（3）的废气涡轮增压器（2）的轴承箱（1），油的连接区域（4） 供应管线（5）为虹吸管（6）的形式。

公开(公告)号：US20110260307A1

公开(公告)日：2011-10-27

申请号：US12768134

申请日：2010-04-27

申请人： Manfred Schneegans ,  Lothar Koenig

发明人： Manfred Schneegans ,  Lothar Koenig

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L23/3735 ,  H01L23/24 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/8382 ,  H01L2224/85045 ,  H01L2224/85054 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85948 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2924/0002 ,  H01L2924/05432 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/83205 ,  H01L2924/01006

摘要： An integrated circuit includes a chip including a copper bond pad metallization, and a copper bond wire including a copper ball. The copper ball is bonded directly to the copper bond pad.

摘要翻译： 集成电路包括包括铜焊垫金属化的芯片和包括铜球的铜焊丝。 铜球直接与铜焊盘接合。

公开(公告)号：US20060244167A1

公开(公告)日：2006-11-02

申请号：US10541363

申请日：2003-12-09

申请人： Bartholomeus Trommelen ,  Lothar Koenig

发明人： Bartholomeus Trommelen ,  Lothar Koenig

IPC分类号： B29C47/92

CPC分类号： G05D5/03 ,  B29C48/08 ,  B29C48/251 ,  B29C48/92 ,  B29C2037/90 ,  B29C2948/92152 ,  B29C2948/92428 ,  B29C2948/926 ,  B29C2948/92647 ,  B29C2948/92695 ,  B29C2948/92704 ,  B29C2948/92876 ,  B29C2948/92904 ,  B29C2948/92923

摘要： The present invention relates to a process for the automatic control of the thickness of extruded film (8). The purpose of the invention is to lower the deviations in the thickness of the film more quickly after the start of the extrusion process. The process involves the measurement of the thickness profile of the film just extruded (8) by means of a thickness-measuring probe (12). The thickness-measuring probe (12) is moved along the surface of the film substantially perpendicular (x) to the conveying direction (z) of the extruded film (8). The thickness-measuring probe (12) records for each measuring cycle (MZ) a thickness profile (P) of the film (8) at least over parts of the expansion of the film (8) perpendicular (x) to its conveying direction (z). The process pursuant to the present invention is characterized by the fact that during a predetermined time-frame at the start of the extrusion process measured values or information derived therefrom using or for a greater number of measuring cycles is made accessible to the computer (14) than those recorded by the thickness-measuring probe (12) in a time-frame of similar length during the normal operation and that the computer (14) takes into account these measured values while providing the statistical values.

摘要翻译： 本发明涉及自动控制挤出薄膜（8）的厚度的方法。 本发明的目的是在挤出过程开始之后更快地降低薄膜厚度的偏差。 该方法包括通过厚度测量探针（12）测量刚刚挤出（8）的膜的厚度分布。 厚度测量探针（12）沿着膜的表面基本上垂直于（x）移动到挤压膜（8）的输送方向（z）。 每个测量循环（MZ）的厚度测量探针（MZ）记录薄膜（8）的厚度分布（P）至少部分垂直于（x）的输送方向的薄膜（8）的膨胀的至少一部分 z）。 根据本发明的方法的特征在于，在挤出过程开始时的预定时间段期间，计算机（14）使得测量值或从其导出的信息或更大数量的测量循环可访问， 比正常操作中长度相同的时间段由厚度测量探针（12）记录的那些数据计算机计算机（14）在提供统计值的同时考虑这些测量值。