摘要:
A silicon nitride sintered material includes a polycrystal material having silicon nitride crystal grains and a grain boundary phase. The sintered material contains a Yb element in an amount of 2 to 30% by weight in terms of its oxide and an Al element in an amount of 1 to 20% by weight in terms of its oxide and has a thermal conductivity of 40 W/mK or less at room temperature, a resistivity of 1×105to 1×1012 &OHgr;·cm at room temperature, and a porosity of 0.5% or less.
摘要:
A base member made of a metal in which aluminum is included, ceramics in which an aluminum element is included, or a composition member constructed by a metal in which aluminum and ceramics are included, is provided in a container in which a solid fluorine compound such as NaHF2 is filled. Then, the container is heated at a temperature higher than a decomposition temperature of the solid fluorine compound. After that, the base member is subjected to a heat treatment with the decomposed gas of the solid fluorine compound to form a fluoride layer on a surface of the base member. In this manner, it is possible to obtain an anti-corrosion member which shows a high corrosion property with respect to the corrosion gas of halogen series and its plasma, particularly with respect to chlorine gas and its plasma.
摘要:
A semiconductor device as a nonvolatile memory comprises dot elements which are formed out of the semiconductor or conductor fine particles and function as a floating gate. The dot elements are asymmetrically formed to a control gate and may be formed in a sidewall insulating film formed over the side face of the control gate or a select gate. When inclined or stepped portions having level differences are formed in a semiconductor substrate, the dot elements are formed on a specified portion of the inclined or stepped portions.
摘要:
A heater comprising a substrate having a heating surface to treat a substance to be heated on the substrate, a heating element embedded in the substrate, and a resistance control part, wherein the substrate comprises a first ceramic material and the resistance control part comprises a second ceramic material which has higher volume resistivity than that of the first ceramics.
摘要:
A semiconductor-supporting device comprising a substrate made of an aluminum nitride-based ceramic material and having a semiconductor-placing surface, wherein an orientation degree of the aluminum nitride-based ceramic material specified by the following formula is not less than 1.1 and not more than 2.0.Orientation degree=[I'(002)/I'(100)]/[I(002)/I(100)]in which in an X-ray diffraction measurement, I'(002) is a diffraction intensity of a (002) face of the aluminum nitride-based ceramic material when X-rays are irradiated from the semiconductor-placing surface, I'(100) is a diffraction intensity of a (100) face of the aluminum nitride-based ceramic material when X-rays are irradiated from the semiconductor-placing surface, I(002) is a diffraction intensity of the (002) face of the aluminum nitride ceramic according to a JCPDS Card No. 25-1133, and I(100) is a diffraction intensity of the (100) face of the aluminum nitride ceramic according to a JCPDS Card No. 25-1133.
摘要:
This invention provides an aluminum nitride based composite body comprising aluminum nitride crystal grains and .gamma.-alumina type crystals in which the aluminum nitride crystal grains has a specified oxygen content as measured by means of an X-ray microanalyzer and a specified spin amount per unit mg of aluminum obtained from a spectrum measured by an electron spin resonance method as well as a method of producing the same.
摘要:
A silicon island portion is formed in a quantum wire so as to be sandwiched between a pair of tunnel barrier portions of a silicon oxide film. On one side of the silicon island portion, a gate electrode for potential control is disposed with a gate insulating film of a silicon oxide film interposed therebetween. On the other side of the silicon island portion, a control electrode for potential control is disposed with an insulating film of a silicon oxide film interposed therebetween. Each of the tunnel barrier portions has a quantum wire constriction structure, which is formed by oxidizing a quantum wire, i.e., a silicon oxide film formed as a field enhanced oxide film with an atomic force microscope or the like, from its surface to a substantially center portion in its section.
摘要:
Two diffraction gratings having the same grate pitch are respectively attached to a semiconductor wafer and a mask to be used in lithography in production of a semiconductor, such that the diffraction gratings are parallel to each other. When first and second frequency lights respectively having different frequencies, are incident, through a light path adjusting system, upon the mask- and wafer-side diffraction gratings in the directions of the first order diffraction angles symmetric with respect to normal-line directions of the diffraction gratings, the frequency lights first orderly diffracted by the diffraction gratings, interfere with each other, thus forming mask- and wafer-side interference lights. An initial phase difference .DELTA..phi.0 between the interference lights, is detected. Then, the light path adjusting system is adjusted to shift the interference lights by the same angle .theta.1 in the same direction, and a later phase difference .DELTA..phi.1 between the interference lights thus shifted, is detected. Based on the relation of .DELTA..phi.1-.DELTA..phi.0=(2.pi.Gtan .theta.1)/(P/2), a mask-wafer gap G is detected with high precision according to the change in phase difference (.DELTA..phi. 1-.DELTA..phi.0). This improves the precision of setting the gap G in a semiconductor production.
摘要:
An X-ray transmission film 2 of a SiN film is formed on the surface of a mask base 1. Formed on the surface of the X-ray transmission film 2 are an LSI pattern 3, and an alignment mark 4 composed of a convex portion 4a and a concave portion 4b. On the surface of the convex portion 4a is an alignment light reflection grating pattern 5 of a tungsten film. Formed on the surface of the concave portion 4b is a metal film 7 of a tungsten film.With this arrangement, a laser light beam 13 does not reach a semiconductor substrate 30 through the alignment mark 4. Thus, when detecting a first-order reflection diffracted light beam 14 from the alignment mark 4 by means of a photodetector, there is no inclusion of unwanted reflected light beams from the semiconductor substrate 30.