摘要:
A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.
摘要:
In this field emission cold cathode apparatus, the heater shares at least one terminal with the other components, namely, the emitter electrode, the gate electrode, the focus electrode. With this structure, gases absorbed into a surface of the emitters can be released out from the emitters, by heating emitters with the heater. In addition, this apparatus can avoid the increase in the number of the terminal compared with the conventional apparatus having a heater.
摘要:
A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.
摘要:
A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.
摘要:
An image display device incorporating a quick-action electron source is disclosed. After the power source of the device is turned on, drive signals are outputted from an RGB output circuit to each of the RGB electron sources after it is detected that sufficient deflection current is flowing from horizontal/vertical deflection circuit to the deflection yoke to enable the electron beam to adequately scan the screen.
摘要:
In a field-emission cold cathode forming an emitter by the vacuum deposition method, contamination at the side surface of the insulating layer due to deposition of an emitter material during formation of the emitter is prevented. Thereby, deterioration of insulating resistance and dielectric strength between gate and emitter can also be prevented. With an oblique vacuum deposition, a sacrificing layer 5 is formed onto the entire area of the side surface within the cavity 4, an emitter is then vacuum deposited, and thereafter emitter material particles are removed together with the protecting film.
摘要:
A method for forming a pattern of a stacked film, includes steps (a) to (e). The step (a) is forming sequentially a first base insulating film and a light shielding material on a transparent substrate. The step (b) is patterning the light shielding material to obtain a light shielding film with a first pattern. The step (c) is forming sequentially a second base insulating film, a semiconductor film and a first oxide film on a substrate. The step (d) is forming a resist pattern with a second pattern on the first oxide film. The step (e) is forming a pattern of a stacked film by dry etching the first oxide film and the semiconductor film, above the light shielding film. The stacked film includes the semiconductor film and the first oxide film. The dry etching includes an etching by using an etching gas and the resist pattern as a mask. The semiconductor film includes a taper angle which is controlled to be within predetermined range.
摘要:
A Wehnelt electrode and a cold cathode are pressed against and fixed to each other under spring force with a ceramic plate interposed therebetween. Metallized layers connected to a gate electrode and a focusing electrode are disposed on surfaces of the ceramic plate. The gate electrode and the focusing electrode are connected to external power supplies via the metallized layers as feeder path structures. With this arrangement, an electron gun for an electron tube with a cold cathode can be designed with increased degree of freedom, reduced in size, can easily be assembled at the time of manufacture, has high dimensional accuracy, provides high dielectric strength between gate and Wehnelt electrodes, and is highly resistant to vibrations.
摘要:
Piled-up films composed of different materials or composed of the same material manufactured by different methods or different conditions are used as an insulating layer for a field-emission cold cathode. The insulating layer may have a composition which is varied continuously in the thickness direction. A cross-section of the insulating layer may be made uneven. Preferably, a triple junction in which a substrate, the insulating layer, and a vacuum are in contact with one another, is disposed at a position which can not be seen from outside the device.
摘要:
Recognizing the phenomenon that the film thickness of a semiconductor layer causes shift in the OFF-leak current characteristic that corresponds to back-gate voltage of a thin-film transistor, the average film thickness of a semiconductor layer is prescribed such that the shift of the OFF-leak current characteristic is reduced. Alternatively, the film thickness distribution (the ratio of the occurrence of each region having different film thickness) in the direction of the channel width of the semiconductor layer is prescribed.