摘要:
Provided is an optical element manufacturing method that is capable of forming various kinds of shapes and capable of achieving sophisticated functions, improved yields, and cost reductions. The method includes: a step that applies a transparent photosensitive resin on a transparent substrate with light-shielding patterns provided thereon; a step that forms transparent layers by performing patterning through irradiating exposure light of an arbitrary amount on the transparent photosensitive resin via the transparent substrate with the light-shielding patterns provided thereon; a step that forms light absorption layers by filling a black curable resin between the transparent layers; and an irradiation step that irradiates the exposure light in an oblique direction to the surface of the transparent substrate where the light-shielding patterns are formed in a state where the transparent substrate is being bent.
摘要:
A thin film transistor (TFT) is provided which is capable of reducing leakage currents in a polycrystalline silicon TFT without causing an increase in manufacturing processes. Source/drain regions of an activated layer of the TFT to be formed in a circuit region and pixel region formed on a glass substrate of a liquid crystal display panel for a mobile phone is formed so that its boron impurity falls within a range of 2.5×1018/cm3 to 5.5×1018/cm3 and its impurity activation falls within a range of 1% to 7%.
摘要翻译:提供薄膜晶体管(TFT),其能够减少多晶硅TFT中的漏电流,而不会导致制造工艺的增加。 形成在电路区域中的TFT的激活层的源极/漏极区域和形成在用于移动电话的液晶显示面板的玻璃基板上的像素区域形成为使得其硼杂质落入2.5× 1018 / cm 3至5.5×10 18 / cm 3,其杂质活化在1%至7%的范围内。
摘要:
A pixel circuit substrate includes a first interlayer insulating film which is made of an inorganic material at least in a source and drain regions of a thin film transistor. A contact hole is formed in an area above the source and drain regions of a thin film transistor in the first interlayer insulating film. A wiring layer is formed on the first interlayer insulating film, extends to an inner wall and a bottom surface of the contact hole. On a top surface of the wiring layer is formed a recess reflecting the shape of a contact hole. A second interlayer insulating film is formed on the wiring layer, embedded in the recess and has a flat top surface in an area above the thin film transistor. A storage capacitor on the second interlayer insulating film is disposed in the area above the thin film transistor.
摘要:
A semiconductor device is provided which is capable of suppressing decreased yields and increased costs, maintaining excellent optical characteristics, reducing secular changes in characteristics to ensure high erliability. After implanting a dopant into a polycrystalline silicon film and activating the implanted dopant and forming a source region, drain region, and channel region, a substrate is exposed to hydrogen gas plasma with a substrate temperature kept within a range between 350° C. and 420° C. and with treating time of 3 minutes to 60 minutes taken. This exposure suppresses a content of occluded water contained in silicon dioxide making up a primary protecting film, which prevents the diffusion of water being an impurity at operational temperatures of a thin film transistor and adverse characteristics on operational characteristics.
摘要:
A method for cleaning a hole in a layered structure having a planarized transparent organic surface comprises the step of exposing said hole to sputtered particles or plasma particles in the presence of a transparent protection layer which covers said planarized transparent organic surface, except within said hole, for protecting said planarized transparent organic surface from said particles.
摘要:
It is the object of the invention to provide a semiconductor acceleration sensor, in which the characteristic is stable, even if minute spherical particle intrudes into the clearance of the sensor, and a yielding rate and a reliability are remarkably improved. The upper and lower surfaces of a sensor chip, which is composed of a weight portion and beams supporting it, are put between the upper and lower stopper substrates. The surfaces of the upper and lower substrates, which face the sensor chip, have engraved areas thereon, and are stuck to the aforementioned sensor chip via adhesive portions. The adhesive portion is filled with a mixture of adhesive agent and minute spherical hard plastics particle with a equal diameter. The width clearance between sensor chip and stopper substrate is determined by the diameter of the minute spherical particle made of hard plastics.
摘要:
A pixel circuit substrate includes a first interlayer insulating film which is made of an inorganic material at least in a source and drain regions of a thin film transistor. A contact hole is formed in an area above the source and drain regions of a thin film transistor in the first interlayer insulating film. A wiring layer is formed on the first interlayer insulating film, extends to an inner wall and a bottom surface of the contact hole. On a top surface of the wiring layer is formed a recess reflecting the shape of a contact hole. A second interlayer insulating film is formed on the wiring layer, embedded in the recess and has a flat top surface in an area above the thin film transistor. A storage capacitor on the second interlayer insulating film is disposed in the area above the thin film transistor.
摘要:
After a polysilicon semiconductor film 5 and a first gate oxide film 6 are formed on a transparent insulating substrate 1, the semiconductor film 5 and the first gate oxide film 6 are patterned into an island shape to form an island part. At this time, an overhang part 8 of a visor shape is formed where side end surfaces of the first gate oxide film 6 and the semiconductor film 5 are not aligned and an end part of the first gate oxide film 6 projects slightly from a position of a side end surface of the semiconductor film 5. The overhang part 8 is removed, for example, during cleaning, which thus enhances yield.
摘要:
Piled-up films composed of different materials or composed of the same material manufactured by different methods or different conditions are used as an insulating layer for a field-emission cold cathode. The insulating layer may have a composition which is varied continuously in the thickness direction. A cross-section of the insulating layer may be made uneven. Preferably, a triple junction in which a substrate, the insulating layer, and a vacuum are in contact with one another, is disposed at a position which can not be seen from outside the device.
摘要:
An image forming apparatus includes: a functional element substrate to which a pixel is formed in a predetermined cycle; an opposed substrate formed on the functional element substrate; and an optical device arranged on the opposed substrate, which includes a transparent layer and an optical absorption layer arranged in a cycle of 1/n (n is an integer number) of the cycle of arranging the pixel, and restricts spread of transmitted light.