Abstract:
Provided is a semiconductor memory device including a plurality of memory cells that are connected to a word line and read data, a plurality of bit line pairs that are connected respectively to the plurality of memory cells, a column selector that selects one of the plurality of bit line pairs according to a column selection signal, a sense amplifier circuit that has an input terminal pair connected to the column selector and is activated according to a sense amplifier activation signal, an offset voltage adjustment circuit that is connected to the sense amplifier circuit and adjusts an offset voltage of the sense amplifier circuit according to the weight control signal, and a weight control circuit that is connected to an output terminal pair of the sense amplifier circuit and outputs a weight control signal with a value corresponding to an output of the activated sense amplifier circuit.
Abstract:
An object of the present invention is to provide a plastic ampule capable of suppressing volatilization and scattering of a drug solution and elution of plastic compounding ingredients into the drug solution, as well as suppressing whisker formation and deformation and damage of an opening when the plastic ampule is opened. A plastic ampule 10 according to the present invention includes a drug solution storage part 11 for storing a drug solution, a drug solution discharge tube 12 in communication with the drug solution storage part 11 and extending toward one side, and a top part 13 closing an end at the one side of the drug solution discharge tube 12, and the drug solution discharge tube 12 includes a fragile part 14 formed to have a thin thickness along a circumferential direction. The drug solution storage part 11, the drug solution discharge tube 12, and the top part 13 are formed of a multilayer plastic material that includes an intermediate layer containing a cyclic olefin-based (co)polymer with a glass transition temperature of 60 to 80° C., an inner layer laminated to an inner side of the intermediate layer, an outer layer laminated to an outer side of the intermediate layer, and adhesive layers respectively disposed between the intermediate layer and the inner layer and between the outer layer and the intermediate layer.
Abstract:
A semiconductor device is provided with an SRAM cell unit. The SRAM cell unit is provided with a data storing section composed of a pair of drive transistors and a pair of load transistors; a data write section composed of a pair of access transistors; and a data read section composed of an access transistor and a drive transistor. Each of the transistors is provided with a semiconductor layer protruding from a base plane; a gate electrode extending on the both facing side planes over the semiconductor layer from above; a gate insulating film between a gate electrode and a semiconductor layer; and a source/drain region. Each semiconductor layer is arranged to have its longitudinal direction along a first direction. In the adjacent SRAM cell units in the first direction, all the corresponding transistors have the semiconductor layer of one transistor on a center line which is along the first direction of the semiconductor layer of the other transistor.
Abstract:
In a reading operation, an off time and a reading time of a holding control transistor is controlled by a replica circuit, so that a read margin is enlarged. Furthermore, a high power source potential and a low power source potential of an SRAM memory cell are switched in reading and writing operations of the memory cell and in a data holding state by a power source potential switching portion. As a result, a write margin is enlarged, and a leakage current is reduced.
Abstract:
Disclosed is a logic circuit includes a first NAND gate that receives a first pulse signal and a first selection signal, a first inverter gate that inverts an output signal of the first NAND gate to output a resulting signal, a second NAND gate that receives a second pulse signal and the first selection signal, a second inverter gate that inverts an output signal of the second NAND gate, a first PMOS transistor with a drain terminal connected to an output of the first NAND gate, a gate terminal connected to an output of the second NAND gate and a source terminal connected to a power supply voltage, and a first NMOS transistor with a drain terminal connected to an output of the first inverter gate, a gate terminal connected to an output of the second inverter gate and a source terminal connected to a ground potential.
Abstract:
A semiconductor integrated circuit device includes: a switching current observer for observing a switching current; a leakage current observer for observing a leakage current; a comparator which compares the switching current and the leakage current with each other; a threshold voltage controller for controlling a substrate bias voltage in order to make a ratio of the switching current and the leakage current constant; a delay observer for observing a delay amount; and a power supply voltage controller for controlling a power supply voltage in order to keep the delay amount in a predetermined range. In the semiconductor integrated circuit device, a process which enables the minimization of an operation power is carried out by controlling the threshold voltage to make the ratio of the switching current and the leakage current constant at a given clock frequency and controlling the power supply voltage to guarantee the operating speed.
Abstract:
This invention provides a propofol-containing fat emulsion preparation including: 0.1 to 2 w/v % of propofol, 10 to 20 w/v % of an oily component, and 2 to 5 w/v % of an emulsifier, the weight of the oily component being in the range of about 5 to about 200 times the weight of propofol, the weight of the emulsifier being in the range of about 0.9 to about 50 times that of propofol, and the average size of emulsion particles being 180 nm or less, and a method for preparing the same. Propofol-containing fat emulsion preparation of this invention alleviates the vascular pain that occurs during the administration thereof without incorporating a local anesthetic, such as lidocaine or the like, therein.
Abstract:
A π gate FinFET structure having reduced variations in off-current and parasitic capacitance and a method for production thereof are provided. The structure of an element is improved so that an off-current suppressing capability can be exhibited more strongly. A field effect transistor, wherein a first insulating film and a semiconductor region are provided so as to protrude upward with respect to the flat surface of a base, the field effect transistor has a gate electrode, a gate insulating film and a source/drain region, and a channel is formed at least on the side surface of the semiconductor region, wherein that the first insulating film is provided on an etch stopper layer composed of a material having an etching rate lower than at least the lowermost layer of the first insulating film for etching under a predetermined condition.
Abstract:
In a communication system, a first communication apparatus includes: an application data generating unit for generating application data including data at an application level and a priority at the application level; and a lower-level packet generating unit disposed therein for generating a packet by adding to the application data a header including a destination address and a source address at a level lower than the application level. A first relay apparatus includes: a priority identifying unit disposed therein for determining whether or not a priority is set in the application data of the packet received by the first relay apparatus, and thereby identifying a first priority at the application level; and a priority control unit disposed therein for renewing a TOS field value in the header of the packet, the header being at the level lower than the application level, on the basis of the first priority.
Abstract:
There is provided a semiconductor device comprising an n-type and a p-type field effect transistors, meeting the conditions that in terms of a crystal orientation of the protruding semiconductor region constituting the n-type field effect transistor, its plane parallel to the substrate is substantially a {100} plane and its side surface is a {100} plane substantially orthogonal to the {100} plane, and that in terms of a crystal orientation of the protruding semiconductor region constituting the p-type field effect transistor, its plane parallel to the substrate is substantially a {100} plane and its side surface is a {110} plane substantially orthogonal to the {100} plane.