摘要:
A method for manufacturing a semiconductor device, including: forming a barrier seed Ti layer covering a recess in an insulating film; forming a first barrier TiN layer by sputtering; forming a second barrier TiN layer by sputtering with a substrate bias power higher than that in forming the first barrier TiN layer; forming a first wiring seed Ti layer by sputtering; forming a second wiring seed Ti layer by sputtering with a substrate bias power higher than that in forming the first wiring seed Ti layer; forming a first wiring seed Al layer by sputtering; forming a second wiring seed Al layer by sputtering with a substrate bias power higher than that in forming the first wiring seed Al layer; forming Ti—Al alloy in the recess by a heating; and forming an Al wiring material layer so as to fill the recess therewith by sputtering and heating.
摘要:
The present invention relates to a semiconductor device including a Fin type field effect transistor (FET) having a protrusive semiconductor layer protruding from a substrate plane, a gate electrode formed so as to straddle the protrusive semiconductor layer, a gate insulating film between the gate electrode and the protrusive semiconductor layer, and source and drain regions provided in the protrusive semiconductor layer, wherein the semiconductor device has on a semiconductor substrate an element forming region having a Fin type FET, a trench provided on the semiconductor substrate for separating the element forming region from another element forming region, and an element isolation insulating film in the trench; the element forming region has a shallow substrate flat surface formed by digging to a depth shallower than the bottom surface of the trench and deeper than the upper surface of the semiconductor substrate, a semiconductor raised portion protruding from the substrate flat surface and formed of a part of the semiconductor substrate, and an insulating film on the shallow substrate flat surface; and the protrusive semiconductor layer of the Fin type FET is formed of a portion protruding from the insulating film of the semiconductor raised portion.
摘要:
A constant distance can be maintained between source/drain regions without providing a gate side wall by forming a gate electrode comprising an eaves structure, and a uniform dopant concentration is kept within a semiconductor by ion implantation. As a result, a FinFET excellent in element properties and operation properties can be obtained. A field effect transistor, wherein a gate structure body is a protrusion that protrudes toward source and drain regions sides in a channel length direction and has a channel length direction width larger than that of the part adjacent to the insulating film in a gate electrode, and the protrusion comprises an eaves structure formed by the protrusion that extends in a gate electrode extending direction on the top surface of the semiconductor layer.
摘要:
A manufacturing method for variable shape mirrors suitable for mass production includes steps: for overlaying a pair of jigs having protruding bar portions like comb teeth on a support substrate so that the protruding bar portions are orthogonal to each other, and inserting support pillars and piezoelectric elements into through hole portions that are formed by gaps between the protruding bar portions, and placing a mirror substrate on the support pillars and the piezoelectric elements; for bonding at least the support substrate and the support pillars, the support substrate and the piezoelectric elements, and the mirror substrate and the support pillars to each other, respectively; for drawing out the jig in the direction opposite to a protruding direction of the protruding bar portion; and for forming a reflection film on an outer surface of the mirror substrate.
摘要:
In a variable shape mirror including a base substrate; a mirror with a mirror surface; a fixed part, arranged on the base substrate, for fixing the mirror and the base substrate; and an actuator using a piezoelectric ceramics arranged between the base substrate and the mirror; an initial voltage of the actuator is a negative voltage. The initial voltage differs for each actuator; and is larger than or equal to a voltage at which a displacement of the actuator becomes minimum and smaller than zero voltage. The negative initial voltage is a bias voltage, and a voltage stroke is performed while applying the bias voltage.
摘要:
In a variable-shape mirror of which the shape of the mirror surface can be varied, a mirror portion is bonded only to a fixed portion and not to a piezoelectric element. When the piezoelectric element is not operating, the mirror portion, receiving a predetermined force from the piezoelectric element, makes contact with the piezoelectric element. When the piezoelectric element contracts, the mirror portion tends to restore its original shape by its counterforce. Thus, even when the piezoelectric element contracts, the contact between the mirror portion and the piezoelectric element is held, and hence the electric conduction to the piezoelectric element is maintained.
摘要:
Contents are distributed on the basis of information of a hobby and an address of the user and the like. The distribution of the contents is controlled also on the basis of a result of comparison of a reception intensity regarding contents of 3 or more levels set on the user side and a distribution intensity set as attributes into the contents on a distributing side.
摘要:
A method of manufacturing a semiconductor device is achieved by forming an interlayer insulating film on a conductive portion formed in a semiconductor substrate which is placed in a chamber. A contact hole is formed to pass through the interlayer insulating film to the conductive portion, and a barrier metal layer is formed to cover a bottom portion of side wall portion of the contact hole. A tungsten layer is formed from a material gas containing fluorine and the fluorine is removed from the tungsten layer through a post purge process. The tungsten layer is formed to fill the contact hole in which the barrier metal layer has been formed.
摘要:
A manufacturing method for variable shape mirrors, which is suitable for mass production, includes a bonding step for sandwiching support pillars and piezoelectric elements between a support substrate and a mirror substrate, and bonding at least the support substrate and the support pillar to each other, the support substrate and the piezoelectric element to each other, and the mirror substrate and the support pillars to each other, respectively, and an elastic film forming step for forming a flat elastic film on the outer surface of the mirror substrate, and a reflection film forming step for forming a reflection film on the elastic film.
摘要:
A variable shape mirror includes a support substrate, a mirror substrate that is opposed to the support substrate, a fixing member that is disposed on the support substrate and fixes the mirror substrate, and a piezoelectric element that is disposed on the support substrate and is expanded or contracted so as to deform a reflection plane of the mirror substrate. A bonding layer for bonding the mirror substrate and the fixing member to each other is provided to the surface of the mirror substrate opposite to the surface on which the reflection plane is formed, and the bonding layer is formed in an area that corresponds to the outside of an incident area of a light beam that enters the reflection plane.